Search Results (167)

Advanced nanoimprint lithography (NIL) is promising for inorganic semiconductor patterning because it enables high-resolution replication with a relatively simple process flow; however, yield loss increasingly originates from spatially distributed, subcritical distortions accumulated across coating, exposure, etching, and imprinting. In this study, we propose an integrated physics-based and data-driven framework for pre-manufacturing defect-risk prediction in NIL. The framework combines an NDA-safe layout database, a physics-based process twin, and a stochastic risk prediction model using a physics-augmented convolutional neural network with conformal uncertainty calibration. Starting from binary design layouts, the process twin sequentially captures resist thickness variations during spin coating, proximity-induced dose redistribution and development-induced pattern deformation during electron-beam lithography (EBL), density-sensitive pattern transfer during reactive ion etching (RIE), and three-dimensional resist filling during imprinting, thereby generating physically consistent parameter maps for downstream learning. The results demonstrate an end-to-end virtual inspection flow that converts layouts into spatially resolved risk maps before fabrication. In addition, patterns with similar contour extent but different local density exhibit distinctly different risk distributions, indicating that manufacturability is governed not only by nominal geometry but also by local pattern environment. These findings support pre-manufacturing virtual inspection as a physically interpretable route for early yield-risk screening in advanced NIL. Full article

Nanoimprint lithography (NIL) is highly dependent on imprinted film as a pattern-transfer medium. This paper systematically reviews the research progress of imprint film materials for NIL. Firstly, polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyvinyl alcohol (PVA) and other single-polymer films are discussed, and their respective advantages (such as low surface energy, high optical transparency, water solubility) and inherent limitations (elastic deformation, demolding difficulties, humidity sensitivity)) are summarized. In order to overcome the above contradiction, researchers developed a composite imprint film structure, including an elastomer–rigid bilayer template and sandwich structure film, which achieved high resolution, conformal contact and facile demolding characteristics through mechanical function decoupling. At the same time, the emerging polymer/transparent electrode composite system (such as AgNWs/PVA, AgNWs/PDMS) gives the film active functions such as self-heating and antistatic ones, which effectively solves the key challenges in thermal management and electrostatic control. This paper comprehensively presents the evolution path from single-material to multi-functional composites, and provides guidance for the design of advanced imprint film for high precision, high reliability and large-scale NIL applications. Full article

Metasurfaces, planar structures made on a subwavelength scale, enable state-of-the-art manipulation of light and have become a promising solution for compact optical devices. However, fabrication of these nanoscale structures relies on demanding processes, limiting their integration into diverse structures, including three-dimensional ones. In this study, we develop a manufacturing and transfer technique that renders the manipulation and deposition of metasurfaces achievable with high freedom by embedding the nanostructure into a flexible polymer matrix. A metasurface consisting of a TiO₂ nanoparticle array fabricated by nanoimprint lithography was encapsulated within a poly(methyl methacrylate) (PMMA) layer through spin-coating. The layer containing the metasurface was then detached from the original SiO₂ substrate using wet-etching, becoming a free-standing soft sheet carrying nanostructures that can be transferred onto various surfaces. After the transfer, the layer thickness was further tuned through reactive ion etching to modulate the optical response. Incident-angle-resolved transmittance exhibited no significant change in optical bands before and after transfer, confirming that the nanostructure, as well as the photonic band, was well preserved. Thickness reduction of the PMMA cladding induced a clear optical resonance shift, demonstrating controllability of the optical response. This approach provides a versatile route for the installation of metasurfaces and expands the design possibilities for nanophotonic devices. Full article

Nanoimprint lithography (NIL) plays an increasingly important role in modern nanomanufacturing processes, but its effective application in production conditions requires precise tools for evaluating and optimising technological processes. The aim of the study was to develop and model key performance indicators (KPIs) supporting the optimisation of the quality, stability and efficiency of nanoimprint lithography processes. As part of the selection of indicators, a literature review, surveys and in-depth interviews with industry experts were conducted, which enabled the identification of indicators relevant from a technological practice perspective. The proposed KPI classification was directly linked to the stages of the NIL process, creating a basis for operational performance control and process capability analysis. A novel aspect is the proposal of an integrated KPI model that combines the classification of indicators based on the stages of the NIL process with their direct link to technological parameters and measurable quality effects. These indicators have been linked to critical process parameters for different NIL variants, including Thermal NIL, UV-NIL, Roll-to-Roll NIL and Step-and-Repeat NIL, using a process analysis and multi-criteria optimisation approach. Research indicates that the use of an integrated KPI model improves the accuracy of nanostructure mapping, reduced defect density, and increased process efficiency without compromising technological stability. The proposed approach is a universal tool supporting NIL process control, its scaling to industrial applications, and integration with statistical process control and data-driven optimisation methods. Full article

We present a Genetic Algorithm (GA)-based inverse design framework for creating a single-layer, fabrication-compatible dielectric nano-patterned surface that enables efficient color routing in both transmissive and reflective optical systems. Unlike traditional multilayer or absorption-based color filters, the proposed structure employs a fabrication-compatible architecture that spatially routes red, green, and blue light into designated output channels, significantly enhancing light utilization and color fidelity. The design process integrates a GA with full-wave finite-difference time-domain (FDTD) simulations to optimize the structural pillar height distribution, using a figure of merit that simultaneously maximizes optical efficiency and minimizes spectral crosstalk. For CMOS image sensor-scale designs, the nano-patterned surface achieved peak optical efficiencies of 76%, 72%, and 78% for blue, green, and red channels, respectively, with an average efficiency of 75.5%. Parametric studies further revealed the dependence of performance on pillar geometry, refractive index, and unit cell scaling, providing practical design insights for scalable fabrication using nanoimprint or grayscale lithography. Extending the approach to reflective displays, we demonstrate tunable-mirror-based architectures that emulate electrophoretic microcapsules, achieving efficient color reflection and an expanded color gamut beyond the sRGB standard. This single-layer, inverse-designed nano-patterned surface offers a high-performance and fabrication-ready solution for compact, energy-efficient imaging and display technologies. Full article

In high-precision optical systems such as laser optics, astronomical observation, and semiconductor lithography, anti-reflection coatings are crucial for light transmittance, imaging quality, and stability, but traditional designs face modeling challenges in balancing ultralow reflectivity, high wavefront quality, and manufacturability amid multi-dimensional parameter coupling and multi-objective constraints. This study addresses these by proposing a unified mathematical modeling framework integrating a Symmetric five-layer high-low refractive index alternating structure (V-H-V-H-V) with dual-scale nanostructures, employing a constrained quasi-Newton optimization algorithm (L-BFGS-B) to minimize reflectivity, wavefront root-mean-square (RMS) error, and surface roughness root-mean-square (RMS) in a six-dimensional parameter space. The Sellmeier equation is adopted to calculate wavelength-dependent material refractive indices, the model uses the transfer matrix method for the Symmetric five-layer high-low refractive index alternating structure’s reflectivity, incorporates nano-surface height function gradient correction, sub-wavelength modulation, and radial optimization, applies Zernike polynomials for low-order aberration correction, quantifies surface roughness via curvature proxies, and optimizes via a weighted objective function prioritizing low reflectivity. Numerical results show the spatial average reflectivity at 632.8 nm reduced to 0.13%, the weighted average reflectivity across five representative wavelengths in the 550–720 nm range to 0.037%, the reflectivity uniformity to 10.7%, the post-correction wavefront RMS to 11.6 milliwavelengths, and the surface height standard deviation to 7.7 nm. This framework enhances design accuracy and efficiency, suits UV nanoimprinting and electron beam evaporation, and offers significant value for high-power lasers, lithography, and space-borne radars. Full article

This article proposes a novel transparent conductive film structure to solve the problem of electrostatic accumulation in traditional nanoimprint lithography processes. This structure is formed by spin-coating a layer of silver nanowire (AgNWs) transparent conductive films on a graphic substrate, followed by coating a layer of polydimethylsiloxane (PDMS) on the surface of the film. After the PDMS is cured, it is peeled off from the substrate to form a free-standing elastic three-dimensional structured surface. These transparent conductive films are not only designed to mitigate static electricity generated during the nanoimprint lithography process, but also have excellent UV transparency, with a 325 nm UV transmittance of up to 90%. At the same time, it exhibits good conductivity with a sheet resistance of 20 Ω/sq. In addition, the films have excellent elasticity and can maintain stable conductivity during repeated stretching, providing a novel solution for flexible optoelectronic devices and nanoimprint technology. Full article

Low-melting bioabsorbable polymers, such as poly(caprolactone-co-lactide) (PCLA), hold significant promise for biomedical applications. However, achieving high-precision micro- and nanotopographical functionalization remains a formidable challenge due to the material’s susceptibility to thermal deformation during conventional thermal molding processes. In this study, functional microstructured PCLA coatings were engineered via low-temperature nanoimprint lithography utilizing a TiO₂–SiO₂ gas-permeable mold. These molds were synthesized via a sol–gel method utilizing titanium dioxide and silicon precursors. The gas-permeable nature of the mold facilitated the efficient evacuation of trapped air and volatiles during the imprinting process, enabling the high-fidelity replication of microstructures (1.3 μm height, 3 μm pitch) and nanostructured PCLA coatings featuring linewidths as narrow as 600 nm. The resultant microstructured PCLA coatings demonstrated modulated surface wettability, evidenced by an increase in water contact angles from 70.1° to 91.4°, and exhibited enhanced FD4 elution kinetics. These results confirm morphology-driven functionalities, specifically hydrophobicity and controlled release capabilities. Collectively, these findings underscore the efficacy of this microfabrication approach for polycaprolactone-based materials and highlight its potential to catalyze the development of high-value-added biomaterials for advanced medical and life science applications. This study establishes a foundational framework for the practical deployment of next-generation bioabsorbable materials and is anticipated to drive innovation in precision medical manufacturing. Full article

Nanoimprint lithography (NIL) master fidelity is governed by coupled variations beginning with resist spin-coating, proceeding through electron beam exposure, and culminating in anisotropic etch transfer. We present an integrated, physics-based simulation chain. First, it includes a spin-coating thickness model that combines Emslie–Meyerhofer scaling with a Bornside edge correction. The simulated wafer-scale map at 4000 rpm exhibits the canonical center-rise and edge-bead profile with a 0.190–0.206 μm thickness range, while the locally selected 600 nm × 600 nm tile shows <0.1 nm variation, confirming an effectively uniform region for downstream analysis. Second, it couples an e-beam lithography (EBL) module in which column electrostatics and trajectory-derived spot size feed a hybrid Gaussian–Lorentzian proximity kernel; under typical operating conditions (${\sigma }_{traj}$ ≈ 2–5 nm), the model yields low CD bias (ΔCD = 2.38/2.73 nm), controlled LER (2.18/4.90 nm), and stable NMSE (1.02/1.05) for isolated versus dense patterns. Finally, the exposure result is passed to a level set reactive ion etching (RIE) model with angular anisotropy and aspect ratio-dependent etching (ARDE), which reproduces density-dependent CD shrinkage trends (4.42% versus 7.03%) consistent with transport-limited profiles in narrow features. Collectively, the simulation chain accounts for stage-to-stage propagation—from spin-coating thickness variation and EBL proximity to ARDE-driven etch behavior—while reporting OPC-aligned metrics such as NMSE, ΔCD, and LER. In practice, mask process correction (MPC) is necessary rather than optional: the simulator provides the predictive model, metrology supplies updates, and constrained optimization sets dose, focus, and etch set-points under CD/LER requirements. Full article

The integration of artificial intelligence (AI) and micro/nanorobotics is fundamentally reshaping biosensing by enabling autonomous, adaptive, and high-resolution biological analysis. These miniaturized robotic systems fabricated using advanced techniques such as photolithography, soft lithography, nanoimprinting, 3D printing, and self-assembly can navigate complex biological environments to perform targeted sensing, diagnostics, and therapeutic delivery. AI-driven algorithms, mainly those in machine learning (ML) and deep learning (DL), act as the brains of the operation, allowing for sophisticated modeling, genuine real-time control, and complex signal interpretation. This review focuses recent advances in the design, fabrication, and functional integration of AI-enabled micro/nanorobots for biomedical sensing. Applications that demonstrate their potential range from quick point-of-care diagnostics and in vivo biosensing to next-generation organ-on-chip systems and truly personalized medicine. We also discuss key challenges in scalability, energy autonomy, data standardization, and closed-loop control. Collectively, these advancements are paving the way for intelligent, responsive, and clinically transformative biosensing systems. Full article

Propagation phase metasurfaces have excellent electromagnetic regulation and polarization-insensitive properties, while roll-to-plate nanoimprint lithography (R2P-NIL) is ideal for their large-scale low-cost fabrication. Existing demolding simulations for R2P-NIL are limited to 2D analysis, ignore elastomeric roller impacts, and cannot handle the discrete pillar/hole structures of such metasurfaces. This study establishes a 3D multiscale simulation model using a finite element method combining a macroscopic elastomeric roller deformation model and a microscopic demolding stress model with motion equation-based parameter transfer. Simulation results show macroscopically that zero elastomeric layer thickness minimizes stress, while stress rises and then stabilizes with increasing thickness; a moderately larger roller radius disperses stress; excessive pressure amplifies stress; a microscopically higher resist elastic modulus lowers stress; cylindrical structures have less stress than cuboids; and the limit aspect ratio peaks at a 100 nm line width. This work provides theoretical support for R2P-NIL parameter optimization and promotes the stable large-scale production of propagation phase metasurfaces. Full article

Nanoimprint lithography (NIL) is a high-resolution parallel patterning method based on molding. It has proven resolution down to the nanometer range and can be scaled up for large areas and high throughput. Its main characteristic is that the surface pattern of a mold is imprinted on a material that is displaced locally by using the difference in hardness of the mold and the moldable material, thus replicating its surface topography. This can be achieved by shaping a thermoplastic film by heating and cooling (T-NIL) or a photosensitive resin followed by a curing process for hardening (UV-NIL). In lithography, the local thickness contrast of the thin molded film can be used as a masking layer to transfer the pattern onto the underlying substrate. Therefore, NIL will be an alternative in fields in which electron-beam lithography and photolithography do not provide sufficient resolution at reasonable throughput. Direct imprint enables applications where a modified functional surface is needed without pattern transfer. NIL is currently used for high-volume manufacturing in different applications, like patterned sapphire substrates, wire grid polarizers, photonic devices, lightguides for AR/VR devices, metalenses, and biosensors for DNA analysis, and is being tested for semiconductor integrated circuit chips. Full article

This paper innovatively proposes a high-precision fabrication strategy for silicon-based micro–nano-composite layered structures composed of micron-scale platforms and nanopillars, effectively addressing the challenges of alignment errors and material mismatch during manufacturing. By integrating electron beam lithography (EBL), inductively coupled plasma (ICP) etching, and ultraviolet nanoimprint lithography (NIL) into a unified multi-step workflow, the method achieves exceptional precision and efficiency in producing complex micro–nano-composite architectures. Comprehensive structural characterization is performed using scanning electron microscopy (SEM) and atomic force microscopy (AFM), with probe convolution effects carefully corrected to ensure accurate dimensional analysis. Experimental results confirm the outstanding stability and uniformity of the fabricated structures, exhibiting minimal deviations in both feature size and spatial layout. Nanopillars with diameters ranging from 50 to 200 nm are successfully integrated onto 1-µm square platforms, with the lateral deviation of 50 nm features maintained within 5% or less. Furthermore, the method effectively mitigates thermal stress-induced misalignment during the fabrication of multi-material layers, demonstrating strong potential for scalable production of advanced photonic devices and integrated nanophotonic systems. Overall, this work establishes a robust and versatile technical pathway for the precise manufacturing and quantitative characterization of micro–nano-composite structures, providing a key foundation for the next generation of photonic integration technologies. Full article

This paper presents a hybrid fabrication method for producing anti-counterfeit optical elements on plastic products and surfaces targeting multidiscipline applications such as food, pharmaceuticals, luxury goods, and electronics industry. Our proposition combines the design flexibility and rapid prototyping capabilities of stereolithography three-dimensional (SLA 3D) printing with nanoimprint lithography (NIL) to create unique optical security tags onto plastic surfaces. The proposed approach is cost-effective, scalable, and tailored for mass production, addressing the increasing demand for secure and reliable authentication solutions. NIL is substrate agnostic, offering material selection versatility and realization of security tags onto polymer surfaces, which are widely used across various sectors such as packaging industry, medical devices, and flexible electronics. This enables integration into a wide range of materials, further enhancing applicability on flat and 3D shape surfaces. An evaluation method based on digital reconstruction has been used to ensure robust performance and verification of the produced optical security features. The results demonstrate that this hybrid approach provides a reproducible and technically feasible path for the development of optical anti-counterfeiting tags suitable for large-scale implementation, particularly within fast-moving consumer goods (FMCG). Full article

Polymeric optical waveguides represent an essential component in photonic technology thanks to their ability to guide light through controlled structures, enabling applications in telecommunications, sensors, and integrated devices. With the development of new materials and increasingly versatile manufacturing methods, these structures are being integrated into various systems at a rapid pace, while their dimensions are constantly being reduced. This article explores the main fabrication methods for polymeric optical waveguides, such as traditional and maskless photolithography, laser ablation, hot embossing, nanoimprint lithography, the Mosquito method, inkjet printing, aerosol jet printing, and electrohydrodynamic (EHD) printing. The operating principle of each method, the equipment and materials used, and their advantages, limitations, and practical applications are evaluated, in addition to the propagation losses and characterization of the waveguides obtained with each method. Full article