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Journal: Energies, 2020
Volume: 13
Number: 586
Article:
Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment
Authors:
by
Ziwen Liu, Qian Wang, Vincent J.L. Gan and Luke Peh
Link:
https://www.mdpi.com/1996-1073/13/3/586
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