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Advances in Electrodeposition of Thin Films and Alloys

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 January 2026 | Viewed by 690

Special Issue Editors


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Guest Editor
Institute of Chemistry, Technology and Metallurgy, University of Belgrade, Njegoševa 12, 11000 Belgrade, Serbia
Interests: thin films; material characterization; electrodeposition; composite coatings; mechanical properties; microhardness; adhesion; wettability; optimization; modeling

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Guest Editor
Institute of Chemistry, Technology and Metallurgy, University of Belgrade, Njegoševa 12, 11000 Belgrade, Serbia
Interests: electrodeposition; morphology; structure; characterization; powders; thin films; coatings; hydrogen evolution; metal matrix composites
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Special Issue Information

Dear Colleagues,

Electrodeposition plays a crucial role in the production of thin films, alloys, and metal matrix composites (MMCs) and is a cost-effective and precise method for improving material properties. Some of its key applications include microtechnology and electronics, corrosion protection, energy storage and conversion, tribological applications, and wear-resistant coatings.

Materials of interest for this Special Issue include thin metal films, amorphous and nanocrystalline films, metal-based alloys, two-dimensional (2D) materials, transition metals and graphene, rare earth metal alloys, magnetic coatings, metal matrix composites (MMCs), hydride coatings, and laminates, as well as other types of materials that can be created by electrodeposition.

The optimization strategies that researchers and industry have focused on in recent years relate to the electrodeposition regime chosen, the optimization of electrodeposition parameters, the control of particle dispersion, post-treatments for films, etc. Statistical and mathematical techniques can also be used to optimize these processes. They help us understand the relationships between multiple input variables and their effects on the outcome, which is particularly useful for fine-tuning the deposition parameters used in MMC production.

The characterization of electrodeposited films is essential for understanding their structural, mechanical, electrical, optical, and functional properties. The characterization techniques most often used are XRD, SEM, AFM (structural and morphological analysis), EDS, XPS (chemical composition and elemental analysis), indentation tests, scratch tests, tribometry-wear tests, friction tests (mechanical and tribological properties), the four-point probe method (electrical properties), TGA, and DSC (thermal properties). The use of other techniques for the characterization of films is also welcome.

We look forward to receiving your contributions.

Dr. Ivana Mladenović
Dr. Nebojša Nikolić
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thin films
  • electrodeposition
  • morphology
  • mechanical properties
  • MEMS
  • optimization

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Published Papers (1 paper)

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Research

11 pages, 4227 KB  
Article
Electrochemical Urea Oxidation on Porous Ni and Ni–M (M = Ir, Pt) Electrodes Obtained via Molten-Salt Treatment Technique
by Dawid Kutyła, Michihisa Fukumoto, Hiroki Takahashi, Ryuu Takahashi, Katarzyna Skibińska and Piotr Żabiński
Materials 2025, 18(22), 5069; https://doi.org/10.3390/ma18225069 - 7 Nov 2025
Viewed by 483
Abstract
Porous Ni, Ni–Ir, and Ni–Pt electrodes were prepared on Ni substrates by molten-salt Al co-deposition followed by dealloying. SEM/EDS and XRD confirmed a Raney-type porous network with Ir or Pt present across the layer. A urea oxidation reaction (UOR) was tested in 1 [...] Read more.
Porous Ni, Ni–Ir, and Ni–Pt electrodes were prepared on Ni substrates by molten-salt Al co-deposition followed by dealloying. SEM/EDS and XRD confirmed a Raney-type porous network with Ir or Pt present across the layer. A urea oxidation reaction (UOR) was tested in 1 M NaOH + 0.33 M urea by cyclic voltammetry and chronoamperometry at +0.40 V vs. SCE (60 min). Smooth Ni showed near-zero current. Porous Ni resulted in ~11 mA cm−2 initially and ~9 mA cm−2 after 60 min. Porous Ni–Ir started at ~7 mA cm−2 and fell to ~2 mA cm−2 within 5 min, indicating fast deactivation, likely due to Ir-oxide formation that suppresses the Ni2+/Ni3+ redox couple. Porous Ni–Pt remained at ~11 mA cm−2 over 60 min, consistent with a stable Ni–Pt effect in which Pt aids urea adsorption/activation while Ni provides the redox path for oxidation. Overall, Pt improves UOR performance, whereas Ir lowers it under these conditions. Full article
(This article belongs to the Special Issue Advances in Electrodeposition of Thin Films and Alloys)
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