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Micromachines 2017, 8(3), 77;

Design and Fabrication of a Slanted-Beam MEMS Accelerometer

Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, Sichuan, China
Author to whom correspondence should be addressed.
Academic Editor: Ha Duong Ngo
Received: 17 January 2017 / Revised: 20 February 2017 / Accepted: 28 February 2017 / Published: 7 March 2017
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This paper presents a novel capacitive microelectromechanical systems (MEMS) accelerometer with slanted supporting beams and all-silicon sandwich structure. Its sensing mechanism is quite similar to an ordinary sandwich-type MEMS accelerometer, except that its proof mass is suspended by a beam parallel to the {111} plane of a (100) silicon wafer. In this way, each sensing element can detect accelerations in two orthogonal directions. Four of these sensing elements could work together and constitute a 3-axis micro-accelerometer by using a simple planar assembly process. This design avoids the traditional 3-axis accelerometer’ disadvantage of possible placement inaccuracy when assembling on three different planes and largely reduces the package volume. The slanted-beam accelerometer’s performance was modeled and analyzed by using both analytical calculations and finite element method (FEM) simulations. A prototype of one sensing element was fabricated and tested. Measured results show that this accelerometer has a good bias stability 76.8 ppm (1σ, tested immediately after power on), two directional sensitivities (sensitivity angle α = 45.4°) and low nonlinearity (<0.5%) over a sensing range up to ±50 g, which demonstrates a great opportunity for future high-precision three-axis inertial measurement. View Full-Text
Keywords: MEMS; accelerometer; slanted beam; all-silicon; sandwich structure MEMS; accelerometer; slanted beam; all-silicon; sandwich structure

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Xu, W.; Yang, J.; Xie, G.; Wang, B.; Qu, M.; Wang, X.; Liu, X.; Tang, B. Design and Fabrication of a Slanted-Beam MEMS Accelerometer. Micromachines 2017, 8, 77.

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