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Article

Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor †

Institute of Microelectronics, Peking University, Beijing 100871, China
*
Author to whom correspondence should be addressed.
This paper is an extended version of the paper entitled “Modeling of Small-Sized Acoustic Particle Velocity Horn for Mems Thermal Acoustic Particle Velocity Sensor” presented at 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), Virtual Event, 25–29 January 2021.
Sensors 2021, 21(13), 4337; https://doi.org/10.3390/s21134337
Submission received: 2 June 2021 / Revised: 17 June 2021 / Accepted: 23 June 2021 / Published: 24 June 2021
(This article belongs to the Special Issue MEMS and Ultra-Sensitive Sensors)

Abstract

In this paper, small-sized acoustic horns, the sensitivity enhancement package for the MEMS-based thermal acoustic particle velocity sensor, have been designed and optimized. Four kinds of acoustic horns, including tube horn, double cone horn, double paradox horn, and exponential horn, were analyzed through numerical calculation. Considering both the amplification factor and effective length of amplification zone, a small-sized double cone horn with middle tube is designed and further optimized. A three-wire thermal acoustic particle velocity sensor was fabricated and packaged in the 3D printed double cone tube (DCT) horn. Experiment results show that an amplification factor of 6.63 at 600 Hz and 6.93 at 1 kHz was achieved. A good 8-shape directivity pattern was also obtained for the optimized DCT horn with the lateral inhibition ratio of 50.3 dB. No additional noise was introduced, demonstrating the DCT horn’s potential in improving the sensitivity of acoustic particle velocity sensors.
Keywords: small-sized; acoustic horn; thermal acoustic particle velocity sensor; sensitivity enhancement small-sized; acoustic horn; thermal acoustic particle velocity sensor; sensitivity enhancement

Share and Cite

MDPI and ACS Style

Chang, W.; Yang, L.; Zhu, Z.; Yang, Z.; Hao, Y.; Gao, C. Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor. Sensors 2021, 21, 4337. https://doi.org/10.3390/s21134337

AMA Style

Chang W, Yang L, Zhu Z, Yang Z, Hao Y, Gao C. Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor. Sensors. 2021; 21(13):4337. https://doi.org/10.3390/s21134337

Chicago/Turabian Style

Chang, Wenhan, Lingmeng Yang, Zhezheng Zhu, Zhenchuan Yang, Yilong Hao, and Chengchen Gao. 2021. "Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor" Sensors 21, no. 13: 4337. https://doi.org/10.3390/s21134337

APA Style

Chang, W., Yang, L., Zhu, Z., Yang, Z., Hao, Y., & Gao, C. (2021). Design and Optimization of Sensitivity Enhancement Package for MEMS-Based Thermal Acoustic Particle Velocity Sensor. Sensors, 21(13), 4337. https://doi.org/10.3390/s21134337

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