Search Results (186)

In our study, supercapacitor electrodes were prepared by depositing electroless Ni-B coating on copper plates, followed by nitric acid etching. The composition and the micro- and phase structure of the coatings were investigated by ICP-OES, PFIB-SEM, and XRD techniques. The original pebble-like structure of the coating consists of 0.8–10 µm particles, with an X-ray amorphous phase structure. The surface morphology and porosity of the coating can be tuned simply by changing the etching time. The supercapacitive performance of the electrodes was evaluated by means of cyclic voltammetry, galvanostatic charge–discharge, and electrochemical impedance spectroscopy measurements. The capacitance of the coating was found to vary on the etching time according to a maximum function, allowing for the determination of an optimal duration to obtain a specific capacitance of 157 mF/cm² (at 0.5 A/g). An excellent charge storage retention of 178% was found after 5000 CV cycles at a scan rate of 50 mV/s owing to the evolved electrochemically active network on the surface of the electrode, indicating a long-term stable and reliable electrode. Full article

Planar heaters are designed to deliver uniform heat across broad surfaces and serve as critical components in applications requiring energy efficiency, safety, and mechanical flexibility, such as wearable electronics and smart textiles. However, conventional metal-based heaters are limited by poor adaptability to curved or complex surfaces, low mechanical compliance, and susceptibility to oxidation-induced degradation. To overcome these challenges, we applied a protein-assisted electroless copper (Cu) plating strategy to electrospun poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP) nanofiber substrates to fabricate flexible, conductive planar heating membranes. For interfacial functionalization, a protein-based engineering approach using bovine serum albumin (BSA) was employed to facilitate palladium ion coordination and seed formation. The resulting membrane exhibited a dense, continuous Cu coating, low sheet resistance, excellent durability under mechanical deformation, and stable heating performance at low voltages. These results demonstrate that the BSA-assisted strategy can be effectively extended to complex three-dimensional fibrous membranes, supporting its scalability and practical potential for next-generation conformal and wearable planar heaters. Full article

Mold copper plates (Cr–Zr–Cu alloy) frequently fail due to severe wear under high-temperature conditions during continuous casting. To solve this problem, Inconel 718 coatings were prepared on the plate surface via laser cladding to enhance its high-temperature wear resistance. The results demonstrate that the coatings exhibit a defect-free structure with metallurgical bonding to the substrate. The coating primarily consists of a γ-(Fe, Ni, Cr) solid solution and carbides (M₂₃C₆ and M₆C). Notably, elongated columnar Laves phases and coarse Cr–Mo compounds were distributed along grain boundaries, significantly enhancing the coating’s microhardness and high-temperature stability. The coating exhibited an average microhardness of 491.7 HV_0.5, which is approximately 6.8 times higher than that of the copper plate. At 400 °C, the wear rate of the coating was 4.7 × 10⁻⁴ mm³·N⁻¹·min⁻¹, significantly lower than the substrate’s wear rate of 8.86 × 10⁻⁴ mm³·N⁻¹·min⁻¹, which represents only 53% of the substrate’s wear rate. The dominant wear mechanisms were adhesive wear, abrasive wear, and oxidative wear. The Inconel 718 coating demonstrates superior hardness and excellent high-temperature wear resistance, effectively improving both the surface properties and service life of mold copper plates. Full article

Levelers are indispensable additives for achieving void-free, bottom-up superconformal copper filling of microvias. Establishing the molecular-level correlation between leveler structure and performance is therefore essential to the continued advancement of microelectronic copper-plating technology. Herein, nitro blue tetrazolium chloride (NBT) is identified as an efficient leveler for copper microvia superfilling. A multiscale strategy—combining electrochemical measurements, X-ray photoelectron spectroscopy (XPS), density functional theory (DFT) calculations, and molecular dynamics (MD) simulations—is employed to elucidate the action mechanism of NBT and pinpoint its electroactive sites. Electrochemical tests show that NBT markedly suppresses copper deposition and, together with polyethylene glycol (PEG), effectively resists competitive adsorption by bis-(3-sulfopropyl) disulfide (SPS), thereby enhancing the microvia superfilling performance of the PEG–SPS–NBT additive system. DFT results reveal that the nitro groups and tetrazolium rings constitute the primary adsorption centers on the copper surface; the nitro groups additionally strengthen intermolecular interactions between NBT and PEG. MD simulations further confirm that NBT anchors onto the Cu(111) surface predominantly through these NO₂ groups and the tetrazolium ring, while co-adsorbed PEG enhances the overall adsorption strength of NBT. The electroplating experiment demonstrates that NBT can act as an effective leveler for microvia superfilling. Moreover, XPS analyses further confirm the synergistic co-adsorption of NBT and PEG and verify that the NO₂ groups and tetrazolium rings are the dominant adsorption sites of NBT. Collectively, the electroplating, XPS, electrochemical, DFT, and MD findings clarify the structure–activity relationship of NBT and provide rational guidelines for designing next-generation copper-plating levelers. Full article

Electrolytic copper foil is one of the core materials in the fields of electronics, communications, and power. The cathode roller is the key component of the complete set of electrolytic copper foil equipment, and the quality of the titanium cylinder of the cathode roller directly determines the quality of the electrolytic copper foil. There typically exists a longitudinal weld on the surface of the cathode roller’s titanium cylinder sleeve manufactured by the welding method, which leads to the degradation of the quality of the electrolytic copper foil. Refining the grains in the weld zone and the heat-affected zone to close to those of the base material is a key solution for the manufacturing of welded cathode rollers. In order to effectively modify the microstructure and obtain an optimal refining effect in the weld zone of a TA1 cathode roller, a novel composite technology consisting of low-energy and fewer-pass welding combined with multi-pass rolling deformation and vacuum annealing treatment was primarily explored for high-purity TA1 titanium plates in this study. The microstructure of each area of the weld was observed using the DMI-3000M optical microscope, and the hardness was measured using the HVS-30 Vickers hardness tester. The research results show that the microstructure of each area of the weld can be effectively refined by using the novel composite technology of low-energy and fewer-pass welding, multi-pass rolling deformation, and vacuum annealing treatment. Among the explored experimental conditions, the optimal grain refinement effect is obtained with a V-shaped welding groove and four passes of welding with a welding current of 90 A and a voltage of 8–9 V, followed by 11 passes of rolling deformation with a total deformation rate of 45% and, finally, vacuum annealing at 650 °C for 1 h. The grain size grades in the weld zone and the heat-affected zone are close to those of the base material, namely grade 7.5~10, grade 7.5~10, and grade 7.5~10 for the weld zone, heat-affected zone, and base material, respectively. Meanwhile, this technology can also refine the grains of the base material, which is conducive to improving the overall mechanical properties of the titanium plate. Full article

Direct-writing submicron copper circuits on glass with laser precision—without lithography, vacuum deposition, or etching—represents a transformative step in next-generation microfabrication. We present a high-resolution, maskless method for metallizing glass using ultrashort pulse Bessel beam laser processing, followed by silver ion activation and electroless copper plating. The laser-modified glass surface hosts nanoscale chemical defects that promote the in situ reduction of Ag⁺ to metallic Ag⁰ upon exposure to AgNO₃ solution. These silver seeds act as robust catalytic and adhesion sites for subsequent copper growth. Using this approach, we demonstrate circuit traces as narrow as 0.7 µm, featuring excellent uniformity and adhesion. Compared to conventional redistribution-layer (RDL) and under-bump-metallization (UBM) techniques, this process eliminates multiple lithographic and vacuum-based steps, significantly reducing process complexity and production time. The method is scalable and adaptable for applications in transparent electronics, fan-out packaging, and high-density interconnects. Full article

W-Cu composites are widely used in the fields of switch contact materials and electronic packages because of their high hardness, high plasticity, and excellent thermal conductivity, while the traditional W-Cu composite preparation process is often accompanied by problems such as a long production cycle, difficulties in the processing of shaped parts, and difficulties in guaranteeing the uniformity. Therefore, this work developed a chemical plating technique to prepare W-20 wt.% Cu composite powder with a core–shell structure and used this powder as a raw material for powder metallurgy to solve the problem of inhomogeneity in the production of W-Cu composite by the conventional solution infiltration method. Moreover, the work also developed a high-temperature-resistant photosensitive resin, which was used as a raw material to prepare injection molds using photocuring to replace traditional steel molds. Compared to steel molds, which take about a month to prepare, 3D printed plastic molds take only a few hours, greatly reducing the production cycle. At the same time, 3D printing also provides the feasibility of the production of shaped parts. The injection molded blanks were degreased and sintered under different sintering conditions. The results show that the resultant chemically plated W-Cu composite powder has a uniform Cu coating on the surface, and the Cu forms a dense and uniform three-dimensional network in the scanning electron microscope images of each subsequent sintered specimen, while the photocuring-prepared molds were used to prepare the W-Cu shaped parts, which greatly shortened the production cycle. This preparation method enables rapid preparation of tungsten–copper composite-shaped parts with good homogeneity. Full article

In the present work, the influence of a magnetron-sputtered copper interlayer on the process of electron beam welding of Ti6Al4V and Al6082-T6 plates was investigated. A sample without a filler was also prepared as a control. The microstructure, microhardness, and tensile properties of both samples were determined. Applying a copper interlayer resulted in the formation of an additional CuAl₂ intermetallic compound in the form of a eutectic structure along the boundary of the aluminum crystal grains. A noticeable shift in the preferred crystallographic orientation of the aluminum phase from the denser {111} family of crystallographic planes in the case of the sample prepared without a filler towards less-dense ones such as {110}, {100}, and {311} in the case of applying a copper filler was observed. This was most probably caused by the lower free surface energy of the crystals oriented towards the {111} family of crystal planes, which favored the chemical bonding between the aluminum solid solution and the CuAl₂ intermetallics. As a result of applying the copper interlayer, a noticeable increase in the microhardness of the weld seam was observed from 78 ± 2 HV0.05 to 136 ± 3 HV0.05. Applying a copper interlayer also led to an improved energy absorption capacity of the weld seam, as suggested by the increase in the UTS/YS ratio from 1.03 to 1.44. This could be explained by the smooth transition between the highly dissimilar Ti6Al4V and Al6082-T6 alloys. The UTS of the sample with the copper filler reached 208 MPa, which was about 60% of that of the base Al6082-T6 alloy. Full article

Through-Silicon-Via (TSV) technology is of crucial importance in the process of defect-free copper filling in vias. In this study, the small molecule 2-mercapto-1-methylimidazole (SN2) is proposed as a new leveler. It enables bottom-up super-filling of blind vias without the need for inhibitors. Atomic force microscopy (AFM), X-ray diffraction (XRD), and XPS were employed to characterize the surface morphology, crystal structure, and adsorption properties of copper crystals in these systems. Meanwhile, by means of electrochemical measurements, the inhibitory effect of the leveler SN2 on copper ion deposition and the synergistic effect between SN2 molecules and other additives were investigated. The LSV test indicated that additive SN2 inhibited copper electrodeposition after being added to the plating solution, and this inhibitory effect enhanced with increasing SN2 concentration. In the actual plating wafer test (1 ASD plating for 1 min, 5 ASD plating for 5 min, and 10 ASD plating for 1 h), the best plating effect was achieved at 3 ppm, which verified the conjecture of the galvanostatic measurements. Moreover, XPS and computer simulations revealed that SN2 could be adsorbed onto the copper surfaces. This work will inspire the discovery of new effective levelers in the future. Full article

The use of solar energy is a promising solution to reduce dependence on fossil fuels. Flat-plate collectors (FPCs) are commonly employed to harness solar energy, but their performance is often limited by thermal resistance, surface deterioration, and inefficient heat dissipation. This study investigates the performance enhancement of an FPC integrated with porous copper foam through numerical simulations. The porous foam increases surface area and improves heat transfer by creating a complex flow path for the working fluid. Key parameters such as the porous foam height ratio (S), Darcy number (Da), and volumetric flow rate ($\dot{V}$) are analysed to determine their impact on thermal performance. The results indicate that a maximum Nusselt number (Nu) of 28.85 and an outlet temperature of 306.81 K is obtained for S = 1. A decrease in Da from 10⁻² to 10⁻⁶ and an increase in $\dot{V}$ from 0.25 L/min to 1 L/min enhance the Nu by 5.7% and 8.8%, respectively. The friction factor (f) increases with increases in S, a decrease in Da and an increase in $\dot{V}$. The performance evaluation criteria (PEC) are obtained to be maximum at S = 0.4, Da = 10⁻² and $\dot{V}$ = 0.25 L/min. These findings demonstrate the potential of porous copper foam in improving FPC efficiency. Full article

Silver-coated copper powder, a cost-effective alternative to pure silver, has gained attention for its potential applications in electronics, energy, and catalysis. To explore the impact of heat treatment on its properties, a series of experiments were conducted with temperature increments of 50 ${}^{\circ }$C and varying holding times. The silver-coated copper powder was prepared through chemical plating and was heat-treated to assess changes in surface morphology, conductivity, density, and antioxidant performance. Results show that heat treatment significantly improved surface flatness and smoothness, particularly at 600 ${}^{\circ }$C for 5 min followed by 700 ${}^{\circ }$C for 10 min. After treatment, the specific surface area decreased from 0.2282 m²/g to 0.2217 m²/g, while bulk density increased from 2.813 g/cm³ to 2.945 g/cm³, improving fluidity and stability. However, dislocation defects and the elimination of surface plasmon coupling between silver particles reduced conductivity, with resistance rising from 2.8 m$\Omega$ to 3.2 m$\Omega$. X-ray diffraction showed an increase in silver grain size from 13.68 nm to 20.33 nm, enhancing density but increasing electron scattering. Heat treatment also raised the initial oxidation temperature from 200 ${}^{\circ }$C to 230 ${}^{\circ }$C but accelerated subsequent oxidation. This study improves upon existing technology by significantly enhancing the surface smoothness, oxidation resistance, density, and specific surface area of the silver-coated copper powder. Full article

Wear-resistant coatings applied to the surface of copper and copper alloys through diverse advanced technologies can substantially enhance their wear resistance and broaden their application spectrum. This paper provides a comprehensive review of the development and current research status of wear-resistant coatings fabricated on copper and its alloys. It presents the research findings on the preparation of wear-resistant coatings using both one-step methods (such as laser cladding, electroplating, thermal spraying, cold spraying, electro-spark deposition, etc.) and two-step methods (chemical plating and heat treatment, electrodeposition and laser cladding, laser cladding and in situ synthesis, etc.). This paper provides an in-depth examination of the characteristics, operating principles, and effects of various coating techniques on enhancing the wear resistance of copper and copper alloys. The advantages and disadvantages of different coating preparation methods are compared and analyzed; meanwhile, a prospective outlook on the future development trends is also offered. Full article

This research examined the biochemical and microbiological characteristics of linen–copper (LI-Cu) composite materials, which were synthesized using magnetronsputtering techniques. The LI-Cu composites underwent comprehensive physicochemical and biological analyses. Physicochemical evaluations included elemental analysis (C, O, Cu), microscopic examination, and assessments of surface properties such as specific surface area and total pore volume. Biological evaluations encompassed microbiological tests and biochemical–hematological assessments, including the activated partial thromboplastin time (aPTT) and prothrombin time (PT). We determined the effect of LI-Cu materials on the viability and DNA damage in peripheral blood mononuclear (PBM) cells. Moreover, we studied the interactions of LI-Cu materials with plasmid DNA using a plasmid relaxation assay. The antimicrobial activity of LI-Cu composites was assessed using methodologies consistent with the EN ISO 20645:2006 and EN 14119:2005 standards. Specimens of the tested material were placed on inoculated agar plates containing representative microorganisms, and the extent of growth inhibition zones was measured. The results demonstrated that the modified materials exhibited antimicrobial activity against representative strains of Gram-positive and Gram-negative bacteria, as well as fungi. The results showed the cyto- and genotoxic properties of LI-Cu against PBM cells in a time- and power-dependent manner. Furthermore, the LI-Cu composite exhibited the potential for direct interaction with plasmid DNA. Full article

Li-ion batteries are at risk of explosions caused by fires, primarily because of the high energy density of Li ions, which raises the temperature. Battery cases are typically made of plastic, aluminum, or SAF30400. Although plastic and aluminum aid weight reduction, their strength and melting points are low. SAF30400 offers excellent strength and corrosion resistance but suffers from work hardening and low high-temperature strength at 700 °C. Additionally, Ni used for plating has a low current density of 25% international copper alloy standard (ICAS). SAF2507 is suitable for use as a Li-ion battery case material because of its excellent strength and corrosion resistance. However, the heterogeneous microstructure of SAF2507 after casting and processing decreases the corrosion resistance, so it requires solution heat treatment. To address these issues, in this study, SAF2507 (780 MPa, 30%) is solution heat-treated at 1100 °C after casting and coated with Ag (ICAS 108.4%) using physical vapor deposition (PVD). Ag is applied at five different thicknesses: 0.5, 1.0, 1.5, 2.0, and 2.5 μm. The surface conditions and electrochemical properties are then examined for each coating thickness. The results indicate that the PVD-coated surface forms a uniform Ag layer, with electrical conductivity increasing from 1.9% ICAS to 72.3% ICAS depending on the Ag coating thickness. This enhancement in conductivity can improve Li-ion battery safety on charge and use. This result is expected to aid the development of advanced Li-ion battery systems in the future. Full article

The application of smart materials in robots has attracted considerable research attention. This study developed an inchworm robot that integrates smart materials and a bionic design, using the unique properties of magnetorheological elastomers (MREs) to improve the performance of robots in complex environments, as well as their adaptability and movement efficiency. This research stems from solving the problem of the insufficient adaptability of traditional bionic robots on different surfaces. A robot that combines an MRE foot, an electromagnetic control system, and a bionic motion mechanism was designed and manufactured. The MRE foot was made from silicone rubber mixed with carbonyl iron particles at a specific ratio. Systematic experiments were conducted on three typical surfaces, PMMA, wood, and copper plates, to test the friction characteristics and motion performance of the robot. On all tested surfaces, the friction force of the MRE foot was reduced significantly after applying a magnetic field. For example, on the PMMA surface, the friction force of the front leg dropped from 2.09 N to 1.90 N, and that of the hind leg decreased from 3.34 N to 1.75 N. The robot movement speed increased by 1.79, 1.76, and 1.13 times on PMMA, wooden, and copper plate surfaces, respectively. The MRE-based intelligent foot design improved the environmental adaptability and movement efficiency of the inchworm robot significantly, providing new ideas for the application of intelligent materials in the field of bionic robots and solutions to movement challenges in complex environments. Full article