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Search Results (833)

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Keywords = silicon nitride

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15 pages, 3152 KiB  
Article
Advanced Modeling of GaN-on-Silicon Spiral Inductors
by Simone Spataro, Giuseppina Sapone, Marcello Giuffrida and Egidio Ragonese
Electronics 2025, 14(15), 3079; https://doi.org/10.3390/electronics14153079 (registering DOI) - 31 Jul 2025
Viewed by 58
Abstract
In this paper, the accuracy of basic and advanced spiral inductor models for gallium nitride (GaN) integrated inductors is evaluated. Specifically, the experimental measurements of geometrically scaled circular spiral inductors, fabricated in a radio frequency (RF) GaN-on silicon technology, are exploited to estimate [...] Read more.
In this paper, the accuracy of basic and advanced spiral inductor models for gallium nitride (GaN) integrated inductors is evaluated. Specifically, the experimental measurements of geometrically scaled circular spiral inductors, fabricated in a radio frequency (RF) GaN-on silicon technology, are exploited to estimate the errors of two lumped geometrically scalable models, i.e., a simple π-model with seven components and an advanced model with thirteen components. The comparison is performed by using either the standard performance parameters, such as inductance (L), quality factor (Q-factor), and self-resonance frequency (SRF), or the two-port scattering parameters (S-parameters). The comparison reveals that despite a higher complexity, the developed advanced model achieves a significant reduction in SRF percentage errors in a wide range of geometrical parameters, while enabling an accurate estimation of two-port S-parameters. Indeed, the correct evaluation of both SRF and two-port S-parameters is crucial to exploit the model in an actual circuit design environment by properly setting the inductor geometrical parameters to optimize RF performance. Full article
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17 pages, 3191 KiB  
Article
Optimizing Graphene Ring Modulators: A Comparative Study of Straight, Bent, and Racetrack Geometries
by Pawan Kumar Dubey, Ashraful Islam Raju, Rasuole Lukose, Christian Wenger and Mindaugas Lukosius
Nanomaterials 2025, 15(15), 1158; https://doi.org/10.3390/nano15151158 - 27 Jul 2025
Viewed by 291
Abstract
Graphene-based micro-ring modulators are promising candidates for next-generation optical interconnects, offering compact footprints, broadband operation, and CMOS compatibility. However, most demonstrations to date have relied on conventional straight bus coupling geometries, which limit design flexibility and require extremely small coupling gaps to reach [...] Read more.
Graphene-based micro-ring modulators are promising candidates for next-generation optical interconnects, offering compact footprints, broadband operation, and CMOS compatibility. However, most demonstrations to date have relied on conventional straight bus coupling geometries, which limit design flexibility and require extremely small coupling gaps to reach critical coupling. This work presents a comprehensive comparative analysis of straight, bent, and racetrack bus geometries in graphene-on-silicon nitride (Si3N4) micro-ring modulators operating near 1.31 µm. Based on finite-difference time-domain simulation results, a proposed racetrack-based modulator structure demonstrates that extending the coupling region enables critical coupling at larger gaps—up to 300 nm—while preserving high modulation efficiency. With only 6–12% graphene coverage, this geometry achieves extinction ratios of up to 28 dB and supports electrical bandwidths approaching 90 GHz. Findings from this work highlight a new co-design framework for coupling geometry and graphene coverage, offering a pathway to high-speed and high-modulation-depth graphene photonic modulators suitable for scalable integration in next-generation photonic interconnects devices. Full article
(This article belongs to the Special Issue 2D Materials for High-Performance Optoelectronics)
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15 pages, 6406 KiB  
Communication
Design and Static Analysis of MEMS-Actuated Silicon Nitride Waveguide Optical Switch
by Yan Xu, Tsen-Hwang Andrew Lin and Peiguang Yan
Micromachines 2025, 16(8), 854; https://doi.org/10.3390/mi16080854 - 25 Jul 2025
Viewed by 322
Abstract
This article aims to utilize a microelectromechanical system (MEMS) to modulate coupling behavior of silicon nitride (Si3N4) waveguides to perform an optical switch based on a directional coupling (DC) mechanism. There are two states of the switch. First state, [...] Read more.
This article aims to utilize a microelectromechanical system (MEMS) to modulate coupling behavior of silicon nitride (Si3N4) waveguides to perform an optical switch based on a directional coupling (DC) mechanism. There are two states of the switch. First state, a Si3N4 wire is initially positioned up suspended in the air. In the second state, this wire will be moved down to be placed between two arms of the DC waveguides, changing the coupling behavior to achieve bar and cross states of the optical switch function. In the future, the MEMS will be used to move this wire down. In this work, we present simulations of the two static states to optimize the DC structure parameters. Based on the simulated results, the device size is 8.8 μm × 55 μm. The insertion loss is calculated to be approximately 0.24 dB and 0.33 dB, the extinction ratio is approximately 24.70 dB and 25.46 dB, and the crosstalk is approximately −24.60 dB and −25.56 dB, respectively. In the C band of optical communication, the insertion loss ranges from 0.18 dB to 0.47 dB. As such, this device will exhibit excellent optical switch performance and provide advantages in many integrated optics-related optical systems applications. Furthermore, it can be used in optical communications, data centers, LiDAR, and so on, enhancing important reference value for such applications. Full article
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14 pages, 3769 KiB  
Article
Inversely Designed Silicon Nitride Power Splitters with Arbitrary Power Ratios
by Yang Cong, Shuo Liu, Yanfeng Liang, Haoyu Wang, Huanlin Lv, Fangxu Liu, Xuanchen Li and Qingxiao Guo
Photonics 2025, 12(8), 744; https://doi.org/10.3390/photonics12080744 - 24 Jul 2025
Viewed by 203
Abstract
An optical power splitter (OPS) with arbitrary splitting ratios has attracted significant research interest for its broad applications in photonic integrated circuits. A series of OPSs with arbitrary splitting ratios based on silicon nitride (Si3N4) platforms are presented. The [...] Read more.
An optical power splitter (OPS) with arbitrary splitting ratios has attracted significant research interest for its broad applications in photonic integrated circuits. A series of OPSs with arbitrary splitting ratios based on silicon nitride (Si3N4) platforms are presented. The devices are designed with ultra-compact dimensions using three-dimensional finite-difference time-domain (3D FDTD) analysis and an inverse design algorithm. Within a 50 nm bandwidth (1525 nm to 1575 nm), we demonstrated a 1 × 2 OPS with splitting ratios of 1:1, 1:1.5, and 1:2; a 1 × 3 OPS with ratios of 1:2:1 and 2:1:2; and a 1 × 4 OPS with ratios of 1:1:1:1 and 2:1:2:1. The target splitting ratios are achieved by optimizing pixel distributions in the coupling region. The dimensions of the designed devices are 1.96 × 1.96 µm2, 2.8 × 2.8 µm2, and 2.8 × 4.2 µm2, respectively. The designed devices achieve transmission efficiencies exceeding 90% and exhibit excellent power splitting ratios (PSRs). Full article
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24 pages, 6475 KiB  
Review
Short-Circuit Detection and Protection Strategies for GaN E-HEMTs in High-Power Applications: A Review
by Haitz Gezala Rodero, David Garrido Díez, Iosu Aizpuru Larrañaga and Igor Baraia-Etxaburu
Electronics 2025, 14(14), 2875; https://doi.org/10.3390/electronics14142875 - 18 Jul 2025
Viewed by 379
Abstract
Gallium nitride (GaN) enhancement-mode high-electron-mobility transistors ( E-HEMTs) deliver superior performance compared to traditional silicon (Si) and silicon carbide (SiC) counterparts. Their faster switching speeds, lower on-state resistances, and higher operating frequencies enable more efficient and compact power converters. However, their integration into [...] Read more.
Gallium nitride (GaN) enhancement-mode high-electron-mobility transistors ( E-HEMTs) deliver superior performance compared to traditional silicon (Si) and silicon carbide (SiC) counterparts. Their faster switching speeds, lower on-state resistances, and higher operating frequencies enable more efficient and compact power converters. However, their integration into high-power applications is limited by critical reliability concerns, particularly regarding their short-circuit (SC) withstand capability and overvoltage (OV) resilience. GaN devices typically exhibit SC withstand times of only a few hundred nanoseconds, needing ultrafast protection circuits, which conventional desaturation (DESAT) methods cannot adequately provide. Furthermore, their high switching transients increase the risk of false activation events. The lack of avalanche capability and the dynamic nature of GaN breakdown voltage exacerbate issues related to OV stress during fault conditions. Although SC-related behaviour in GaN devices has been previously studied, a focused and comprehensive review of protection strategies tailored to GaN technology remains lacking. This paper fills that gap by providing an in-depth analysis of SC and OV failure phenomena, coupled with a critical evaluation of current and next-generation protection schemes suitable for GaN-based high-power converters. Full article
(This article belongs to the Special Issue Advances in Semiconductor GaN and Applications)
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14 pages, 4871 KiB  
Article
Study on Laser Surface Texturing and Wettability Control of Silicon Nitride Ceramic
by Hong-Jian Wang, Jing-De Huang, Bo Wang, Yang Zhang and Jin Wang
Micromachines 2025, 16(7), 819; https://doi.org/10.3390/mi16070819 - 17 Jul 2025
Viewed by 257
Abstract
Silicon nitride (Si3N4) ceramic is widely used in the production of structural components. The surface wettability is closely related to the service life of materials. Laser surface texturing is considered an effective method for controlling surface wettability by processing [...] Read more.
Silicon nitride (Si3N4) ceramic is widely used in the production of structural components. The surface wettability is closely related to the service life of materials. Laser surface texturing is considered an effective method for controlling surface wettability by processing specific patterns. This research focused on the laser surface texturing of a Si3N4 ceramic, employing rectangular patterns instead of the typical dimple designs, as these had promising applications in heat transfer and hydrodynamic lubrication. The effects of scanning speed and number of scans on the change of the morphologies and dimensions of the grooves were investigated. The results indicated that the higher scanning speed and fewer number of scans resulted in less damage to the textured surface. As the scanning speed increased, the width and depth of the grooves decreased significantly first, and then fluctuated. Conversely, increasing the number of scans led to an increase in the width and depth of the grooves, eventually stabilizing. The analysis of the elemental composition of different areas on the textured surface presented a notable increase in oxygen content at the grooves, while Si and N levels decreased. It was mainly caused by the chemical reaction between Si3N4 ceramic and oxygen during laser surface texturing in an air environment. This study also assessed the wettability of the textured surface, finding that the contact angle of the water droplet was significantly affected by the groove dimensions. After laser surface texturing, the contact angle increased from 35.51 ± 0.33° to 57.52 ± 1.83°. Improved wettability was associated with smaller groove volume, indicating better hydrophilicity at lower scanning speed and enhanced hydrophobicity with a fewer number of scans. Full article
(This article belongs to the Special Issue Advances in Digital Manufacturing and Nano Fabrication)
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14 pages, 2149 KiB  
Article
Gain Characteristics of Hybrid Waveguide Amplifiers in SiN Photonics Integration with Er-Yb:Al2O3 Thin Film
by Ziming Dong, Guoqing Sun, Yuqing Zhao, Yaxin Wang, Lei Ding, Liqin Tang and Yigang Li
Photonics 2025, 12(7), 718; https://doi.org/10.3390/photonics12070718 - 16 Jul 2025
Viewed by 275
Abstract
Integrated optical waveguide amplifiers, with their compact footprint, low power consumption, and scalability, are the basis for optical communications. The realization of high gain in such integrated devices is made more challenging by the tight optical constraints. In this work, we present efficient [...] Read more.
Integrated optical waveguide amplifiers, with their compact footprint, low power consumption, and scalability, are the basis for optical communications. The realization of high gain in such integrated devices is made more challenging by the tight optical constraints. In this work, we present efficient amplification in an erbium–ytterbium-based hybrid slot waveguide consisting of a silicon nitride waveguide and a thin-film active layer/electron-beam resist. The electron-beam resist as the upper cladding layer not only possesses the role of protecting the waveguide but also has tighter optical confinement in the vertical cross-section direction. On this basis, an accurate and comprehensive dynamic model of an erbium–ytterbium co-doped amplifier is realized by introducing quenched ions. A modal gain of above 20 dB is achieved at the signal wavelength of 1530 nm in a 1.4 cm long hybrid slot waveguide, with fractions of quenched ions fq = 30%. In addition, the proposed hybrid waveguide amplifiers exhibit higher modal gain than conventional air-clad amplifiers under the same conditions. Endowing silicon nitride photonic integrated circuits with efficient amplification enriches the integration of various active functionalities on silicon. Full article
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34 pages, 1638 KiB  
Review
Recent Advances in Bidirectional Converters and Regenerative Braking Systems in Electric Vehicles
by Hamid Naseem and Jul-Ki Seok
Actuators 2025, 14(7), 347; https://doi.org/10.3390/act14070347 - 14 Jul 2025
Viewed by 647
Abstract
As electric vehicles (EVs) continue to advance toward widespread adoption, innovations in power electronics are playing a pivotal role in improving efficiency, performance, and sustainability. This review presents recent progress in bidirectional converters and regenerative braking systems (RBSs), highlighting their contributions to energy [...] Read more.
As electric vehicles (EVs) continue to advance toward widespread adoption, innovations in power electronics are playing a pivotal role in improving efficiency, performance, and sustainability. This review presents recent progress in bidirectional converters and regenerative braking systems (RBSs), highlighting their contributions to energy recovery, battery longevity, and vehicle-to-grid integration. Bidirectional converters support two-way energy flow, enabling efficient regenerative braking and advanced charging capabilities. The integration of wide-bandgap semiconductors, such as silicon carbide and gallium nitride, further enhances power density and thermal performance. The paper evaluates various converter topologies, including single-stage and multi-stage architectures, and assesses their suitability for high-voltage EV platforms. Intelligent control strategies, including fuzzy logic, neural networks, and sliding mode control, are discussed for optimizing braking force and maximizing energy recuperation. In addition, the paper explores the influence of regenerative braking on battery degradation and presents hybrid energy storage systems and AI-based methods as mitigation strategies. Special emphasis is placed on the integration of RBSs in advanced electric vehicle platforms, including autonomous systems. The review concludes by identifying current challenges, emerging trends, and key design considerations to inform future research and practical implementation in electric vehicle energy systems. Full article
(This article belongs to the Special Issue Feature Papers in Actuators for Surface Vehicles)
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14 pages, 2247 KiB  
Article
Design and Simulation of Optical Waveguide Digital Adjustable Delay Lines Based on Optical Switches and Archimedean Spiral Structures
by Ting An, Limin Liu, Guizhou Lv, Chunhui Han, Yafeng Meng, Sai Zhu, Yuandong Niu and Yunfeng Jiang
Photonics 2025, 12(7), 679; https://doi.org/10.3390/photonics12070679 - 5 Jul 2025
Viewed by 279
Abstract
In the field of modern optical communication, radar signal processing and optical sensors, true time delay technology, as a key means of signal processing, can achieve the accurate control of the time delay of optical signals. This study presents a novel design that [...] Read more.
In the field of modern optical communication, radar signal processing and optical sensors, true time delay technology, as a key means of signal processing, can achieve the accurate control of the time delay of optical signals. This study presents a novel design that integrates a 2 × 2 Multi-Mode Interference (MMI) structure with a Mach–Zehnder modulator on a silicon nitride–lithium niobate (SiN-LiNbO3) heterogeneous integrated optical platform. This configuration enables the selective interruption of optical wave paths. The upper path passes through an ultralow-loss Archimedes’ spiral waveguide delay line made of silicon nitride, where the five spiral structures provide delays of 10 ps, 20 ps, 40 ps, 80 ps, and 160 ps, respectively. In contrast, the lower path is straight through, without introducing an additional delay. By applying an electrical voltage, the state of the SiN-LiNbO3 switch can be altered, facilitating the switching and reconfiguration of optical paths and ultimately enabling the combination of various delay values. Simulation results demonstrate that the proposed optical true delay line achieves a discrete, adjustable delay ranging from 10 ps to 310 ps with a step size of 10 ps. The delay loss is less than 0.013 dB/ps, the response speed reaches the order of ns, and the 3 dB-EO bandwidth is broader than 67 GHz. In comparison to other optical switches optical true delay lines in terms of the parameters of delay range, minimum adjustable delay, and delay loss, the proposed optical waveguide digital adjustable true delay line, which is based on an optical switch and an Archimedes’ spiral structure, has outstanding advantages in response speed and delay loss. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nano-Optics and Photonics)
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14 pages, 23403 KiB  
Article
Flexibly Reconfigurable Kerr Micro-Comb Based on Cascaded Si3N4 Micro-Ring Filters
by Jieyu Yang, Guang Chen, Lidan Lu, Jianzhen Ou, Chao Mei, Yingjie Xu, Wenbo Bo, Peng Wang, Xinyi Li and Lianqing Zhu
Photonics 2025, 12(7), 661; https://doi.org/10.3390/photonics12070661 - 30 Jun 2025
Viewed by 346
Abstract
In recent years, micro-combs, due to their compact structure and high efficiency, have proven to be a practical solution for optical sources. In this paper, an approach to flexibly modulating micro-combs is proposed, and a simulation platform based on Si3N4 [...] Read more.
In recent years, micro-combs, due to their compact structure and high efficiency, have proven to be a practical solution for optical sources. In this paper, an approach to flexibly modulating micro-combs is proposed, and a simulation platform based on Si3N4 micro-combs with highly integrated, tunable, and reconfigurable features is built. By means of the Lugiato–Lefever equation model, the dynamic evolution process of micro-combs is analyzed, and a micro-ring resonator is designed with a free spectral range of 7.24 nm, an effective mode area of 1.0829µm2, and coherent comb lines spanning over 125 THz. Cascaded silicon nitride micro-ring filters are utilized to obtain reconfigurable modulation effects for Kerr-frequency micro-combs. Due to the significance of flexibly controlled optical sources with high-repetition rates and multiple channels for system-on-chip, our proposal has potential in photonic integrated circuit systems, such as high-density photonic computing and large-capacity optical communications, in the future. Full article
(This article belongs to the Special Issue Photonic Integrated Circuits: Techniques, Insights and Devices)
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16 pages, 3499 KiB  
Article
Physical and Electrical Properties of Silicon Nitride Thin Films with Different Nitrogen–Oxygen Ratios
by Wen-Jie Chen, Yang-Chao Liu, Zhen-Yu Wang, Lin Gu, Yi Shen and Hong-Ping Ma
Nanomaterials 2025, 15(13), 958; https://doi.org/10.3390/nano15130958 - 20 Jun 2025
Viewed by 529
Abstract
Silicon oxynitride (SiOxNy, hereafter denoted as SiON) thin films represent an intermediate phase between silicon dioxide (SiO2) and silicon nitride (Si3N4). Through systematic compositional ratio adjustments, the refractive index can be precisely tuned [...] Read more.
Silicon oxynitride (SiOxNy, hereafter denoted as SiON) thin films represent an intermediate phase between silicon dioxide (SiO2) and silicon nitride (Si3N4). Through systematic compositional ratio adjustments, the refractive index can be precisely tuned across a wide range from 1.45 to 2.3. However, the underlying mechanism governing the influence of elemental composition on film structural quality remains insufficiently understood. To address this knowledge gap, we systematically investigate the effects of key industrial plasma-enhanced chemical vapor deposition (PECVD) parameters—including precursor gas selection and flow rate ratios—on SiON film properties. Our experimental measurements reveal that stoichiometric SiOxNy (x = y) achieves a minimum surface roughness of 0.18 nm. As oxygen content decreases and nitrogen content increases, progressive replacement of Si-O bonds by Si-N bonds correlates with increased structural defect density within the film matrix. Capacitance–voltage (C-V) characterization demonstrates a corresponding enhancement in device capacitance following these compositional modifications. Recent studies confirm that controlled modulation of film stoichiometry enables precise tailoring of dielectric properties and capacitive behavior, as demonstrated in SiON-based power electronics, thereby advancing applications in related fields. Full article
(This article belongs to the Section 2D and Carbon Nanomaterials)
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16 pages, 497 KiB  
Article
Numerical Analysis of a SiN Digital Fourier Transform Spectrometer for a Non-Invasive Skin Cancer Biosensor
by Miguel Ángel Nava Blanco and Gerardo Antonio Castañón Ávila
Sensors 2025, 25(12), 3792; https://doi.org/10.3390/s25123792 - 18 Jun 2025
Viewed by 480
Abstract
Early detection and continuous monitoring of diseases are critical to improving patient outcomes, treatment adherence, and diagnostic accuracy. Traditional melanoma diagnosis relies primarily on visual assessment and biopsy, with reported accuracies ranging from 50% to 90% and significant inter-observer variability. Among emerging diagnostic [...] Read more.
Early detection and continuous monitoring of diseases are critical to improving patient outcomes, treatment adherence, and diagnostic accuracy. Traditional melanoma diagnosis relies primarily on visual assessment and biopsy, with reported accuracies ranging from 50% to 90% and significant inter-observer variability. Among emerging diagnostic technologies, Raman spectroscopy has demonstrated considerable promise for non-invasive disease detection, particularly in early-stage skin cancer identification. A portable, real-time Raman spectroscopy system could significantly enhance diagnostic precision, reduce biopsy reliance, and expedite diagnosis. However, miniaturization of Raman spectrometers for portable use faces significant challenges, including weak signal intensity, fluorescence interference, and inherent trade-offs between spectral resolution and the signal-to-noise ratio. Recent advances in silicon photonics present promising solutions by facilitating efficient light collection, enhancing optical fields via high-index-contrast waveguides, and allowing compact integration of photonic components. This work introduces a numerical analysis of an integrated digital Fourier transform spectrometer implemented on a silicon-nitride (SiN) platform, specifically designed for Raman spectroscopy. The proposed system employs a switch-based digital Fourier transform spectrometer architecture coupled with a single optical power meter for detection. Utilizing a regularized regression method, we successfully reconstructed Raman spectra in the 800 cm−1 to 1800 cm−1 range, covering spectra of both benign and malignant skin lesions. Our results demonstrate the capability of the proposed system to effectively differentiate various skin cancer types, highlighting its feasibility as a non-invasive diagnostic sensor. Full article
(This article belongs to the Section Optical Sensors)
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31 pages, 5464 KiB  
Review
Alumina-Based Cutting Tools—A Review of Recent Progress
by Irena Žmak, Sonja Jozić, Lidija Ćurković and Tomislav Filetin
Materials 2025, 18(12), 2813; https://doi.org/10.3390/ma18122813 - 16 Jun 2025
Viewed by 675
Abstract
Choosing the appropriate cutting tool material is essential for enhancing machining processes because it directly affects product quality, surface finish, dimensional accuracy, tool longevity, and overall efficiency. Different materials are used for cutting tools, i.e., for cutting inserts. Due to their high hardness [...] Read more.
Choosing the appropriate cutting tool material is essential for enhancing machining processes because it directly affects product quality, surface finish, dimensional accuracy, tool longevity, and overall efficiency. Different materials are used for cutting tools, i.e., for cutting inserts. Due to their high hardness and high temperature resistance, ceramics cutting inserts allow for increased cutting speeds, resulting in shorter manufacturing times and reduced costs, despite being pricier than traditional cemented carbide and facing certain technical challenges due to their brittleness. Alumina-based ceramics dominate the market, accounting for about two-thirds of usage, followed by silicon nitride and zirconia. This paper provides a comprehensive overview of recent advances in alumina ceramic materials used as cutting inserts, focusing on research conducted in the last five years to optimize static and dynamic mechanical and thermal properties, wear resistance, density, etc. They ways in which the properties are altered through the incorporation of whiskers, nanoparticles, or nanotubes; the modification of the structure; the optimization of sintering parameters; and the application of advanced sintering techniques are demonstrated. The paper also addresses sustainability, environmental impact, and the management of critical raw materials associated with cutting inserts, which pertains to the future development of cutting insert materials. Full article
(This article belongs to the Special Issue Advanced Materials and Processing Technologies)
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15 pages, 1687 KiB  
Article
Study on Regulation Mechanism of Heat Transport at Aluminum Nitride/Graphene/Silicon Carbide Heterogeneous Interface
by Dongjing Liu, Pengbo Wang, Zhiliang Hu, Jia Fu, Wei Qin, Jianbin Yu, Yangyang Zhang, Bing Yang and Yunqing Tang
Nanomaterials 2025, 15(12), 928; https://doi.org/10.3390/nano15120928 - 14 Jun 2025
Viewed by 435
Abstract
In order to solve the self-heating problem of power electronic devices, this paper adopts a nonequilibrium molecular dynamics approach to study the thermal transport regulation mechanism of the aluminum nitride/graphene/silicon carbide heterogeneous interface. The effects of temperature, size, and vacancy defects on interfacial [...] Read more.
In order to solve the self-heating problem of power electronic devices, this paper adopts a nonequilibrium molecular dynamics approach to study the thermal transport regulation mechanism of the aluminum nitride/graphene/silicon carbide heterogeneous interface. The effects of temperature, size, and vacancy defects on interfacial thermal conductivity are analyzed by phonon state density versus phonon participation rate to reveal their phonon transfer mechanisms during thermal transport. It is shown that the interfacial thermal conductance (ITC) increases about three times when the temperature increases from 300 K to 1100 K. It is analyzed that the increase in temperature will enhance lattice vibration, enhance phonon coupling degree, and thus increase its ITC. With the increase in the number of AlN-SiC layers from 8 to 28, the ITC increases by about 295.3%, and it is analyzed that the increase in the number of AlN-SiC layers effectively reduces the interfacial scattering and improves the phonon interfacial transmission efficiency. The increase in the number of graphene layers from 1 layer to 4 layers decreases the ITC by 70.3%. The interfacial thermal conductivity reaches a minimum, which is attributed to the increase in graphene layers aggravating the degree of phonon localization. Under the influence of the increase in graphene single and double vacancy defects concentration, the ITC is slightly reduced. When the defect rate reaches about 20%, the interfacial thermal conductance of SV (single vacancy) and DV (double vacancy) defects rises back to 5.606 × 10−2 GW/m2K and 5.224 × 10−2 GW/m2K, respectively. It is analyzed that the phonon overlapping and the participation rate act at the same time, so the heat-transferring phonons increase, increasing the thermal conductance of their interfaces. The findings provide theoretical support for optimizing the thermal management performance of heterostructure interfaces. Full article
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11 pages, 1391 KiB  
Article
Influence of Thickness on the Structure and Properties of TiAl(Si)N Gradient Coatings
by Alexey Kassymbaev, Alexandr Myakinin, Gulzhas Uazyrkhanova, Farida Belisarova, Amangeldi Sagidugumar and Ruslan Kimossov
Coatings 2025, 15(6), 710; https://doi.org/10.3390/coatings15060710 - 13 Jun 2025
Viewed by 511
Abstract
Enhanced hard coatings with exceptional mechanical and thermal qualities have prompted substantial study into multicomponent nitride systems. TiAl(Si)N coatings have emerged as viable possibilities owing to their remarkable hardness, thermal stability, and oxidation resistance. This work involved the fabrication of thickness-varied TiAl(Si)N gradient [...] Read more.
Enhanced hard coatings with exceptional mechanical and thermal qualities have prompted substantial study into multicomponent nitride systems. TiAl(Si)N coatings have emerged as viable possibilities owing to their remarkable hardness, thermal stability, and oxidation resistance. This work involved the fabrication of thickness-varied TiAl(Si)N gradient coatings using reactive magnetron sputtering, employing a controlled modulation of aluminum and silicon content across the film thickness. Three samples, with thicknesses of ~400 nm, ~600 nm, and ~800 nm, were deposited under uniform Ar/N2 gas flow ratios, and their microstructural, mechanical, and tribological characteristics were rigorously examined. SEM investigation demonstrated a significant change across thicknesses. XRD results validated the emergence of a predominant cubic TiAl(Si)N phase alongside a secondary hexagonal AlN phase, signifying partial phase segregation. The nanoindentation results indicated that Sample 2 exhibited the maximum hardness (~38 GPa) and Young’s modulus (~550 GPa) due to an optimized equilibrium between solid solution strengthening and nanocomposite production. Tribological testing revealed that Sample 1 displayed the lowest and most consistent friction coefficient, corresponding to its superior H/E and H3/E2 ratios, which signify improved elasticity and resistance to plastic deformation. The findings emphasize that the implementation of a compositional gradient, especially in the distribution of Si and Al, markedly affects the microstructure and performance of TiAl(Si)N coatings. Gradient structures enhance the microstructure, optimize hardness, and increase the friction coefficient. Ongoing refinement of gradient profiles and deposition parameters may further improve the characteristics of TiAl(Si)N coatings, facilitating their wider industrial use. Full article
(This article belongs to the Section Surface Characterization, Deposition and Modification)
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