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Micromachines
Volume 13
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10.3390/mi13010114
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Review

A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System

by
Dongdong Chen
,
Xinhui Cui
,
Qidong Zhang
,
Di Li
*,
Wenyang Cheng
*,
Chunlong Fei
and
Yintang Yang
School of Microelectronics, Xidian University, Xi’an 710071, China
*
Authors to whom correspondence should be addressed.
Micromachines 2022, 13(1), 114; https://doi.org/10.3390/mi13010114
Submission received: 20 December 2021 / Revised: 31 December 2021 / Accepted: 5 January 2022 / Published: 11 January 2022
(This article belongs to the Special Issue Low-Power Circuits for Internet-of-Things)
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Abstract

As traditional ultrasonic imaging systems (UIS) are expensive, bulky, and power-consuming, miniaturized and portable UIS have been developed and widely utilized in the biomedical field. The performance of integrated circuits (ICs) in portable UIS obviously affects the effectiveness and quality of ultrasonic imaging. In the ICs for UIS, the analog-to-digital converter (ADC) is used to complete the conversion of the analog echo signal received by the analog front end into digital for further processing by a digital signal processing (DSP) or microcontroller unit (MCU). The accuracy and speed of the ADC determine the precision and efficiency of UIS. Therefore, it is necessary to systematically review and summarize the characteristics of different types of ADCs for UIS, which can provide valuable guidance to design and fabricate high-performance ADC for miniaturized high resolution UIS. In this paper, the architecture and performance of ADC for UIS, including successive approximation register (SAR) ADC, sigma-delta (Σ-∆) ADC, pipelined ADC, and hybrid ADC, have been systematically introduced. In addition, comparisons and discussions of different types of ADCs are presented. Finally, this paper is summarized, and presents the challenges and prospects of ADC ICs for miniaturized high resolution UIS.
Keywords: analog-to-digital converter; ultrasonic imaging; miniaturized system; integrated circuit analog-to-digital converter; ultrasonic imaging; miniaturized system; integrated circuit

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MDPI and ACS Style

Chen, D.; Cui, X.; Zhang, Q.; Li, D.; Cheng, W.; Fei, C.; Yang, Y. A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System. Micromachines 2022, 13, 114. https://doi.org/10.3390/mi13010114

AMA Style

Chen D, Cui X, Zhang Q, Li D, Cheng W, Fei C, Yang Y. A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System. Micromachines. 2022; 13(1):114. https://doi.org/10.3390/mi13010114

Chicago/Turabian Style

Chen, Dongdong, Xinhui Cui, Qidong Zhang, Di Li, Wenyang Cheng, Chunlong Fei, and Yintang Yang. 2022. "A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System" Micromachines 13, no. 1: 114. https://doi.org/10.3390/mi13010114

APA Style

Chen, D., Cui, X., Zhang, Q., Li, D., Cheng, W., Fei, C., & Yang, Y. (2022). A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System. Micromachines, 13(1), 114. https://doi.org/10.3390/mi13010114

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