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Micromachines
Volume 16
Issue 8
10.3390/mi16080907
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Article

Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting

by
Dongqiao Bai
1,
Jin Huang
1,*,
Hongxiao Gong
1,*,
Jianjun Wang
1,
Yunna Pu
1,
Jiaying Zhang
1,
Peng Sun
1,
Zihan Zhu
1,
Pan Li
1,
Huagui Wang
1,
Pengbing Zhao
1 and
Chaoyu Liang
2
1
State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China
2
School of Construction Machinery, Chang’an University, Xi’an, 710064, China
*
Authors to whom correspondence should be addressed.
Micromachines 2025, 16(8), 907; https://doi.org/10.3390/mi16080907 (registering DOI)
Submission received: 15 July 2025 / Revised: 31 July 2025 / Accepted: 1 August 2025 / Published: 2 August 2025
Versions Notes

Abstract

Electrohydrodynamic (EHD) printing offers mask-free, high-resolution deposition across a broad range of ink viscosities, yet combining void-free filling of high-aspect-ratio through-glass vias (TGVs) with ultrafine drop-on-demand (DOD) line printing on the same platform requires balancing conflicting requirements: for example, high field strengths to drive ink into deep and narrow vias; sufficiently high ink viscosity to prevent gravity-induced leakage; and stable meniscus dynamics to avoid satellite droplets and charge accumulation on the glass surface. By coupling electrostatic field analysis with transient level-set simulations, we establish a dimensionless regime map that delineates stable cone-jetting regime; these predictions are validated by high-speed imaging and surface profilometry. Operating within this window, the platform achieves complete, void-free filling of 200 µm × 1.52 mm TGVs and continuous 10 µm-wide traces in a single print pass. Demonstrating its capabilities, we fabricate transparent Ku-band substrate-integrated waveguide antennas on borosilicate glass: the printed vias and arc feed elements exhibit a reflection coefficient minimum of –18 dB at 14.2 GHz, a –10 dB bandwidth of 12.8–16.2 GHz, and an 8 dBi peak gain with 37° beam tilt, closely matching full-wave predictions. This physics-driven, all-in-one EHD approach provides a scalable route to high-performance, glass-integrated RF devices and transparent electronics.
Keywords: electrohydrodynamic (EHD) printing; through-glass via (TGV) filling; glass-integrated RF antenna electrohydrodynamic (EHD) printing; through-glass via (TGV) filling; glass-integrated RF antenna

Share and Cite

MDPI and ACS Style

Bai, D.; Huang, J.; Gong, H.; Wang, J.; Pu, Y.; Zhang, J.; Sun, P.; Zhu, Z.; Li, P.; Wang, H.; et al. Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting. Micromachines 2025, 16, 907. https://doi.org/10.3390/mi16080907

AMA Style

Bai D, Huang J, Gong H, Wang J, Pu Y, Zhang J, Sun P, Zhu Z, Li P, Wang H, et al. Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting. Micromachines. 2025; 16(8):907. https://doi.org/10.3390/mi16080907

Chicago/Turabian Style

Bai, Dongqiao, Jin Huang, Hongxiao Gong, Jianjun Wang, Yunna Pu, Jiaying Zhang, Peng Sun, Zihan Zhu, Pan Li, Huagui Wang, and et al. 2025. "Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting" Micromachines 16, no. 8: 907. https://doi.org/10.3390/mi16080907

APA Style

Bai, D., Huang, J., Gong, H., Wang, J., Pu, Y., Zhang, J., Sun, P., Zhu, Z., Li, P., Wang, H., Zhao, P., & Liang, C. (2025). Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting. Micromachines, 16(8), 907. https://doi.org/10.3390/mi16080907

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