- Article
Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite
- Xiaoyang Wang,
- Pengtao Liu,
- Guanghui Zhao,
- Juan Li and
- Chenchen Zhi
The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s−1 was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the...