Search Results (122)

Diamond, renowned for its exceptional electrical, physical, and chemical properties, including ultra-wide bandgap, superior hardness, high thermal conductivity, and unparalleled stability, serves as an ideal candidate for next-generation high-power and high-temperature electronic devices. Among diamond-based devices, Schottky barrier diodes (SBDs) have garnered significant attention due to their simple architecture and superior rectifying characteristics. This review systematically summarizes recent advances in diamond SBDs, focusing on both metal–semiconductor (MS) and metal–interlayer–semiconductor (MIS) configurations. For MS structures, we critically analyze the roles of single-layer metals (including noble metals, transition metals, and other metals) and multilayer metals in modulating Schottky barrier height (SBH) and enhancing thermal stability. However, the presence of interface-related issues such as high densities of surface states and Fermi level pinning often leads to poor control of the SBH, limiting device performance and reliability. To address these challenges and achieve high-quality metal/diamond interfaces, researchers have proposed various interface engineering strategies. In particular, the introduction of interfacial layers in MIS structures has emerged as a promising approach. For MIS architectures, functional interlayers—including high-k materials (Al₂O₃, HfO₂, SnO₂) and low-work-function materials (LaB₆, CeB₆)—are evaluated for their efficacy in interface passivation, barrier modulation, and electric field control. Terminal engineering strategies, such as field-plate designs and surface termination treatments, are also highlighted for their role in improving breakdown voltage. Furthermore, we emphasize the limitations in current parameter extraction from current–voltage (I–V) properties and call for a unified new method to accurately determine SBH. This comprehensive analysis provides critical insights into interface engineering strategies and evaluation protocols for high-performance diamond SBDs, paving the way for their reliable deployment in extreme conditions. Full article

Fermi-level pinning (FLP) at metal–semiconductor interfaces remains a key obstacle to achieving low-resistance contacts in two-dimensional (2D) transition metal dichalcogenide (TMDC)-based heterostructures. Here, we present a first-principles study of Schottky barrier formation in WSe₂-MoSe₂ van der Waals heterostructures interfaced with four representative metals (Ag, Al, Au, and Pt). It was found that all metal–WSe₂/MoSe₂ direct contacts induce pronounced metal-induced gap states (MIGSs), leading to significant FLP inside the WSe₂/MoSe₂ band gaps and elevated Schottky barrier heights (SBHs) greater than 0.31 eV. By introducing a 2D metal-doped metallic (mWSe/mMoSe) layer between WSe₂/MoSe₂ and the metal electrodes, the MIGSs can be effectively suppressed, resulting in nearly negligible SBHs for both electrons and holes, with even an SBH of 0 eV observed in the Ag-AgMoSe-MoSe₂ contact, thereby enabling quasi-Ohmic contact behavior. Our results offer a universal and practical strategy to mitigate FLP and achieve high-performance TMDC-based electronic devices with ultralow contact resistance. Full article

In this study, we develop a graphene-trenched silicon Schottky junction for humidity sensing. This novel structure comprises suspended graphene bridging etched trenches on a silicon substrate, creating both free-standing and substrate-contacting regions of graphene that enhance water adsorption sensing. Suspended graphene is intrinsically insensitive to water adsorption, making it difficult for adsorbed H₂O to effectively dope the graphene. In contrast, when graphene is supported on the silicon substrate, water molecules can effectively dope the graphene by modifying the silicon’s impurity bands and their hybridization with graphene. This humidity-induced doping leads to a significant modulation of the Schottky barrier at the graphene–silicon interface, which serves as the core sensing mechanism. We investigate the current–voltage (I–V) characteristics of these devices as a function of trench width and relative humidity. Our analysis shows that humidity influences key device parameters, including the Schottky barrier height, ideality factor, series resistance, and normalized sensitivity. Specifically, larger trench widths reduce the graphene density of states, an effect that is accounted for in our analysis of these parameters. The sensor operates under both forward and reverse bias, enabling tunable sensitivity, high selectivity, and low power consumption. These features make it promising for applications in industrial and home safety, environmental monitoring, and process control. Full article

Hydrogen gas sensing is critical for energy storage, industrial safety, and environmental monitoring. However, traditional sensors still face challenges in selectivity, sensitivity, and stability. This work introduces an innovative N-polar GaN/AlGaN high-electron-mobility transistor (HEMT) with a 10 nm Pd catalytic layer as a hydrogen sensor. The device achieves ppm-level H₂ detection with rapid recovery and reusability, which is comparable to or even exceeds the performance of conventional Ga-polar HEMTs. The N-polar structure enhances sensitivity through its unique polarization-induced 2DEG and intrinsic back barrier, while the Pd layer catalyzes H₂ dissociation, forming a dipole layer that can modulate the Schottky barrier height. Experimental results demonstrate superior performance at both room temperature and elevated temperatures. Specifically, at 200 °C, the sensor exhibits a response of 102% toward 200 ppm H₂, with response/recovery times of 150 s/17 s. This represents a 96% enhancement in sensitivity and a reduction of 180 s/14 s in response/recovery times compared to room-temperature conditions (23 °C). These findings highlight the potential of N-polar HEMTs for high-performance hydrogen sensing applications. Full article

The zero-bandgap of graphene means that it can achieve a full spectral range response for graphene-based photodetectors. But the zero bandgap of graphene also brings relatively large dark current. To improve this issue and achieve low-cost graphene-based photodetectors, radio frequency (RF) magnetron-sputtered molybdenum disulfide constructed with graphene to form heterojunction was investigated. The results indicated that graphene/molybdenum disulfide heterojunction could provide a Schottky barrier height value of 0.739 eV, which was higher than that of the graphene/Si photodetector. It is beneficial to suppress the generation of the dark current. Different sputtering conditions were also studied. Testing results indicated that for the optimized process, the responsivity, detectivity, and quantum efficiency of graphene/molybdenum disulfide heterojunction photodetectors could reach up to 126 mA/W, 1.21 × 10¹¹ Jones, and 34%, respectively. In addition, graphene/molybdenum disulfide heterojunction on flexible PET substrate showed good stability, indicating that graphene/molybdenum disulfide heterojunction also has a good potential application in the field of flexible electronics. Full article

Aligned carbon nanotubes (A-CNTs) are emerging as one of the most promising materials for next-generation nanoelectronics. However, achieving reliable ohmic contacts between A-CNTs and metals remains a critical challenge. In this study, we employ rapid thermal annealing (RTA) to facilitate the formation of transition metal carbides at the metal–CNT interface, significantly reducing contact resistance and enhancing stability. Using the transmission line method (TLM), we demonstrate that RTA reduces the contact resistance at the Ti/A-CNT interface from 112.26 k$\mathrm{\Omega }·\mathrm{\mu }$m to 1.57 k$\mathrm{\Omega }·\mathrm{\mu }$m and at the Ni/A-CNT interface from 81.72 k$\mathrm{\Omega }·\mathrm{\mu }$m to 1.17 k$\mathrm{\Omega }·\mathrm{\mu }$m, representing a reduction of over an order of magnitude. Moreover, the Schottky barrier heights (SBHs) for both the Ti/A-CNT and Ni/A-CNT interfaces decreases by approximately 50% after annealing. A comparative analysis with Pd/A-CNT contacts shows that Ti and Ni contacts exhibit superior reliability under harsh conditions. This work provides a viable solution for improving the electrical performance and reliability of CNT-based devices, offering a pathway toward the development of future CMOS technologies. Full article

Gallium Arsenide (GaAs) Schottky technology stands out for its superior performance in terms of conversion loss for terahertz mixers at room temperatures, which establishes it as a dominant solution in receivers for high-data-rate wireless communications. However, Indium Gallium Arsenide (InGaAs) Schottky mixers offer a notable advantage in terms of reduced power requirements due to their lower barrier height, enabling optical pumping with the incorporation of photodiodes acting as photonic local oscillators (LOs). In this study, we present the first comparative analysis of GaAs and InGaAs diode technologies under both electrical and optical pumping, which are also being compared for the first time, particularly in the context of a wireless communication system, transmitting up to 80 Gbps at 0.3 THz using 16-quadrature amplitude modulation (QAM). The terahertz transmitter and the optical receiver’s LO are based on modified uni-traveling-carrier photodiodes (MUTC-PDs) driven by free-running lasers. The investigation covers a total of two mixers, including narrow-band GaAs and InGaAs. The results reveal that, despite InGaAs mixers exhibiting higher conversion loss, the bit error rate (BER) can be as low as that with GaAs. This is attributed to the purity of optically generated LO signals in the receiver. This work positions InGaAs Schottky technology as a compelling candidate for terahertz reception in the context of optical wireless communication systems. Full article

Optical absorption spectra of 9 MeV electron-irradiated GaSe crystals measured at temperatures in the range from 9.5 to 300 K were analyzed. The absorption spectra with features caused by Ga vacancies in two charge states and direct interband transitions were fitted by a model equation. Temperature dependencies of the defect concentrations and optical transition energies, as well as of the GaSe band gap, were determined. Current- and capacitance-voltage characteristics and DLTS spectra were measured for as-grown and electron-irradiated GaSe slabs with Sc (barrier) and Pt (ohmic) contacts. An experimental Sc/GaSe Schottky barrier height of 1.12 eV was determined in close agreement with a theoretical estimate. The activation energy and the hole capture cross-section deduced from the DLTS data are 0.23 (0.66) eV and 1.5 × 10⁻¹⁹ (2.3 × 10⁻¹⁵) cm⁻² for the supposed $V_{\mathrm{Ga}}^{-1}$ ($V_{\mathrm{Ga}}^{-2}$) defect. For the electron-irradiated GaSe crystals, the found activation energies are close to the values inferred from the optical measurements. Full article

In this paper, we investigated the effects of the processing parameters, such as deposition methods, annealing temperature, and metal thickness, on the electrical characteristics of Ti/4H-SiC contacts. A reduction of the Schottky barrier height from 1.19 to 1.00 eV following an increase of the annealing temperature (475–700 °C) was observed for a reference contact with an 80 nm-thick Ti layer. The current transport mechanisms can be described according to the thermionic emission (TE) and thermionic field emission (TFE) models under forward and reverse biases, respectively. The comparison with an e-beam evaporated Ti(80 nm)/4H-SiC contact did not show significant differences for the forward characteristics, while an increase of the leakage current was observed under high reverse voltage (>500 V). Finally, a thickness variation from 10 to 80 nm induced a reduction of the Schottky barrier height, due to the reaction occurring at the interface with a Ti-Al region extended up to the 4H-SiC surface. In addition to a deeper understanding of the Schottky barrier properties, this work is useful for the development of Schottky barrier diodes with tailored characteristics. Full article

In this work, the electrical properties of the Ga₂O₃ Schottky barrier diodes (SBDs) using W/Au as the Schottky metal were investigated. Due to the 450 °C post-anode annealing (PAA), the reduced oxygen vacancy defects on the β-Ga₂O₃ surface resulted in the improvement in the forward characteristics of the W/Au Ga₂O₃ Schottky diode, and the breakdown voltage was significantly enhanced, increasing by 56.25% from 400 V to 625 V after PAA treatment. Additionally, the temperature dependence of barrier heights and ideality factors was analyzed using the thermionic emission (TE) model combined with a Gaussian distribution of barrier heights. Post-annealing reduced the apparent barrier height standard deviation from 112 meV to 92 meV, indicating a decrease in barrier height fluctuations. And the modified Richardson constants calculated for the as-deposited and annealed samples were in close agreement with the theoretical value, demonstrating that the barrier inhomogeneity of the W/Au Ga₂O₃ SBDs can be accurately explained using the TE model with a Gaussian distribution of barrier heights. Full article

Interface-passivated graphene/silicon Schottky junction solar cells have demonstrated promising features with improved stability and power conversion efficiency (PCE). However, there are some misunderstandings in the literature regarding some of the working mechanisms and the impacts of the silicon/insulator interface. Specifically, attributing performance improvement to oxygen vacancies and characterizing performance using Schottky barrier height and ideality factor might not be the most accurate or appropriate. This work uses Al₂O₃ as an example to provide a detailed discussion on the interface ALD growth of Al₂O₃ on silicon and its impact on graphene electrode metal–insulator–semiconductor (MIS) solar cells. We further suggest that the current conduction in MIS solar cells with an insulating layer of 2 to 3 nm thickness is better described by direct tunneling, Poole–Frenkel emission, and Fowler–Nordheim tunneling, as the junction voltage sweeps from negative to a larger forward bias. The dielectric film thickness, its band offset with Si, and the interface roughness, are key factors to consider for process optimization. Full article

This study investigates the impact of cross-bridge Kelvin resistor (CBKR) layout designs on specific contact resistivity (ρ_c) measurements between TiSi₂ and n⁺ Si. The theoretical ρ_c is calculated as a function of silicon doping concentration (N_Si) and Schottky barrier height (ϕ_b) to evaluate the measurement value. Various CBKR patterns are fabricated and measured with different contact hole areas (A_c) and aligned margins (δ) to evaluate measurement accuracy. The results show that CBKR with a narrow active width (W) can more accurately measure the ρ_c compared to the conventional layout mainly attributed to the current path confinement. In addition, if the contact hole length (L) is smaller than the transfer length (L_T), the entire A_c contributes to the voltage drop of contact resistance (R_c), resulting in improved measurement accuracy. In contrast, if δ is increased, the measurement error decreases due to current dispersion near the recessed TiSi₂ region, which is different from conventional CBKR layouts. Consequently, the measured ρ_c with an optimized layout shows a close value to the theoretical ρ_c. Full article

This study investigated the low contact resistivity and Schottky barrier characteristics in p-GaN by modifying the thickness and doping levels of a p-InGaN cap layer. A comparative analysis with highly doped p-InGaN revealed the key mechanisms contributing to low-resistance contacts. Atomic force microscopy inspections showed that the surface roughness depends on the doping levels and cap layer thickness, with higher doping improving the surface quality. Notably, increasing the doping concentration in the p⁺⁺-InGaN cap layer significantly reduced the specific contact resistivity to 6.4 ± 0.8 × 10⁻⁶ Ω·cm², primarily through enhanced tunneling. Current–voltage (I–V) characteristics indicated that the cap layer’s surface properties and strain-induced polarization effects influenced the Schottky barrier height and reverse current. The reduction in barrier height by approximately 0.42 eV in the p⁺⁺-InGaN layer enhanced hole tunneling, further lowering the contact resistivity. Additionally, polarization-induced free charges at the metal–semiconductor interface reduced band bending, thereby enhancing carrier transport. A transition in current conduction mechanisms was also observed, shifting from recombination tunneling to space-charge-limited conduction across different voltage ranges. This research underscores the importance of doping, cap layer thickness, and polarization effects in achieving ultra-low contact resistivity, offering valuable insights for improving the performance of p-GaN-based power devices. Full article

This research presents a comprehensive study of a Schottky diode fabricated using a gold wafer and a bilayer molybdenum disulfide (${\mathrm{MoS}}_2$) film. Through detailed simulations, we investigated the electric field distribution, potential profile, carrier concentration, and current–voltage characteristics of the device. Our findings confirm the successful formation of a Schottky barrier at the Au/${\mathrm{MoS}}_2$ interface, characterized by a distinct nonlinear I–V relationship. Comparative analysis revealed that the Au/${\mathrm{MoS}}_2$ diode significantly outperforms a traditional W/Si structure in terms of rectification performance. The Au/${\mathrm{MoS}}_2$ diode exhibited a current density of 1.84 × ${10}^{-9}$ A/${\mathrm{cm}}^2$, substantially lower than the 3.62 × ${10}^{-5}$ A/${\mathrm{cm}}^2$ in the W/Si diode. Furthermore, the simulated I–V curves of the Au/${\mathrm{MoS}}_2$ diode closely resembled the ideal diode curve, with a Pearson correlation coefficient of approximately 0.9991, indicating an ideality factor near 1. A key factor contributing to the superior rectification performance of the Au/${\mathrm{MoS}}_2$ diode is its higher Schottky barrier height of 0.9 eV compared to the 0.67 eV of W/Si. This increased barrier height is evident in the band diagram analysis, which further elucidates the underlying physics of Schottky barrier formation in the Au/${\mathrm{MoS}}_2$ junction. This research provides insights into the electronic properties of Schottky contacts based on two-dimensional ${\mathrm{MoS}}_2$, particularly the relationship between electronic barriers, system dimensions, and current flow. The demonstration of high-ideality-factor Au/${\mathrm{MoS}}_2$ diodes contributes to the design and optimization of future electronic and optoelectronic devices based on 2D materials. These findings have implications for advancements in semiconductor technology, potentially enabling the development of smaller, more efficient, and flexible devices. Full article

In this study, metal–silicide-based contacts to GaN-cap/AlGaN/AlN-spacer/GaN-on-Si heterostructure were investigated. Planar Schottky diodes with Cu-covered anodes comprising silicide layers of various metal–silicon (M–Si) compositions were fabricated and characterized in terms of their electrical parameters and thermal stability. The investigated contacts included Ti–Si, Ta–Si, Co–Si, Ni–Si, Pd–Si, Ir–Si, and Pt–Si layers. Reference diodes with pure Cu or Au/Ni anodes were also examined. To test the thermal stability, selected devices were subjected to subsequent annealing steps in vacuum at incremental temperatures up to 900 °C. The Cu/M–Si anodes showed significantly better thermal stability than the single-layer Cu contact, and in most cases exceeded the stability of the reference Au/Ni contact. The work functions of the sputtered thin layers were determined to support the discussion of the formation mechanism of the Schottky barrier. It was concluded that the barrier heights were dependent on the M–Si composition, although they were not dependent on the work function of the layers. An extended, unified Schottky barrier formation model served as the basis for explaining the complex electrical behavior of the devices under investigation. Full article