Search Results (180)

Graphite is widely used as an anode in lithium-ion batteries (LIBs); however, its limited capacity restricts the energy density enhancement. Si-based anodes offer much higher capacity, but their significant volume changes during repeated lithiation and delithiation generate mechanical stress and can damage the electrode/current-collector interface. Herein, high-strength nanotwinned Cu (NT-Cu) was fabricated and employed as current collectors for carbon-coated Si/β-Si₃N₄-based anodes. The electroplated 5 μm-thick NT-Cu foils exhibited tensile strength exceeding 760 MPa. The role of the Cu current collector was investigated by comparing NT-Cu foils with different mechanical properties and commercial Cu foils. The results show that electrochemical performance was not governed by UTS alone; instead, a balanced combination of tensile strength, ductility, and surface morphology was important for improving cycling stability and rate capability. To further improve cycling retention, artificial graphite was incorporated into the Si/β-Si₃N₄ composite. Using a 5 μm electroplated NT-Cu foil and a Si/β-Si₃N₄/artificial graphite composite anode, the pouch cell retained 81.51% of its capacity and delivered 267.3 mAh g⁻¹ after 206 cycles. These results demonstrate the potential of NT-Cu for improving the stability of Si-containing LIB anodes. Full article

Few-layer hexagonal boron nitride (hBN) is a promising two-dimensional dielectric for electronic and neuromorphic devices. However, its practical deployment is often hindered by the thickness nonuniformity of as-grown samples and by defects introduced during the transfer-stacking process of assembled samples. In particular, the influence of the initial hBN quality on the final stacked-film quality remains insufficiently understood. Here, we report a wafer-scale strategy for fabricating high-quality few-layer hBN based on ultraflat single-crystal hBN (USC-hBN) monolayers. Compared with transfer-stacked hBN grown on Cu foil (rough hBN), stacked few-layer USC-hBN shows a much lower surface roughness and a drastically reduced wrinkle density, indicating superior flatness and interfacial cleanliness. Furthermore, memristors fabricated from six-layer USC-hBN exhibit clearer resistive-switching behavior and a higher ON/OFF ratio than those based on rough hBN, owing to the more uniform surface/interface. These results demonstrate that source-material flatness is a critical determinant of transfer-stacked hBN quality and device performance. This work provides an effective route toward reliable integration of high-quality two-dimensional dielectric films. Full article

Cathodic electrodeposition of copper on molybdenum and stainless-steel substrates has been investigated with the aim of examining their potential to produce thin copper foils (TCFs). Copper in the form of a thin film was electrodeposited galvanostatically from the acidic sulfate electrolyte without and with an addition of suppressor/activator additives, such as chloride ions, polyethylene glycol 6000 and 3–mercapto–1–propanesulfonic acid. The cathodes and electrodeposited Cu films were characterized by SEM, AFM, and XRD techniques, while the adhesion of Cu films, as a crucial parameter in the production of Cu foils, was estimated by a lab-made prototype of a bending test machine made by applying additive technology. The adhesion parameter named “critical cycle number” (n_c), which defines the minimal number of cycles leading to a delamination (separation) of the film from the cathode was used for assessing the adhesion features of the films. The easiest delamination, i.e., the smallest n_c, showed nanocrystalline films obtained with the addition of all additives, whereupon the values were significantly smaller than the values obtained for microcrystalline films obtained without and with a partial combination of the additives. The easy delamination of the nanocrystalline films indicated that both substrates have a high potential for application in the production of TCFs. Full article

Cold-mercury gilding uses mercury as an adhesive to bond gold foil onto the surface of copper and silver artifacts. This technique and mercury gilding (fire gilding) both belong to the Au-Hg system and are closely related in technology. Clarifying the technical differences between them is of great significance for revealing the developmental sequence of ancient gilding technologies. On the basis of reconstructing traditional fire gilding, simulated cold-mercury-gilded samples were successfully prepared using experimental archeological methods, and multi-scale characterization was performed using SEM-EDS, XRD, and XPS. The results show that the surface of cold-mercury-gilded samples displays a micromorphology of folded and overlapped gold foil accompanied by locally dense particle aggregation. The cross-section of the gold layer exhibits a multilayer stacked structure, in which mercury is enriched at the gold layer/substrate interface and forms an AuHgCu/Ag diffusion layer. Room-temperature-stable Au-Hg and Ag-Hg phases such as Au₂Hg and AgHg are present in the gold layer, reflecting complex phase transformation behavior of the Au-Hg/Ag-Hg system at room temperature. During cold-mercury gilding, liquid mercury first adheres to the gold foil, and then interdiffusion and phase reactions occur between mercury, gold, and copper/silver atoms at room temperature. Intermetallic compounds and diffusion layers formed at the interface achieve firm bonding between the gold layer and the substrate. Both cold-mercury gilding and mercury gilding achieve metallurgical bonding through atomic interdiffusion. However, affected by differences in the initial state of mercury and operating temperature, the phase transformation and atomic diffusion behaviors of the system differ significantly, which are ultimately reflected in the cross-sectional structure of the gold layer, the composition of the interfacial diffusion layer, and the types of phases. Therefore, mercury-gilded artifacts show superior gold layer durability and bonding strength with the substrate compared with cold-mercury-gilded artifacts. Both techniques pioneered the application of mercury in metallic gilding and represent important innovations in ancient surface decoration technology. Full article

Titanium dioxide (TiO₂) nanotube arrays (NTAs) were constructed on Ti foil to immobilize Cu₂ZnSnS₄-TiO₂ (CZTS-T/NTAs) via the sol–gel dip-coating technique. The films were characterized by X-ray diffraction (XRD) patterns, field-emission scanning electron microscope–energy dispersive spectroscopy (FESEM-EDX), ultraviolet–visible diffuse reflectance spectra (UV–Vis/DRS), and electrochemical impedance spectroscopy (EIS) techniques. The photocatalytic property of CZTS-T/NTAs was evaluated by the photodegradation of Basic Blue 41 under visible light irradiation. We show that CZTS-T/NTAs have an energy band gap of 2.23 eV, which leads to excellent potential trapping or facilitates the transition of charge carriers under visible light. The parameters R₀ and C₀ of the experimental EIS data, by fitting the proposed electrical circuit, were also discussed. Decreasing R₀ led to an increase in cell capacitance, which resulted in increased carrier generation at the interface between the catalyst and solution and thus an increased photodegradation yield. The response surface methodology (RSM) and central composite rotatable design (CCRD) were used to optimize the effects of the experimental parameters in the degradation process by four key variables (pH, dye concentration, irradiation time, and hydrogen peroxide (H₂O₂) concentration). As a result, the optimized conditions attained a considerable degradation of 95.25%. We also proposed the possible photodegradation mechanism of the photocatalyst. Notably, the proposed catalyst after six consecutive reuse runs retained activity. Full article

This study investigates the joint characteristics of a 60-layered copper foil stack using linear vibration ultrasonic welding for lithium-ion pouch cell applications. With increasing demand for high-capacity electric vehicle batteries, ensuring the reliability of multilayer electrode joints is essential. Experiments were conducted by varying vibrational amplitude, welding time, and clamping pressure. Weld quality was analyzed based on indentation profiles, joint strength, and failure modes. Results revealed that optimal welding energy (500–900 J) produced well-formed joints without surface cracks or tearing. Excessive welding energy (>900 J) led to material thinning and interfacial failure. The maximum T-peel peak load of 138.7 N was obtained at the 30th joining interface under 25 µm amplitude, 0.8 s welding time, and 1.5 bar clamping pressure. Interface-dependent optimum conditions were observed, reflecting thickness–direction variations in deformation and bonding within the 60-layer stack. Indentation length and depth correlated linearly with welding energy. Failure modes transitioned from no adhesion to tearing and button-pull types. The findings provide guidelines for optimizing welding parameters for high-quality multilayer foil joints in battery manufacturing. Full article

Grain size plays a decisive role in governing the interface evolution and mechanical properties of ultra-thin metal composite foils. This study systematically investigates this relationship in roll-bonded C7701/Ti/C7701 (Cu-Ni-Zn alloy) composite foils. By controlling the initial grain size via pre-annealing, we demonstrate that a moderate grain size (~7–8 μm) optimally regulates a sequential “bonding–diffusion–intermetallic compound (IMC) formation” process at the interface. This results in a continuous, thin IMC layer and the best strength–ductility synergy (e.g., UTS ~217.5 MPa, elongation ~4.15%). In contrast, excessively fine or coarse grains lead to thick, brittle IMCs or interfacial defects, respectively, degrading performance. The mechanism by which grain size influences performance is revealed through a sequential mechanism of “bonding–diffusion–intermetallic compound formation.” Full article

The coexistence of Cu in copper sulfate electrolyte significantly affects the microstructure and performance of the copper foil. So far, there has been little quantitative analysis of Cu⁺ in the electrolyte during the copper foil production process. This paper fabricated a 2,2′-Biquinoline (BIQ) modified expanded graphite (EG) electrode electrochemical sensor for the selective determination of Cu⁺. EG, with its large specific surface area and excellent adsorption and electrochemical properties, significantly enhances analytical sensitivity. Additionally, BIQ’s specific coordination with Cu⁺ improves the sensor’s rapid and effective quantification of Cu⁺ in the electrolytic copper foil electrolyte. The linear equation of this sensor is I = 0.03769 + 0.29997 × c (R² = 0.9989), with a detection limit of 8 μg/L (S/N = 3). The BIQ-modified EG electrode has good selectivity for Cu⁺, with a recovery rate for cuprous ions of 101.00% to 105.00% under the coexistence of 10,000 times Cu²⁺, and an RSD of less than 2%. This sensor’s efficient, sensitive, and selective detection of Cu⁺ can be an effective method to improve the quality of electrolytic copper foil products. Full article

This study examines the joining characteristics of Cu foil stacks to lead tabs using green-laser welding in the main-welding step of a sequential welding process for lithium-ion pouch cells. The influence of lap configuration, line and wobble seam strategies, and process parameters was systematically investigated in terms of bead morphology, mechanical performance, metallurgical characteristics, and electrical resistance. Under the present line-welding parameter window (2.0 kW, 100–200 mm/s), humping, pinholes, and porosity were observed, particularly in the upper lead-tab configuration, which is attributed to melt-pool/keyhole instability under the applied conditions. Wobble welding effectively suppressed these defects in the foil-stack configuration by promoting stable melt flow and efficient bubble expulsion. Mechanical tests revealed that the wobble-based seam strategy achieved a maximum tensile–shear load of approximately 1.28 kN at a wobble amplitude of 0.8 mm. Fracture analysis confirmed a transition from seam-type interfacial failure in line welding to ductile tearing in the heat-affected zone with wobble welding. In electrical performance, wobble welding reduced resistance to as low as 45 µΩ at a wobble amplitude of 1.2 mm, while line welding yielded higher and scattered values. These results should be interpreted as the combined outcome of the wobble-based seam strategy (beam oscillation together with overlapped stitch welding at a lower travel speed) under the present processing windows. A strictly matched A/B comparison at identical linear energy density and seam layout will be investigated in future work to isolate the effect of oscillation. Full article

In response to the challenge of achieving highly reliable interface fabrication in the fields of microelectronics and micro-electromechanical system (MEMS) packaging, this study harnesses the superior characteristics of solid-state bonding inherent in explosive welding (EXW) technology. This study investigates the precise EXW of milligram-scale metallic foils by employing focused laser energy to control the explosion behavior of liquid energetic materials, thereby generating shockwaves that induce high-velocity oblique collisions between metallic foils and base plates. Laser-focused energy was utilized to regulate energetic materials for conducting precision EXW experiments on Al/Cu couples. The technical feasibility and interfacial quality of this method for fabricating Al/Cu bonding interfaces were systematically evaluated through in situ observation of the dynamic welding process, comprehensive analysis of interfacial microstructures, and numerical simulations. The results reveal distinct Al/Cu elemental diffusion at the bonding interface, confirming the technical viability of the approach. However, an unloading rebound phenomenon is observed at the interface, which is inherently associated with the dynamic impact process, indicating the need for further optimization in the precise control of impact loading. Full article

In recent years, electrochemical pressure (ECP) sensors with self-powered and both dynamic and static pressure detection capabilities have received widespread attention. To improve pressure sensing performances while reducing the thickness of conventional sandwich structure ECP sensors, we propose an ECP sensor with a simple electrode coplanar structure. Specifically, it consists of Cu/Zn foil electrodes and LiCl/polyvinyl alcohol (PVA) modified filter paper. Among them, the Cu/Zn coplanar electrodes are used for redox reactions, the LiCl provides conductive ions, and the PVA is used to provide a humid environment to promote the ionization and conduction of LiCl. The rough surface microstructure of the filter paper is used to enhance the pressure sensing performances of the sensor. The results show that the ECP sensor with an electrode coplanar structure can spontaneously output current in the pressure range of 0.4–100 kPa, with sensitivities of 0.273 kPa⁻¹ (0.6–20 kPa) and 0.036 kPa⁻¹ (20–100 kPa). Specifically, compared to ECP sensors with a sandwich structure, it has a wider response range and higher sensitivity. Through the current response, morphological characterizations, and redox reactions, the pressure sensing mechanism is elucidated. Furthermore, the proposed ECP sensor can be used for respiratory state recognition combined with machine learning. This research provides a new approach for developing a high-performance ECP sensor with a simple electrode coplanar structure. Full article

The adoption of silicon-graphite composites as anode materials for the next generation of lithium-ion batteries with enhanced specific capacity requires complex technological efforts in order to mitigate the problem of the quick performance fading of electrodes due to the mechanical degradation of materials. The matter is currently being addressed in terms of electrolyte components, polymer binders, materials structure and morphology itself, as well as current collector design, which differ greatly in cost and scalability. The present work describes the efficacy of Cu foil perforation—a simple, low-cost, and easily scalable approach—as a means of Si/C composite anode performance stabilization during extensive charge-discharge cycling. The NMC||Si/C pouch-type full cells demonstrated over 90% of initial capacity retention after 100 charge-discharge cycles in the case of a 250 µm perforated Cu foil used as a current collector, compared to only 60% capacity left in the same conditions for plain Cu foil as an anode. The obtained result is related to the prevention of anode material delamination off the foil surface as a result of silicon expansion and contraction, which is achieved through the formation inter-penetrating metal-composite structure and the presence of “stitches”, connecting and holding both sides of the electrode tightly attached to the current collector. Full article

We report a galvanic replacement-driven strategy for the in situ growth of highly uniform one-dimensional (1D) Cu@CuO-X (X = Ag, Bi) nanobelts directly on aluminum foils. Unlike conventional multi-step coating or hard-template replication strategies, the formation of these heterostructured nanobelts is governed by a spontaneous interfacial galvanic replacement process between Cu and the introduced metal species, ensuring in situ growth and intimate interfacial integration. Comprehensive SEM, TEM, XRD, and XPS characterizations confirm the successful formation of Cu@CuO-Ag and Cu@CuO-Bi architectures, where Bi predominantly exists in the oxidized Bi³⁺ state, forming Bi₂O₃-like surface species. Benefiting from their 1D anisotropic framework and controllable heterointerfaces, this work underscores the distinctiveness and versatility of the self-templated galvanic replacement strategy for the design of multifunctional nanomaterials. Full article

This study systematically investigates the thickness-dependent mechanical properties of electroplated copper foils with fine-grained (FG-Cu) and columnar nanotwinned (NT-Cu) microstructures. Tensile testing across a thickness range of 5–30 μm revealed that NT-Cu exhibits superior mechanical stability, with significantly lower reductions in both ultimate tensile strength (UTS) and yield strength (YS) compared to FG-Cu. The UTS of the 30 μm thick FG-Cu foil was measured at 651 MPa, increasing to 792 MPa at a thickness of 5 μm. In contrast, the UTS of NT-Cu foils only rose from 624 MPa at 30 μm to 663 MPa at 5 μm. A similar trend was observed for the YS. Microstructural analysis confirmed that NT-Cu maintains a stable columnar grain structure with minimal grain growth, contributing to its resistance to thickness-induced strength loss. These findings highlight NT-Cu as a promising candidate for applications requiring consistent mechanical performance across varying foil thicknesses. Full article

Embedding flexible electronic circuits into a sustainable polymer is an emerging and significant topic in the field of in-mold electronics (IME). Ensuring strong adhesion between the flexible circuit and the molded polymer is critical for the durability of IME products. In this study, three different types of etched copper polyimide (PI) foils were used as the substrate of electronic components. Two bio-based and biodegradable polymers of polylactic acid (PLA) and polyhydroxybutyrate (PHB) served as the overmolding material. Four different surface pretreatments: drying, polydopamine (PDA) coating, PDA coating followed by thermal treatment under vacuum, oxygen plasma, and 3-aminopropyltriethoxysilane (APTES) were applied to the PI surface prior to the overmolding process to investigate the influence on the adhesive strength. Additionally, a thermoplastic polyurethane (TPU) adhesive layer was introduced via vacuum lamination to further improve adhesion. The main objective of this study was to evaluate the adhesive strength between etched PI and overmolded biopolymers before and after surface modifications. The loci of failure were analyzed using scanning electron microscopy (SEM). The results indicate that laminated TPU is the most effective approach for improving adhesion between polyimide foils and biopolymers. Full article