Binderless Thermal Insulation Boards from Rapeseed Straw: Optimization and Performance Analysis
Abstract
1. Introduction
2. Materials and Methods
2.1. Fiber Preparation and Board Manufacturing
2.2. Fiber Length Analysis
2.3. Thermal Analysis
2.4. Microstructure
2.5. Basis Physical Properties
2.6. Water Vapor Diffusion Properties
2.7. Sorption Isotherms
2.8. Thermal Properties
3. Results and Discussion
3.1. Fiber Length Analysis
3.2. Thermal Analysis
3.3. Microstructure
3.4. Basic Physical Properties
3.5. Water Vapor Diffusion Properties
3.6. Sorption Isotherms
3.7. Thermal Properties
4. Conclusions
- Optimal processing temperature: A pressing temperature of 160 °C was sufficient to soften lignin and enable strong fiber bonding without damaging cellulose. At 180 °C, partial fiber degradation occurred.
- Effect of fiber fineness: Boards made from finer fibers and processed at 160 °C exhibited lower bulk density, more uniform lignin distribution, and enhanced vapor permeability, indicating a strong influence of fiber morphology on both physical and hygric behavior.
- Density and thermal performance: The produced boards had bulk densities about 50% lower than conventional softwood fiberboards while maintaining comparable thermal conductivity.
- Hygrothermal behavior: The vapor diffusion resistance factor (2.7–5.3) confirmed a vapor-permeable structure, similar to softwood fiberboards and higher than flax-, hemp-, or cellulose-based insulations.
- Application potential: Binderless rapeseed fiberboards represent a promising bio-based alternative for construction applications requiring moderate insulation performance, vapor permeability, and environmental sustainability, such as roof sheathing, exterior walls, or underfloor insulation.
Supplementary Materials
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Bulk Density [kg/m3] | WA 24 h [kg/kg] | TS 24 h [%] | |
|---|---|---|---|
| Fine—160 °C | 138 ± 8 | 6.17 ± 0.18 | 3.5 ± 0.11 |
| Fine—180 °C | 139 ± 8 | 6.18 ± 0.14 | 3.3 ± 0.10 |
| Medium—160 °C | 135 ± 5 | 6.16 ± 0.17 | 3.4 ± 0.12 |
| Medium—180 °C | 137 ± 6 | 6.17 ± 0.12 | 3.1 ± 0.10 |
| Coarse—160 °C | 133 ± 7 | 6.16 ± 0.12 | 3.4 ± 0.16 |
| Coarse—180 °C | 135 ± 8 | 6.18± 0.11 | 3.2 ± 0.15 |
| Material | Water Vapor Diffusion Coefficient [×10−6 m2s−1] | Water Vapor Diffusion Resistance Factor [-] | ||
|---|---|---|---|---|
| Dry Cup | Wet Cup | Dry Cup | Wet Cup | |
| Fine—160 °C | 3.81 ± 0.36 | 10.4 ± 1.35 | 6.08 ± 0.57 | 2.21 ± 0.11 |
| Fine—180 °C | 3.48 ± 0.57 | 12.4 ± 2.05 | 6.81 ± 1.30 | 1.94 ± 0.38 |
| Medium—160 °C | 3.89 ± 0.32 | 10.1 ± 1.32 | 5.94 ± 0.51 | 2.29 ± 0.13 |
| Medium—180 °C | 3.82 ± 0.10 | 12.5 ± 2.64 | 6.04 ± 0.30 | 1.94 ± 0.53 |
| Coarse—160 °C | 4.28 ± 0.31 | 10.6 ±1.45 | 5.38 ± 0.30 | 2.17 ± 0.17 |
| Coarse—180 °C | 3.94 ± 0.18 | 10.5 ± 1.42 | 5.73 ± 0.47 | 2.19 ± 0.52 |
| Thermal Conductivity [W/m·K] | Specific Heat Capacity [J/(kg·K)] | |
|---|---|---|
| Fine—160 °C | 0.0521 ± 0.004 | 1410 ± 150 |
| Fine—180 °C | 0.0533 ± 0.003 | 1442 ± 171 |
| Medium—160 °C | 0.0517 ± 0.008 | 1443 ± 182 |
| Medium—180 °C | 0.0519 ± 0.002 | 1417 ± 154 |
| Coarse—160 °C | 0.0513 ± 0.002 | 1445 ± 168 |
| Coarse—180 °C | 0.0521 ± 0.002 | 1457 ± 126 |
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Jerman, M.; Böhm, M.; Vrzáň, J.; Krejsová, J.; Kobetičová, K.; Černý, R. Binderless Thermal Insulation Boards from Rapeseed Straw: Optimization and Performance Analysis. Materials 2025, 18, 5481. https://doi.org/10.3390/ma18245481
Jerman M, Böhm M, Vrzáň J, Krejsová J, Kobetičová K, Černý R. Binderless Thermal Insulation Boards from Rapeseed Straw: Optimization and Performance Analysis. Materials. 2025; 18(24):5481. https://doi.org/10.3390/ma18245481
Chicago/Turabian StyleJerman, Miloš, Martin Böhm, Jakub Vrzáň, Jitka Krejsová, Klára Kobetičová, and Robert Černý. 2025. "Binderless Thermal Insulation Boards from Rapeseed Straw: Optimization and Performance Analysis" Materials 18, no. 24: 5481. https://doi.org/10.3390/ma18245481
APA StyleJerman, M., Böhm, M., Vrzáň, J., Krejsová, J., Kobetičová, K., & Černý, R. (2025). Binderless Thermal Insulation Boards from Rapeseed Straw: Optimization and Performance Analysis. Materials, 18(24), 5481. https://doi.org/10.3390/ma18245481

