Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment
Abstract
Share and Cite
Liu, Z.; Wang, Q.; Gan, V.J.L.; Peh, L. Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment. Energies 2020, 13, 586. https://doi.org/10.3390/en13030586
Liu Z, Wang Q, Gan VJL, Peh L. Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment. Energies. 2020; 13(3):586. https://doi.org/10.3390/en13030586
Chicago/Turabian StyleLiu, Ziwen, Qian Wang, Vincent J.L. Gan, and Luke Peh. 2020. "Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment" Energies 13, no. 3: 586. https://doi.org/10.3390/en13030586
APA StyleLiu, Z., Wang, Q., Gan, V. J. L., & Peh, L. (2020). Envelope Thermal Performance Analysis Based on Building Information Model (BIM) Cloud Platform—Proposed Green Mark Collaboration Environment. Energies, 13(3), 586. https://doi.org/10.3390/en13030586
