Order Article Reprints

Bai D, Huang J, Gong H, Wang J, Pu Y, Zhang J, Sun P, Zhu Z, Li P, Wang H, et al. Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting. Micromachines. 2025; 16(8):907. https://doi.org/10.3390/mi16080907

Bai, Dongqiao, Jin Huang, Hongxiao Gong, Jianjun Wang, Yunna Pu, Jiaying Zhang, Peng Sun, Zihan Zhu, Pan Li, Huagui Wang, and et al. 2025. "Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting" Micromachines 16, no. 8: 907. https://doi.org/10.3390/mi16080907

Bai, D., Huang, J., Gong, H., Wang, J., Pu, Y., Zhang, J., Sun, P., Zhu, Z., Li, P., Wang, H., Zhao, P., & Liang, C. (2025). Integrated Additive Manufacturing of TGV Interconnects and High-Frequency Circuits via Bipolar-Controlled EHD Jetting. Micromachines, 16(8), 907. https://doi.org/10.3390/mi16080907