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13 pages, 6684 KiB

Open AccessArticle

The Development of the Differential MEMS Vector Hydrophone

by Guojun Zhang, Mengran Liu, Nixin Shen, Xubo Wang and Wendong Zhang

Sensors 2017, 17(6), 1332; https://doi.org/10.3390/s17061332 - 8 Jun 2017

Cited by 13 | Viewed by 7669

Abstract

To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and [...] Read more.

To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, M_v = −185 dB (@ 500 Hz, 0 dB reference 1 V/μPa), which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, M_v = −58 dB (0 dB reference 1 V/g), which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 3284 KiB

Open AccessArticle

Nonlinear-Based MEMS Sensors and Active Switches for Gas Detection

by Adam Bouchaala, Nizar Jaber, Omar Yassine, Osama Shekhah, Valeriya Chernikova, Mohamed Eddaoudi and Mohammad I. Younis

Sensors 2016, 16(6), 758; https://doi.org/10.3390/s16060758 - 25 May 2016

Cited by 51 | Viewed by 9353

Abstract

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of [...] Read more.

The objective of this paper is to demonstrate the integration of a MOF thin film on electrostatically actuated microstructures to realize a switch triggered by gas and a sensing algorithm based on amplitude tracking. The devices are based on the nonlinear response of micromachined clamped-clamped beams. The microbeams are coated with a metal-organic framework (MOF), namely HKUST-1, to achieve high sensitivity. The softening and hardening nonlinear behaviors of the microbeams are exploited to demonstrate the ideas. For gas sensing, an amplitude-based tracking algorithm is developed to quantify the captured quantity of gas. Then, a MEMS switch triggered by gas using the nonlinear response of the microbeam is demonstrated. Noise analysis is conducted, which shows that the switch has high stability against thermal noise. The proposed switch is promising for delivering binary sensing information, and also can be used directly to activate useful functionalities, such as alarming. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 6449 KiB

Open AccessArticle

Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer

by Xiaodan Miao, Xuhan Dai, Yi Huang, Guifu Ding and Xiaolin Zhao

Sensors 2016, 16(5), 634; https://doi.org/10.3390/s16050634 - 5 May 2016

Cited by 7 | Viewed by 6233

Abstract

This paper presents a bistable microswitch fully batch-fabricated on a single glass wafer, comprising of a microactuator, a signal transformer, a microspring and a permanent magnet. The bistable mechanism of the microswitch with large displacement of 160 μm depends on the balance of [...] Read more.

This paper presents a bistable microswitch fully batch-fabricated on a single glass wafer, comprising of a microactuator, a signal transformer, a microspring and a permanent magnet. The bistable mechanism of the microswitch with large displacement of 160 μm depends on the balance of the magnetic force and elastic force. Both the magnetic force and elastic force were optimized by finite-element simulation to predict the reliable of the device. The prototype was fabricated and characterized. By utilizing thick laminated photoresist sacrificial layer, the large displacement was obtained to ensure the insulation of the microswitch. The testing results show that the microswitch realized the bistable mechanism at a 3–5 V input voltage and closed in 0.96 ms, which verified the simulation. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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12 pages, 2793 KiB

Open AccessArticle

Top-Down CMOS-NEMS Polysilicon Nanowire with Piezoresistive Transduction

by Eloi Marigó, Marc Sansa, Francesc Pérez-Murano, Arantxa Uranga and Núria Barniol

Sensors 2015, 15(7), 17036-17047; https://doi.org/10.3390/s150717036 - 14 Jul 2015

Cited by 2 | Viewed by 5597

Abstract

A top-down clamped-clamped beam integrated in a CMOS technology with a cross section of 500 nm × 280 nm has been electrostatic actuated and sensed using two different transduction methods: capacitive and piezoresistive. The resonator made from a single polysilicon layer has a [...] Read more.

A top-down clamped-clamped beam integrated in a CMOS technology with a cross section of 500 nm × 280 nm has been electrostatic actuated and sensed using two different transduction methods: capacitive and piezoresistive. The resonator made from a single polysilicon layer has a fundamental in-plane resonance at 27 MHz. Piezoresistive transduction avoids the effect of the parasitic capacitance assessing the capability to use it and enhance the CMOS-NEMS resonators towards more efficient oscillator. The displacement derived from the capacitive transduction allows to compute the gauge factor for the polysilicon material available in the CMOS technology. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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26 pages, 4462 KiB

Open AccessArticle

Development of a Portable Non-Invasive Swallowing and Respiration Assessment Device

by Wann-Yun Shieh, Chin-Man Wang and Chia-Shuo Chang

Sensors 2015, 15(6), 12428-12453; https://doi.org/10.3390/s150612428 - 27 May 2015

Cited by 35 | Viewed by 8536

Abstract

Dysphagia is a condition that happens when a person cannot smoothly swallow food from the mouth to the stomach. It causes malnourishment in patients, or can even cause death due to aspiration pneumonia. Recently, more and more researchers have focused their attention on [...] Read more.

Dysphagia is a condition that happens when a person cannot smoothly swallow food from the mouth to the stomach. It causes malnourishment in patients, or can even cause death due to aspiration pneumonia. Recently, more and more researchers have focused their attention on the importance of swallowing and respiration coordination, and the use of non-invasive assessment systems has become a hot research trend. In this study, we aimed to integrate the timing and pattern monitoring of respiration and swallowing by using a portable and non-invasive approach which can be applied at the bedside in hospitals or institutions, or in a home environment. In this approach, we use a force sensing resistor (FSR) to detect the motions of the thyroid cartilage in the pharyngeal phase. We also use the surface electromyography (sEMG) to detect the contraction of the submental muscle in the oral phase, and a nasal cannula to detect nasal airflow for respiration monitoring during the swallowing process. All signals are received and processed for swallowing event recognition. A total of 19 volunteers participated in the testing and over 57 measurements were made. The results show that the proposed approach can effectively distinguish the swallowing function in people of different ages and genders. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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17 pages, 1818 KiB

Open AccessArticle

An Adaptive Compensation Algorithm for Temperature Drift of Micro-Electro-Mechanical Systems Gyroscopes Using a Strong Tracking Kalman Filter

by Yibo Feng, Xisheng Li and Xiaojuan Zhang

Sensors 2015, 15(5), 11222-11238; https://doi.org/10.3390/s150511222 - 13 May 2015

Cited by 26 | Viewed by 8307

Abstract

We present an adaptive algorithm for a system integrated with micro-electro-mechanical systems (MEMS) gyroscopes and a compass to eliminate the influence from the environment, compensate the temperature drift precisely, and improve the accuracy of the MEMS gyroscope. We use a simplified drift model [...] Read more.

We present an adaptive algorithm for a system integrated with micro-electro-mechanical systems (MEMS) gyroscopes and a compass to eliminate the influence from the environment, compensate the temperature drift precisely, and improve the accuracy of the MEMS gyroscope. We use a simplified drift model and changing but appropriate model parameters to implement this algorithm. The model of MEMS gyroscope temperature drift is constructed mostly on the basis of the temperature sensitivity of the gyroscope. As the state variables of a strong tracking Kalman filter (STKF), the parameters of the temperature drift model can be calculated to adapt to the environment under the support of the compass. These parameters change intelligently with the environment to maintain the precision of the MEMS gyroscope in the changing temperature. The heading error is less than 0.6° in the static temperature experiment, and also is kept in the range from 5° to −2° in the dynamic outdoor experiment. This demonstrates that the proposed algorithm exhibits strong adaptability to a changing temperature, and performs significantly better than KF and MLR to compensate the temperature drift of a gyroscope and eliminate the influence of temperature variation. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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12 pages, 3680 KiB

Open AccessArticle

A PDMS-Based 2-Axis Waterproof Scanner for Photoacoustic Microscopy

by Jin Young Kim, Changho Lee, Kyungjin Park, Geunbae Lim and Chulhong Kim

Sensors 2015, 15(5), 9815-9826; https://doi.org/10.3390/s150509815 - 27 Apr 2015

Cited by 36 | Viewed by 8497

Abstract

Optical-resolution photoacoustic microscopy (OR-PAM) is an imaging tool to provide in vivo optically sensitive images in biomedical research. To achieve a small size, fast imaging speed, wide scan range, and high signal-to-noise ratios (SNRs) in a water environment, we introduce a polydimethylsiloxane (PDMS)-based [...] Read more.

Optical-resolution photoacoustic microscopy (OR-PAM) is an imaging tool to provide in vivo optically sensitive images in biomedical research. To achieve a small size, fast imaging speed, wide scan range, and high signal-to-noise ratios (SNRs) in a water environment, we introduce a polydimethylsiloxane (PDMS)-based 2-axis scanner for a flexible and waterproof structure. The design, theoretical background, fabrication process and performance of the scanner are explained in details. The designed and fabricated scanner has dimensions of 15 × 15 × 15 mm along the X, Y and Z axes, respectively. The characteristics of the scanner are tested under DC and AC conditions. By pairing with electromagnetic forces, the maximum scanning angles in air and water are 18° and 13° along the X and Y axes, respectively. The measured resonance frequencies in air and water are 60 and 45 Hz along the X axis and 45 and 30 Hz along the Y axis, respectively. Finally, OR-PAM with high SNRs is demonstrated using the fabricated scanner, and the PA images of micro-patterned samples and microvasculatures of a mouse ear are successfully obtained with high-resolution and wide-field of view. OR-PAM equipped with the 2-axis PDMS based waterproof scanner has lateral and axial resolutions of 3.6 μm and 26 μm, respectively. This compact OR-PAM system could potentially and widely be used in preclinical and clinical applications. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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16 pages, 2967 KiB

Open AccessArticle

Heat Transfer and Friction Characteristics of the Microfluidic Heat Sink with Variously-Shaped Ribs for Chip Cooling

by Gui-Lian Wang, Da-Wei Yang, Yan Wang, Di Niu, Xiao-Lin Zhao and Gui-Fu Ding

Sensors 2015, 15(4), 9547-9562; https://doi.org/10.3390/s150409547 - 22 Apr 2015

Cited by 42 | Viewed by 10809

Abstract

This paper experimentally and numerically investigated the heat transfer and friction characteristics of microfluidic heat sinks with variously-shaped micro-ribs, i.e., rectangular, triangular and semicircular ribs. The micro-ribs were fabricated on the sidewalls of microfluidic channels by a surface-micromachining micro-electro-mechanical system (MEMS) process [...] Read more.

This paper experimentally and numerically investigated the heat transfer and friction characteristics of microfluidic heat sinks with variously-shaped micro-ribs, i.e., rectangular, triangular and semicircular ribs. The micro-ribs were fabricated on the sidewalls of microfluidic channels by a surface-micromachining micro-electro-mechanical system (MEMS) process and used as turbulators to improve the heat transfer rate of the microfluidic heat sink. The results indicate that the utilizing of micro-ribs provides a better heat transfer rate, but also increases the pressure drop penalty for microchannels. Furthermore, the heat transfer and friction characteristics of the microchannels are strongly affected by the rib shape. In comparison, the triangular ribbed microchannel possesses the highest Nusselt number and friction factor among the three rib types. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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24 pages, 999 KiB

Open AccessArticle

An Analytical Model for Squeeze-Film Damping of Perforated Torsional Microplates Resonators

by Pu Li and Yuming Fang

Sensors 2015, 15(4), 7388-7411; https://doi.org/10.3390/s150407388 - 25 Mar 2015

Cited by 17 | Viewed by 7249

Abstract

Squeeze-film damping plays a significant role in the performance of micro-resonators because it determines their quality factors. Perforations in microstructures are often used to control the squeeze-film damping in micro-resonators. To model the perforation effects on the squeeze-film damping, many analytical models have [...] Read more.

Squeeze-film damping plays a significant role in the performance of micro-resonators because it determines their quality factors. Perforations in microstructures are often used to control the squeeze-film damping in micro-resonators. To model the perforation effects on the squeeze-film damping, many analytical models have been proposed, however, most of the previous models have been concerned with the squeeze-film damping due to the normal motion between the perforated vibrating plate and a fixed substrate, while there is a lack of works that model the squeeze-film damping of perforated torsion microplates, which are also widely used in MEMS devices. This paper presents an analytical model for the squeeze-film damping of perforated torsion microplates. The derivation in this paper is based on a modified Reynolds equation that includes compressibility and rarefaction effects. The pressure distribution under the vibrating plate is obtained using the double sine series. Closed-form expressions for the stiffness and the damping coefficients of the squeeze-film are derived. The accuracy of the model is verified by comparing its results with the finite element method (FEM) results and the experimental results available in the literature. The regime of validity and limitations of the present model are assessed. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 2222 KiB

Open AccessArticle

A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

by Adel Merdassi, Peng Yang and Vamsy P. Chodavarapu

Sensors 2015, 15(4), 7349-7359; https://doi.org/10.3390/s150407349 - 25 Mar 2015

Cited by 19 | Viewed by 9090

Abstract

We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at [...] Read more.

We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at 10 milliTorr which provides a high Quality factor and reduces noise interference on the MEMS sensor devices. The MIDIS process is based on high aspect ratio bulk micromachining of single-crystal silicon layer that is vacuum encapsulated between two other silicon handle wafers. The process includes sealed Through Silicon Vias (TSVs) for compact design and flip-chip integration with signal processing circuits. The proposed accelerometer design is sensitive to single-axis in-plane acceleration and uses a differential capacitance measurement. Over ±1 g measurement range, the measured sensitivity was 1fF/g. The accelerometer system was designed to provide a detection resolution of 33 milli-g over the operational range of ±100 g. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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24 pages, 6395 KiB

Open AccessArticle

Improving the Precision and Speed of Euler Angles Computation from Low-Cost Rotation Sensor Data

by Aleš Janota, Vojtech Šimák, Dušan Nemec and Jozef Hrbček

Sensors 2015, 15(3), 7016-7039; https://doi.org/10.3390/s150307016 - 23 Mar 2015

Cited by 62 | Viewed by 16291

Abstract

This article compares three different algorithms used to compute Euler angles from data obtained by the angular rate sensor (e.g., MEMS gyroscope)—the algorithms based on a rotational matrix, on transforming angular velocity to time derivations of the Euler angles and on unit quaternion [...] Read more.

This article compares three different algorithms used to compute Euler angles from data obtained by the angular rate sensor (e.g., MEMS gyroscope)—the algorithms based on a rotational matrix, on transforming angular velocity to time derivations of the Euler angles and on unit quaternion expressing rotation. Algorithms are compared by their computational efficiency and accuracy of Euler angles estimation. If attitude of the object is computed only from data obtained by the gyroscope, the quaternion-based algorithm seems to be most suitable (having similar accuracy as the matrix-based algorithm, but taking approx. 30% less clock cycles on the 8-bit microcomputer). Integration of the Euler angles’ time derivations has a singularity, therefore is not accurate at full range of object’s attitude. Since the error in every real gyroscope system tends to increase with time due to its offset and thermal drift, we also propose some measures based on compensation by additional sensors (a magnetic compass and accelerometer). Vector data of mentioned secondary sensors has to be transformed into the inertial frame of reference. While transformation of the vector by the matrix is slightly faster than doing the same by quaternion, the compensated sensor system utilizing a matrix-based algorithm can be approximately 10% faster than the system utilizing quaternions (depending on implementation and hardware). Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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10 pages, 1427 KiB

Open AccessArticle

A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

by Junjie Wu, Lihua Lei, Xin Chen, Xiaoyu Cai, Yuan Li and Tao Han

Sensors 2014, 14(11), 20533-20542; https://doi.org/10.3390/s141120533 - 30 Oct 2014

Cited by 4 | Viewed by 6104

Abstract

For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it was validated using the finite element method. A [...] Read more.

For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it was validated using the finite element method. A precise data acquisition circuit with an accuracy of 20 μV was designed to obtain weak voltage signals. By calibration, the sensing system was shown to have a sensitivity of 17.29 mV/μm and 4.59 mV/μm in the axial and lateral directions, respectively; the nonlinearity in these directions was 0.8% and 1.0% full scale, respectively. A full range of 4.6 μm was achieved in the axial direction. Results of a resolution test indicated that the sensing system had a resolution of 5 nm in the axial direction and 10 nm in the lateral direction. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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10 pages, 1395 KiB

Open AccessCommunication

Multifrequency Excitation Method for Rapid and Accurate Dynamic Test of Micromachined Gyroscope Chips

by Yan Deng, Bin Zhou, Chao Xing and Rong Zhang

Sensors 2014, 14(10), 19507-19516; https://doi.org/10.3390/s141019507 - 17 Oct 2014

Cited by 7 | Viewed by 5944

Abstract

A novel multifrequency excitation (MFE) method is proposed to realize rapid and accurate dynamic testing of micromachined gyroscope chips. Compared with the traditional sweep-frequency excitation (SFE) method, the computational time for testing one chip under four modes at a 1-Hz frequency resolution and [...] Read more.

A novel multifrequency excitation (MFE) method is proposed to realize rapid and accurate dynamic testing of micromachined gyroscope chips. Compared with the traditional sweep-frequency excitation (SFE) method, the computational time for testing one chip under four modes at a 1-Hz frequency resolution and 600-Hz bandwidth was dramatically reduced from 10 min to 6 s. A multifrequency signal with an equal amplitude and initial linear-phase-difference distribution was generated to ensure test repeatability and accuracy. The current test system based on LabVIEW using the SFE method was modified to use the MFE method without any hardware changes. The experimental results verified that the MFE method can be an ideal solution for large-scale dynamic testing of gyroscope chips and gyroscopes. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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21 pages, 1459 KiB

Open AccessArticle

Attitude Heading Reference System Using MEMS Inertial Sensors with Dual-Axis Rotation

by Li Kang, Lingyun Ye, Kaichen Song and Yang Zhou

Sensors 2014, 14(10), 18075-18095; https://doi.org/10.3390/s141018075 - 29 Sep 2014

Cited by 27 | Viewed by 8708

Abstract

This paper proposes a low cost and small size attitude and heading reference system based on MEMS inertial sensors. A dual-axis rotation structure with a proper rotary scheme according to the design principles is applied in the system to compensate for the attitude [...] Read more.

This paper proposes a low cost and small size attitude and heading reference system based on MEMS inertial sensors. A dual-axis rotation structure with a proper rotary scheme according to the design principles is applied in the system to compensate for the attitude and heading drift caused by the large gyroscope biases. An optimization algorithm is applied to compensate for the installation angle error between the body frame and the rotation table’s frame. Simulations and experiments are carried out to evaluate the performance of the AHRS. The results show that the proper rotation could significantly reduce the attitude and heading drifts. Moreover, the new AHRS is not affected by magnetic interference. After the rotation, the attitude and heading are almost just oscillating in a range. The attitude error is about 3° and the heading error is less than 3° which are at least 5 times better than the non-rotation condition. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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19 pages, 524 KiB

Open AccessArticle

A Finite Element Model of a MEMS-based Surface Acoustic Wave Hydrogen Sensor

by Mohamed M. EL Gowini and Walied A. Moussa

Sensors 2010, 10(2), 1232-1250; https://doi.org/10.3390/s100201232 - 2 Feb 2010

Cited by 54 | Viewed by 15321

Abstract

Hydrogen plays a significant role in various industrial applications, but careful handling and continuous monitoring are crucial since it is explosive when mixed with air. Surface Acoustic Wave (SAW) sensors provide desirable characteristics for hydrogen detection due to their small size, low fabrication [...] Read more.

Hydrogen plays a significant role in various industrial applications, but careful handling and continuous monitoring are crucial since it is explosive when mixed with air. Surface Acoustic Wave (SAW) sensors provide desirable characteristics for hydrogen detection due to their small size, low fabrication cost, ease of integration and high sensitivity. In this paper a finite element model of a Surface Acoustic Wave sensor is developed using ANSYS12© and tested for hydrogen detection. The sensor consists of a YZ-lithium niobate substrate with interdigital electrodes (IDT) patterned on the surface. A thin palladium (Pd) film is added on the surface of the sensor due to its high affinity for hydrogen. With increased hydrogen absorption the palladium hydride structure undergoes a phase change due to the formation of the β-phase, which deteriorates the crystal structure. Therefore with increasing hydrogen concentration the stiffness and the density are significantly reduced. The values of the modulus of elasticity and the density at different hydrogen concentrations in palladium are utilized in the finite element model to determine the corresponding SAW sensor response. Results indicate that with increasing the hydrogen concentration the wave velocity decreases and the attenuation of the wave is reduced. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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Graphical abstract

20 pages, 650 KiB

Open AccessArticle

A Reduced Three Dimensional Model for SAW Sensors Using Finite Element Analysis

by Mohamed M. El Gowini and Walied A. Moussa

Sensors 2009, 9(12), 9945-9964; https://doi.org/10.3390/s91209945 - 8 Dec 2009

Cited by 17 | Viewed by 12992

Abstract

A major problem that often arises in modeling Micro Electro Mechanical Systems (MEMS) such as Surface Acoustic Wave (SAW) sensors using Finite Element Analysis (FEA) is the extensive computational capacity required. In this study a new approach is adopted to significantly reduce the [...] Read more.

A major problem that often arises in modeling Micro Electro Mechanical Systems (MEMS) such as Surface Acoustic Wave (SAW) sensors using Finite Element Analysis (FEA) is the extensive computational capacity required. In this study a new approach is adopted to significantly reduce the computational capacity needed for analyzing the response of a SAW sensor using the finite element (FE) method. The approach is based on the plane wave solution where the properties of the wave vary in two dimensions and are uniform along the thickness of the device. The plane wave solution therefore allows the thickness of the SAW device model to be minimized; the model is referred to as a Reduced 3D Model (R3D). Various configurations of this novel R3D model are developed and compared with theoretical and experimental frequency data and the results show very good agreement. In addition, two-dimensional (2D) models with similar configurations to the R3D are developed for comparison since the 2D approach is widely adopted in the literature as a computationally inexpensive approach to model SAW sensors using the FE method. Results illustrate that the R3D model is capable of capturing the SAW response more accurately than the 2D model; this is demonstrated by comparison of centre frequency and insertion loss values. These results are very encouraging and indicate that the R3D model is capable of capturing the MEMS-based SAW sensor response without being computationally expensive. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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15 pages, 1192 KiB

Open AccessArticle

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

by Azrul Azlan Hamzah, Jumril Yunas, Burhanuddin Yeop Majlis and Ibrahim Ahmad

Sensors 2008, 8(11), 7438-7452; https://doi.org/10.3390/s8117438 - 19 Nov 2008

Cited by 25 | Viewed by 13817

Abstract

This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer [...] Read more.

This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer level after fabrication. A MEMSTech 50g capacitive accelerometer was used to demonstrate a sputtered encapsulation technique. Encapsulation with a very uniform surface profile was achieved using spin-on glass (SOG) as a sacrificial layer, SU-8 as base layer, RF sputtered silicon as main structural layer, eutectic gold-silicon as seal layer, and liquid crystal polymer (LCP) as outer encapsulant layer. SEM inspection and capacitance test indicated that the movable elements were released after encapsulation. Nanoindentation test confirmed that the encapsulated device is sufficiently robust to withstand a transfer molding process. Thus, an encapsulation technique that is robust, CMOS compatible, and economical has been successfully developed for packaging isolatable MEMS devices at the wafer level. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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10 pages, 551 KiB

Open AccessArticle

Nano-Scale Characterization of a Piezoelectric Polymer (Polyvinylidene Difluoride, PVDF)

by Hyungoo Lee, Rodrigo Cooper, Ke Wang and Hong Liang

Sensors 2008, 8(11), 7359-7368; https://doi.org/10.3390/s8117359 - 18 Nov 2008

Cited by 26 | Viewed by 12797

Abstract

The polymer polyvinylidene difluoride (PVDF) has unique piezoelectric properties favorable for Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) applications. In the present research, we conducted nanometer-length scale characterization of this material using several high-resolution techniques. Specifically, we used an atomic force microscope (AFM) [...] Read more.

The polymer polyvinylidene difluoride (PVDF) has unique piezoelectric properties favorable for Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) applications. In the present research, we conducted nanometer-length scale characterization of this material using several high-resolution techniques. Specifically, we used an atomic force microscope (AFM) to study the nanoand microstructures of the PVDF under stress and to measure their nanoscale conductivity and piezoelectricity. We found that the surface morphology, electronic structure, and microstructure are profoundly affected under electrical potential. Such a behavior is important for the properties and performance of MEMS and NEMS. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 574 KiB

Open AccessArticle

Dynamic Characteristics of Vertically Coupled Structures and the Design of a Decoupled Micro Gyroscope

by Bumkyoo Choi, Seung-Yop Lee, Taekhyun Kim and Seog Soon Baek

Sensors 2008, 8(6), 3706-3718; https://doi.org/10.3390/s8063706 - 3 Jun 2008

Cited by 13 | Viewed by 11122

Abstract

In a vertical type, vibratory gyroscope, the coupled motion between reference (driving) and sensing vibrations causes the zero-point output, which is the unwanted sensing vibration without angular velocity. This structural coupling leads to an inherent discrepancy between the natural frequencies of the reference [...] Read more.

In a vertical type, vibratory gyroscope, the coupled motion between reference (driving) and sensing vibrations causes the zero-point output, which is the unwanted sensing vibration without angular velocity. This structural coupling leads to an inherent discrepancy between the natural frequencies of the reference and the sensing oscillations, causing curve veering in frequency loci. The coupled motion deteriorates sensing performance and dynamic stability. In this paper, the dynamic characteristics associated with the coupling phenomenon are theoretically analyzed. The effects of reference frequency and coupling factor on the rotational direction and amplitude of elliptic oscillation are determined. Based on the analytical studies on the coupling effects, we propose and fabricate a vertically decoupled vibratory gyroscope with the frequency matching. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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22 pages, 303 KiB

Open AccessArticle

Error and Performance Analysis of MEMS-based Inertial Sensors with a Low-cost GPS Receiver

by Minha Park and Yang Gao

Sensors 2008, 8(4), 2240-2261; https://doi.org/10.3390/s8042240 - 29 Mar 2008

Cited by 97 | Viewed by 16463

Abstract

Global Navigation Satellite Systems (GNSS), such as the Global Positioning System (GPS), have been widely utilized and their applications are becoming popular, not only in military or commercial applications, but also for everyday life. Although GPS measurements are the essential information for currently [...] Read more.

Global Navigation Satellite Systems (GNSS), such as the Global Positioning System (GPS), have been widely utilized and their applications are becoming popular, not only in military or commercial applications, but also for everyday life. Although GPS measurements are the essential information for currently developed land vehicle navigation systems (LVNS), GPS signals are often unavailable or unreliable due to signal blockages under certain environments such as urban canyons. This situation must be compensated in order to provide continuous navigation solutions. To overcome the problems of unavailability and unreliability using GPS and to be cost and size effective as well, Micro Electro Mechanical Systems (MEMS) based inertial sensor technology has been pushing for the development of low-cost integrated navigation systems for land vehicle navigation and guidance applications. This paper will analyze the characterization of MEMS based inertial sensors and the performance of an integrated system prototype of MEMS based inertial sensors, a low-cost GPS receiver and a digital compass. The influence of the stochastic variation of sensors will be assessed and modeled by two different methods, namely Gauss-Markov (GM) and AutoRegressive (AR) models, with GPS signal blockage of different lengths. Numerical results from kinematic testing have been used to assess the performance of different modeling schemes. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 592 KiB

Open AccessArticle

Three-Dimensional Transport Modeling for Proton Exchange Membrane(PEM) Fuel Cell with Micro Parallel Flow Field

by Pil Hyong Lee, Sang Seok Han and Sang Soon Hwang

Sensors 2008, 8(3), 1475-1487; https://doi.org/10.3390/s8031475 - 3 Mar 2008

Cited by 7 | Viewed by 12565

Abstract

Modeling and simulation for heat and mass transport in micro channel are beingused extensively in researches and industrial applications to gain better understanding of thefundamental processes and to optimize fuel cell designs before building a prototype forengineering application. In this study, we used [...] Read more.

Modeling and simulation for heat and mass transport in micro channel are beingused extensively in researches and industrial applications to gain better understanding of thefundamental processes and to optimize fuel cell designs before building a prototype forengineering application. In this study, we used a single-phase, fully three dimensionalsimulation model for PEMFC that can deal with both anode and cathode flow field forexamining the micro flow channel with electrochemical reaction. The results show thathydrogen and oxygen were solely supplied to the membrane by diffusion mechanism ratherthan convection transport, and the higher pressure drop at cathode side is thought to becaused by higher flow rate of oxygen at cathode. And it is found that the amount of water incathode channel was determined by water formation due to electrochemical reaction pluselectro-osmotic mass flux directing toward the cathode side. And it is very important tomodel the back diffusion and electro-osmotic mass flux accurately since the two flux wasclosely correlated each other and greatly influenced for determination of ionic conductivityof the membrane which directly affects the performance of fuel cell. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 6644 KiB

Open AccessArticle

Fabrication of Biochips with Micro Fluidic Channels by Micro End-milling and Powder Blasting

by Dae Jin Yun, Tae Il Seo and Dong Sam Park

Sensors 2008, 8(2), 1308-1320; https://doi.org/10.3390/s8021308 - 22 Feb 2008

Cited by 22 | Viewed by 11311

Abstract

For microfabrications of biochips with micro fluidic channels, a large number of microfabrication techniques based on silicon or glass-based Micro-Electro-Mechanical System (MEMS) technologies were proposed in the last decade. In recent years, for low cost and mass production, polymer-based microfabrication techniques by microinjection [...] Read more.

For microfabrications of biochips with micro fluidic channels, a large number of microfabrication techniques based on silicon or glass-based Micro-Electro-Mechanical System (MEMS) technologies were proposed in the last decade. In recent years, for low cost and mass production, polymer-based microfabrication techniques by microinjection molding and micro hot embossing have been proposed. These techniques, which require a proper photoresist, mask, UV light exposure, developing, and electroplating as a preprocess, are considered to have some problems. In this study, we propose a new microfabrication technology which consists of micro end-milling and powder blasting. This technique could be directly applied to fabricate the metal mold without any preprocesses. The metal mold with micro-channels is machined by micro end-milling, and then, burrs generated in the end-milling process are removed by powder blasting. From the experimental results, micro end-milling combined with powder blasting could be applied effectively for fabrication of the injection mold of biochips with micro fluidic channels. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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10 pages, 1247 KiB

Open AccessArticle

A Perturbation Method for the 3D Finite Element Modeling of Electrostatically Driven MEMS

by Mohamed Boutaayamou, Ruth V. Sabariego and Patrick Dular

Sensors 2008, 8(2), 994-1003; https://doi.org/10.3390/s8020994 - 19 Feb 2008

Cited by 1 | Viewed by 11267

Abstract

In this paper, a finite element (FE) procedure for modeling electrostatically actu-ated MEMS is presented. It concerns a perturbation method for computing electrostatic fielddistortions due to moving conductors. The computation is split in two steps. First, an un-perturbed problem (in the absence of [...] Read more.

In this paper, a finite element (FE) procedure for modeling electrostatically actu-ated MEMS is presented. It concerns a perturbation method for computing electrostatic fielddistortions due to moving conductors. The computation is split in two steps. First, an un-perturbed problem (in the absence of certain conductors) is solved with the conventional FEmethod in the complete domain. Second, a perturbation problem is solved in a reduced re-gion with an additional conductor using the solution of the unperturbed problem as a source.When the perturbing region is close to the original source field, an iterative computation maybe required. The developed procedure offers the advantage of solving sub-problems in re-duced domains and consequently of benefiting from different problem-adapted meshes. Thisapproach allows for computational efficiency by decreasing the size of the problem. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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22 pages, 1400 KiB

Open AccessArticle

Effects of van der Waals Force and Thermal Stresses on Pull-in Instability of Clamped Rectangular Microplates

by Romesh C. Batra, Maurizio Porfiri and Davide Spinello

Sensors 2008, 8(2), 1048-1069; https://doi.org/10.3390/s8021048 - 15 Feb 2008

Cited by 101 | Viewed by 12389

Abstract

We study the influence of von Karman nonlinearity, van der Waals force, and a athermal stresses on pull-in instability and small vibrations of electrostatically actuated mi-croplates. We use the Galerkin method to develop a tractable reduced-order model for elec-trostatically actuated clamped rectangular microplates [...] Read more.

We study the influence of von Karman nonlinearity, van der Waals force, and a athermal stresses on pull-in instability and small vibrations of electrostatically actuated mi-croplates. We use the Galerkin method to develop a tractable reduced-order model for elec-trostatically actuated clamped rectangular microplates in the presence of van der Waals forcesand thermal stresses. More specifically, we reduce the governing two-dimensional nonlineartransient boundary-value problem to a single nonlinear ordinary differential equation. For thestatic problem, the pull-in voltage and the pull-in displacement are determined by solving apair of nonlinear algebraic equations. The fundamental vibration frequency corresponding toa deflected configuration of the microplate is determined by solving a linear algebraic equa-tion. The proposed reduced-order model allows for accurately estimating the combined effectsof van der Waals force and thermal stresses on the pull-in voltage and the pull-in deflectionprofile with an extremely limited computational effort. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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9 pages, 1527 KiB

Open AccessArticle

Micro Dot Patterning on the Light Guide Panel Using Powder Blasting

by Ho Su Jang, Myeong Woo Cho and Dong Sam Park

Sensors 2008, 8(2), 877-885; https://doi.org/10.3390/s8020877 - 8 Feb 2008

Cited by 11 | Viewed by 11523

Abstract

This study is to develop a micromachining technology for a light guidepanel(LGP) mold, whereby micro dot patterns are formed on a LGP surface by a singleinjection process instead of existing screen printing processes. The micro powder blastingtechnique is applied to form micro dot [...] Read more.

This study is to develop a micromachining technology for a light guidepanel(LGP) mold, whereby micro dot patterns are formed on a LGP surface by a singleinjection process instead of existing screen printing processes. The micro powder blastingtechnique is applied to form micro dot patterns on the LGP mold surface. The optimalconditions for masking, laminating, exposure, and developing processes to form the microdot patterns are first experimentally investigated. A LGP mold with masked micro patternsis then machined using the micro powder blasting method and the machinability of themicro dot patterns is verified. A prototype LGP is test- injected using the developed LGPmold and a shape analysis of the patterns and performance testing of the injected LGP arecarried out. As an additional approach, matte finishing, a special surface treatment method,is applied to the mold surface to improve the light diffusion characteristics, uniformity andbrightness of the LGP. The results of this study show that the applied powder blastingmethod can be successfully used to manufacture LGPs with micro patterns by just singleinjection using the developed mold and thereby replace existing screen printing methods. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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16 pages, 599 KiB

Open AccessArticle

Suitability of MEMS Accelerometers for Condition Monitoring: An experimental study

by Alhussein Albarbar, Samir Mekid, Andrew Starr and Robert Pietruszkiewicz

Sensors 2008, 8(2), 784-799; https://doi.org/10.3390/s8020784 - 6 Feb 2008

Cited by 137 | Viewed by 19635

Abstract

With increasing demands for wireless sensing nodes for assets control and condition monitoring; needs for alternatives to expensive conventional accelerometers in vibration measurements have been arisen. Micro-Electro Mechanical Systems (MEMS) accelerometer is one of the available options. The performances of three of the [...] Read more.

With increasing demands for wireless sensing nodes for assets control and condition monitoring; needs for alternatives to expensive conventional accelerometers in vibration measurements have been arisen. Micro-Electro Mechanical Systems (MEMS) accelerometer is one of the available options. The performances of three of the MEMS accelerometers from different manufacturers are investigated in this paper and compared to a well calibrated commercial accelerometer used as a reference for MEMS sensors performance evaluation. Tests were performed on a real CNC machine in a typical industrial environmental workshop and the achieved results are presented. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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17 pages, 638 KiB

Open AccessArticle

Experimental-Numerical Comparison of the Cantilever MEMS Frequency Shift in presence of a Residual Stress Gradient

by Alberto Ballestra, Aurelio Somà and Renato Pavanello

Sensors 2008, 8(2), 767-783; https://doi.org/10.3390/s8020767 - 6 Feb 2008

Cited by 22 | Viewed by 11902

Abstract

The dynamic characterization of a set of gold micro beams by electrostatic excitation in presence of residual stress gradient has been studied experimentally. A method to determine the micro-cantilever residual stress gradient by measuring the deflection and curvature and then identifying the residual [...] Read more.

The dynamic characterization of a set of gold micro beams by electrostatic excitation in presence of residual stress gradient has been studied experimentally. A method to determine the micro-cantilever residual stress gradient by measuring the deflection and curvature and then identifying the residual stress model by means of frequency shift behaviour is presented. A comparison with different numerical FEM models and experimental results has been carried out, introducing in the model the residual stress of the structures, responsible for an initial upward curvature. Dynamic spectrum data are measured via optical interferometry and experimental frequency shift curves are obtained by increasing the dc voltage applied to the specimens. A good correspondence is pointed out between measures and numerical models so that the residual stress effect can be evaluated for different configurations. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 4962 KiB

Open AccessArticle

Micro Fluidic Channel Machining on Fused Silica Glass Using Powder Blasting

by Ho-Su Jang, Myeong-Woo Cho and Dong-Sam Park

Sensors 2008, 8(2), 700-710; https://doi.org/10.3390/s8020700 - 6 Feb 2008

Cited by 29 | Viewed by 12224

Abstract

In this study, micro fluid channels are machined on fused silica glass via powder blasting, a mechanical etching process, and the machining characteristics of the channels are experimentally evaluated. In the process, material removal is performed by the collision of micro abrasives injected [...] Read more.

In this study, micro fluid channels are machined on fused silica glass via powder blasting, a mechanical etching process, and the machining characteristics of the channels are experimentally evaluated. In the process, material removal is performed by the collision of micro abrasives injected by highly compressed air on to the target surface. This approach can be characterized as an integration of brittle mode machining based on micro crack propagation. Fused silica glass, a high purity synthetic amorphous silicon dioxide, is selected as a workpiece material. It has a very low thermal expansion coefficient and excellent optical qualities and exceptional transmittance over a wide spectral range, especially in the ultraviolet range. The powder blasting process parameters affecting the machined results are injection pressure, abrasive particle size and density, stand-off distance, number of nozzle scanning, and shape/size of the required patterns. In this study, the influence of the number of nozzle scanning, abrasive particle size, and pattern size on the formation of micro channels is investigated. Machined shapes and surface roughness are measured using a 3-dimensional vision profiler and the results are discussed. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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14 pages, 2930 KiB

Open AccessArticle

Experimental Study on the Effects of Alumina Abrasive Particle Behavior in MR Polishing for MEMS Applications

by Dong-Woo Kim, Myeong-Woo Cho, Tae-Il Seo and Young-Jae Shin

Sensors 2008, 8(1), 222-235; https://doi.org/10.3390/s8010222 - 21 Jan 2008

Cited by 24 | Viewed by 12985

Abstract

Recently, the magnetorheological (MR) polishing process has been examined asa new ultra-precision polishing technology for micro parts in MEMS applications. In theMR polishing process, the magnetic force plays a dominant role. This method uses MRfluids which contains micro abrasives as a polishing media. [...] Read more.

Recently, the magnetorheological (MR) polishing process has been examined asa new ultra-precision polishing technology for micro parts in MEMS applications. In theMR polishing process, the magnetic force plays a dominant role. This method uses MRfluids which contains micro abrasives as a polishing media. The objective of the presentresearch is to shed light onto the material removal mechanism under various slurryconditions for polishing and to investigate surface characteristics, including shape analysisand surface roughness measurement, of spots obtained from the MR polishing process usingalumina abrasives. A series of basic experiments were first performed to determine theoptimum polishing conditions for BK7 glass using prepared slurries by changing the processparameters, such as wheel rotating speed and electric current. Using the obtained results,groove polishing was then performed and the results are investigated. Outstanding surfaceroughness of Ra=3.8nm was obtained on the BK7 glass specimen. The present resultshighlight the possibility of applying this polishing method to ultra-precision micro partsproduction, especially in MEMS applications. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 839 KiB

Open AccessArticle

Application of Design of Experiment Method for Thrust Force Minimization in Step-feed Micro Drilling

by Dong-Woo Kim, Myeong-Woo Cho, Tae-il Seo and Eung-Sug Lee

Sensors 2008, 8(1), 211-221; https://doi.org/10.3390/s8010211 - 21 Jan 2008

Cited by 25 | Viewed by 14087

Abstract

Micro drilled holes are utilized in many of today’s fabrication processes.Precision production processes in industries are trending toward the use of smaller holeswith higher aspect ratios, and higher speed operation for micro deep hole drilling. However,undesirable characteristics related to micro drilling such as [...] Read more.

Micro drilled holes are utilized in many of today’s fabrication processes.Precision production processes in industries are trending toward the use of smaller holeswith higher aspect ratios, and higher speed operation for micro deep hole drilling. However,undesirable characteristics related to micro drilling such as small signal-to-noise ratios,wandering drill motion, high aspect ratio, and excessive cutting forces can be observedwhen cutting depth increases. In this study, the authors attempt to minimize the thrustforces in the step-feed micro drilling process by application of the DOE (Design ofExperiment) method. Taking into account the drilling thrust, three cutting parameters,feedrate, step-feed, and cutting speed, are optimized based on the DOE method. Forexperimental studies, an orthogonal array L₂₇(3¹³) is generated and ANOVA (Analysis ofVariance) is carried out. Based on the results it is determined that the sequence of factorsaffecting drilling thrusts corresponds to feedrate, step-feed, and spindle rpm. Acombination of optimal drilling conditions is also identified. In particular, it is found in thisstudy that the feedrate is the most important factor for micro drilling thrust minimization. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 362 KiB

Open AccessCommunication

Three Cavity Tunable MEMS Fabry Perot Interferometer

by Avinash Parashar, Ankur Shah, Muthukumaran Packirisamy and Narayanswamy Sivakumar

Sensors 2007, 7(12), 3071-3083; https://doi.org/10.3390/s7123071 - 4 Dec 2007

Cited by 6 | Viewed by 9704

Abstract

In this paper a four-mirror tunable micro electro-mechanical systems (MEMS)Fabry Perot Interferometer (FPI) concept is proposed with the mathematical model. Thespectral range of the proposed FPI lies in the infrared spectrum ranging from 2400 to 4018(nm). FPI can be finely tuned by deflecting [...] Read more.

In this paper a four-mirror tunable micro electro-mechanical systems (MEMS)Fabry Perot Interferometer (FPI) concept is proposed with the mathematical model. Thespectral range of the proposed FPI lies in the infrared spectrum ranging from 2400 to 4018(nm). FPI can be finely tuned by deflecting the two middle mirrors (or by changing the threecavity lengths). Two different cases were separately considered for the tuning. In case one,tuning was achieved by deflecting mirror 2 only and in case two, both mirrors 2 and 3 weredeflected for the tuning of the FPI. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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15 pages, 324 KiB

Open AccessArticle

Influence of Damping on the Dynamical Behavior of the Electrostatic Parallel-plate and Torsional Actuators with Intermolecular Forces

by Wen-Hui Lin and Ya-Pu Zhao

Sensors 2007, 7(12), 3012-3026; https://doi.org/10.3390/s7123012 - 29 Nov 2007

Cited by 30 | Viewed by 10303

Abstract

The influence of damping on the dynamical behavior of the electrostaticparallel-plate and torsional actuators with the van der Waals (vdW) or Casimir force(torque) is presented. The values of the pull-in parameters and the number of theequilibrium points do not change whether there is [...] Read more.

The influence of damping on the dynamical behavior of the electrostaticparallel-plate and torsional actuators with the van der Waals (vdW) or Casimir force(torque) is presented. The values of the pull-in parameters and the number of theequilibrium points do not change whether there is damping or not. The ability ofequilibrium points is varied with the appearance of damping. One equilibrium point is anunstable saddle with a different damping coefficient, the other equilibrium point is astable node when the damping coefficient is greater than some critical value, andotherwise it is a stable focus. Then there are two heteroclinic orbits passing from theunstable saddle point to the stable node or focus. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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15 pages, 466 KiB

Open AccessArticle

Effect of Electrical Contact on the Contact Residual Stress of a Microrelay Switch

by Yung-Chuan Chen, Hsun-Heng Tsai, Wei-Hua Lu and Li-Wen Chen

Sensors 2007, 7(11), 2997-3011; https://doi.org/10.3390/s7112997 - 26 Nov 2007

Cited by 2 | Viewed by 11118

Abstract

This paper investigates the effect of electrical contact on the thermal contactstress of a microrelay switch. A three-dimensional elastic-plastic finite element model withcontact elements is used to simulate the contact behavior between the microcantilever beamand the electrode. A model with thermal-electrical coupling and [...] Read more.

This paper investigates the effect of electrical contact on the thermal contactstress of a microrelay switch. A three-dimensional elastic-plastic finite element model withcontact elements is used to simulate the contact behavior between the microcantilever beamand the electrode. A model with thermal-electrical coupling and thermal-stress coupling isused in the finite element analysis. The effects of contact gap, plating film thickness andnumber of switching cycles on the contact residual stress, contact force, plastic deformation,and temperature rise of the microrelay switch are explored. The numerical results indicatethat the residual stress increases with increasing contact gap or decreasing plating filmthickness. The results also show that the residual stress increases as the number of switchingcycles increases. A large residual stress inside the microcantilever beam can decrease thelifecycle of the microrelay. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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14 pages, 602 KiB

Open AccessArticle

Quantitative Accelerated Life Testing of MEMS Accelerometers

by Marius Bâzu, Lucian Gălăţeanu, Virgil Emil Ilian, Jerome Loicq, Serge Habraken and Jean-Paul Collette

Sensors 2007, 7(11), 2846-2859; https://doi.org/10.3390/s7112846 - 20 Nov 2007

Cited by 23 | Viewed by 13883

Abstract

Quantitative Accelerated Life Testing (QALT) is a solution for assessing thereliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shownin this paper and an attempt to assess the reliability level for a batch of MEMSaccelerometers is reported. The testing plan [...] Read more.

Quantitative Accelerated Life Testing (QALT) is a solution for assessing thereliability of Micro Electro Mechanical Systems (MEMS). A procedure for QALT is shownin this paper and an attempt to assess the reliability level for a batch of MEMSaccelerometers is reported. The testing plan is application-driven and contains combinedtests: thermal (high temperature) and mechanical stress. Two variants of mechanical stressare used: vibration (at a fixed frequency) and tilting. Original equipment for testing at tiltingand high temperature is used. Tilting is appropriate as application-driven stress, because thetilt movement is a natural environment for devices used for automotive and aerospaceapplications. Also, tilting is used by MEMS accelerometers for anti-theft systems. The testresults demonstrated the excellent reliability of the studied devices, the failure rate in the“worst case” being smaller than 10^-7h^-1. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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13 pages, 2328 KiB

Open AccessArticle

Modeling and Fabrication of Micro FET Pressure Sensor with Circuits

by Ching-Liang Dai, Yao-Wei Tai and Pin-Hsu Kao

Sensors 2007, 7(12), 3386-3398; https://doi.org/10.3390/s7123386 - 19 Nov 2007

Cited by 37 | Viewed by 12538

Abstract

This paper presents the simulation, fabrication and characterization of a microFET (field effect transistor) pressure sensor with readout circuits. The pressure sensorincludes 16 sensing cells in parallel. Each sensing cell that is circular shape is composed ofan MOS (metal oxide semiconductor) and a [...] Read more.

This paper presents the simulation, fabrication and characterization of a microFET (field effect transistor) pressure sensor with readout circuits. The pressure sensorincludes 16 sensing cells in parallel. Each sensing cell that is circular shape is composed ofan MOS (metal oxide semiconductor) and a suspended membrane, which the suspendedmembrane is the movable gate of the MOS. The CoventorWare is used to simulate thebehaviors of the pressure sensor, and the HSPICE is employed to evaluate the characteristicsof the circuits. The pressure sensor integrated with circuits is manufactured using thecommercial 0.35 μm CMOS (complementary metal oxide semiconductor) process and apost-process. In order to obtain the suspended membranes, the pressure sensor requires apost-CMOS process. The post-process adopts etchants to etch the sacrificial layers in thepressure sensors to release the suspended membranes, and then the etch holes in the pressuresensor are sealed by LPCVD (low pressure chemical vapor deposition) parylene. Thepressure sensor produces a change in current when applying a pressure to the sensing cells.The circuits are utilized to convert the current variation of the pressure sensor into thevoltage output. Experimental results show that the pressure sensor has a sensitivity of 0.032mV/kPa in the pressure range of 0-500 kPa. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 618 KiB

Open AccessArticle

Modeling and Manufacturing of Micromechanical RF Switch with Inductors

by Ching-Liang Dai and Ying-Liang Chen

Sensors 2007, 7(11), 2660-2670; https://doi.org/10.3390/s7112670 - 9 Nov 2007

Cited by 30 | Viewed by 11449

Abstract

This study presents the simulation, fabrication and characterization ofmicromechanical radio frequency (RF) switch with micro inductors. The inductors areemployed to enhance the characteristic of the RF switch. An equivalent circuit model isdeveloped to simulate the performance of the RF switch. The behaviors of [...] Read more.

This study presents the simulation, fabrication and characterization ofmicromechanical radio frequency (RF) switch with micro inductors. The inductors areemployed to enhance the characteristic of the RF switch. An equivalent circuit model isdeveloped to simulate the performance of the RF switch. The behaviors of themicromechanical RF switch are simulated by the finite element method software,CoventorWare. The micromechanical RF switch is fabricated using the complementarymetal oxide semiconductor (CMOS) and a post-process. The post-process employs a wetetching to etch the sacrificial layer, and to release the suspended structures of the RF switch.The structure of the RF switch contains a coplanar waveguide (CPW), a suspendedmembrane, eight springs and two inductors in series. Experimental results reveal that theinsertion loss and isolation of the switch are 1.7 dB at 21 GHz and 19 dB at 21 GHz,respectively. The driving voltage of the switch is about 13 V. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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9 pages, 394 KiB

Open AccessArticle

Magnetostrictive Micro Mirrors for an Optical Switch Matrix

by Heung-Shik Lee, Chongdu Cho and Myeong-Woo Cho

Sensors 2007, 7(10), 2174-2182; https://doi.org/10.3390/s7102174 - 9 Oct 2007

Cited by 8 | Viewed by 11437

Abstract

We have developed a wireless-controlled compact optical switch by siliconmicromachining techniques with DC magnetron sputtering. For the optical switchingoperation, micro mirror is designed as cantilever shape size of 5mm×800μm×50μm.TbDyFe film is sputter-deposited on the upper side of the mirror with the condition as: [...] Read more.

We have developed a wireless-controlled compact optical switch by siliconmicromachining techniques with DC magnetron sputtering. For the optical switchingoperation, micro mirror is designed as cantilever shape size of 5mm×800μm×50μm.TbDyFe film is sputter-deposited on the upper side of the mirror with the condition as: Argas pressure below 1.2×10^-9 torr, DC input power of 180W and heating temperature of up to250°C for the wireless control of each component. Mirrors are actuated by externallyapplied magnetic fields for the micro application. Applied beam path can be changedaccording to the direction and the magnitude of applied magnetic field. Reflectivity changes,M-H curves and X-ray diffractions of sputtered mirrors are measured to determine magneto-optical, magneto-elastic properties with variation in sputtered film thickness. The deflectedangle-magnetic field characteristics of the fabricated mirror are measured. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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14 pages, 365 KiB

Open AccessArticle

The Investigation of a Shape Memory Alloy Micro-Damper for MEMS Applications

by Qiang Pan and Chongdu Cho

Sensors 2007, 7(9), 1887-1900; https://doi.org/10.3390/s7091887 - 11 Sep 2007

Cited by 64 | Viewed by 13886

Abstract

Some shape memory alloys like NiTi show noticeable high damping property inpseudoelastic range. Due to its unique characteristics, a NiTi alloy is commonly used forpassive damping applications, in which the energy may be dissipated by the conversion frommechanical to thermal energy. This study [...] Read more.

Some shape memory alloys like NiTi show noticeable high damping property inpseudoelastic range. Due to its unique characteristics, a NiTi alloy is commonly used forpassive damping applications, in which the energy may be dissipated by the conversion frommechanical to thermal energy. This study presents a shape memory alloy based micro-damper, which exploits the pseudoelasticity of NiTi wires for energy dissipation. Themechanical model and functional principle of the micro-damper are explained in detail.Moreover, the mechanical behavior of NiTi wires subjected to various temperatures, strainrates and strain amplitudes is observed. Resulting from those experimental results, thedamping properties of the micro-damper involving secant stiffness, energy dissipation andloss factor are analyzed. The result indicates the proposed NiTi based micro-damper exhibitsgood energy dissipation ability, compared with conventional materials damper. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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17 pages, 1199 KiB

Open AccessArticle

Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

by Stefano Mariani, Aldo Ghisi, Alberto Corigliano and Sarah Zerbini

Sensors 2007, 7(9), 1817-1833; https://doi.org/10.3390/s7081817 - 7 Sep 2007

Cited by 57 | Viewed by 12758

Abstract

The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale) and meso-scale (at MEMS [...] Read more.

The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale) and meso-scale (at MEMS length-scale) simulations, accounting for the verysmall inertial contribution of the sensor to the overall dynamics of the device. Macro-scaleanalyses are adopted to get insights into the link between shock waves caused by the impactagainst a target surface and propagating inside the die, and the displacement/acceleration his-tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stresseddetails of the sensor and to assess whether the impact can lead to possible localized failures.Numerical results show that the acceleration at sensor anchors cannot be considered an ob-jective indicator for drop severity. Instead, accurate analyses at sensor level are necessary toestablish how MEMS can fail because of drops. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 758 KiB

Open AccessArticle

Reliability of a MEMS Actuator Improved by Spring Corner Designs and Reshaped Driving Waveforms

by Hsin-Ta Hsieh and Guo-Dung John Su

Sensors 2007, 7(9), 1720-1730; https://doi.org/10.3390/s7091720 - 3 Sep 2007

Cited by 21 | Viewed by 12160

Abstract

In this paper, we report spring corner designs and driving waveforms to improve the reliability for a MEMS (Micro-Electro-Mechanical System) actuator. In order to prevent the stiction problems, no stopper or damping absorber is adopted. Therefore, an actuator could travel long distance by [...] Read more.

In this paper, we report spring corner designs and driving waveforms to improve the reliability for a MEMS (Micro-Electro-Mechanical System) actuator. In order to prevent the stiction problems, no stopper or damping absorber is adopted. Therefore, an actuator could travel long distance by electromagnetic force without any object in moving path to absorb excess momentum. Due to long displacement and large mass, springs of MEMS actuators tend to crack from weak points with high stress concentration and this situation degrades reliability performance. Stress distribution over different spring designs were simulated and a serpentine spring with circular and wide corner design was chosen due to its low stress concentration. This design has smaller stress concentration versus displacement. Furthermore, the resonant frequencies are removed from the driving waveform based on the analysis of discrete Fourier transfer function. The reshaped waveform not only shortens actuator switching time, but also ensures that the spring is in a small displacement region without overshooting so that the maximum stress is kept below 200 MPa. The experimental results show that the MEMS device designed by theses principles can survive 500 g (gravity acceleration) shock test and pass 150 million switching cycles without failure. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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12 pages, 1374 KiB

Open AccessArticle

Micro Machining of Injection Mold Inserts for Fluidic Channel of Polymeric Biochips

by Woo-Chul Jung, Young-Moo Heo, Gil-Sang Yoon, Kwang-Ho Shin, Sung-Ho Chang, Gun-Hee Kim and Myeong-Woo Cho

Sensors 2007, 7(8), 1643-1654; https://doi.org/10.3390/s7081643 - 27 Aug 2007

Cited by 37 | Viewed by 15233

Abstract

Recently, the polymeric micro-fluidic biochip, often called LOC (lab-on-a-chip), has been focused as a cheap, rapid and simplified method to replace the existing biochemical laboratory works. It becomes possible to form miniaturized lab functionalities on a chip with the development of MEMS technologies. [...] Read more.

Recently, the polymeric micro-fluidic biochip, often called LOC (lab-on-a-chip), has been focused as a cheap, rapid and simplified method to replace the existing biochemical laboratory works. It becomes possible to form miniaturized lab functionalities on a chip with the development of MEMS technologies. The micro-fluidic chips contain many micro-channels for the flow of sample and reagents, mixing, and detection tasks. Typical substrate materials for the chip are glass and polymers. Typical techniques for micro-fluidic chip fabrication are utilizing various micro pattern forming methods, such as wet-etching, micro-contact printing, and hot-embossing, micro injection molding, LIGA, and micro powder blasting processes, etc. In this study, to establish the basis of the micro pattern fabrication and mass production of polymeric micro-fluidic chips using injection molding process, micro machining method was applied to form micro-channels on the LOC molds. In the research, a series of machining experiments using micro end-mills were performed to determine optimum machining conditions to improve surface roughness and shape accuracy of designed simplified micro-channels. Obtained conditions were used to machine required mold inserts for micro-channels using micro end-mills. Test injection processes using machined molds and COC polymer were performed, and then the results were investigated. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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16 pages, 1542 KiB

Open AccessArticle

Investigations of Slip Effect on the Performance of Micro Gas Bearings and Stability of Micro Rotor-Bearing Systems

by Hai Huang, Guang Meng and Jieyu Chen

Sensors 2007, 7(8), 1399-1414; https://doi.org/10.3390/s7081399 - 3 Aug 2007

Cited by 14 | Viewed by 9859

Abstract

Incorporating the velocity slip effect of the gas flow at the solid boundary, theperformance and dynamic response of a micro gas-bearing-rotor system are investigated inthis paper. For the characteristic length scale of the micro gas bearing, the gas flow in thebearing resides in [...] Read more.

Incorporating the velocity slip effect of the gas flow at the solid boundary, theperformance and dynamic response of a micro gas-bearing-rotor system are investigated inthis paper. For the characteristic length scale of the micro gas bearing, the gas flow in thebearing resides in the slip regime rather than in the continuum regime. The modifiedReynolds equations of different slip models are presented. Gas pressure distribution and loadcarrying capacity are obtained by solving the Reynolds equations with finite differentmethod (FDM). Comparing results from different models, it is found that the second orderslip model agrees reasonably well with the benchmarked solutions obtained from thelinearized Boltzmann equation. Therefore, dynamic coefficients derived from the secondorder slip model are employed to evaluate the linear dynamic stability and vibrationcharacteristics of the system. Compared with the continuum flow model, the slip effectreduces dynamic coefficients of the micro gas bearing, and the threshold speed for stableoperation is consequently raised. Also, dynamic analysis shows that the system responseschange with variation of the operating parameters including the eccentricity ratio, therotational speed, and the unbalance ratio. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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12 pages, 7464 KiB

Open AccessArticle

Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

by Jong-Wan Kim, Hidekuni Takao, Kazuaki Sawada and Makoto Ishida

Sensors 2007, 7(8), 1387-1398; https://doi.org/10.3390/s7081387 - 31 Jul 2007

Cited by 46 | Viewed by 13599

Abstract

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensorsystems that have been developed to monitor the motion and vital signs of humans invarious environments. Integration of radio frequency transmitter (RF) technology withcomplementary metal-oxide-semiconductor/micro electro [...] Read more.

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensorsystems that have been developed to monitor the motion and vital signs of humans invarious environments. Integration of radio frequency transmitter (RF) technology withcomplementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. Theessential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiralinductors for an LC resonator and an integrated antenna have been fabricated and evaluatedexperimentally. The fabricated RF transmitter and integrated antenna were packaged withsubminiature series A (SMA) connectors, respectively. For the impedance (50 ) matching,a bonding wire type inductor was developed. In this paper, the design and fabrication of thebonding wire inductor for impedance matching is described. Integrated techniques for theRF transmitter by CMOS compatible processes have been successfully developed. Aftermatching by inserting the bonding wire inductor between the on-chip integrated antennaand the VCO output, the measured emission power at distance of 5 m from RF transmitterwas -37 dBm (0.2 μW). Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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22 pages, 757 KiB

Open AccessArticle

Methods for Solving Gas Damping Problems in Perforated Microstructures Using a 2D Finite-Element Solver

by Timo Veijola and Peter Raback

Sensors 2007, 7(7), 1069-1090; https://doi.org/10.3390/s7071069 - 28 Jun 2007

Cited by 38 | Viewed by 12112

Abstract

We present a straightforward method to solve gas damping problems for perfo-rated structures in two dimensions (2D) utilising a Perforation Profile Reynolds (PPR) solver.The PPR equation is an extended Reynolds equation that includes additional terms modellingthe leakage flow through the perforations, and variable [...] Read more.

We present a straightforward method to solve gas damping problems for perfo-rated structures in two dimensions (2D) utilising a Perforation Profile Reynolds (PPR) solver.The PPR equation is an extended Reynolds equation that includes additional terms modellingthe leakage flow through the perforations, and variable diffusivity and compressibility pro-files. The solution method consists of two phases: 1) determination of the specific admittanceprofile and relative diffusivity (and relative compressibility) profiles due to the perforation,and 2) solution of the PPR equation with a FEM solver in 2D. Rarefied gas corrections inthe slip-flow region are also included. Analytic profiles for circular and square holes withslip conditions are presented in the paper. To verify the method, square perforated damperswith 16 – 64 holes were simulated with a three-dimensional (3D) Navier-Stokes solver, a ho-mogenised extended Reynolds solver, and a 2D PPR solver. Cases for both translational (innormal to the surfaces) and torsional motion were simulated. The presented method extendsthe region of accurate simulation of perforated structures to cases where the homogenisationmethod is inaccurate and the full 3D Navier-Stokes simulation is too time-consuming. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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37 pages, 605 KiB

Open AccessArticle

Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

by Wen-Ming Zhang, Guang Meng and Di Chen

Sensors 2007, 7(5), 760-796; https://doi.org/10.3390/s7050760 - 31 May 2007

Cited by 89 | Viewed by 20442

Abstract

Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity [...] Read more.

Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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11 pages, 774 KiB

Open AccessArticle

An Experimental Study on the Fabrication of Glass-based Acceleration Sensor Body Using Micro Powder Blasting Method

by Dong-Sam Park, Dae-Jin Yun, Myeong-Woo Cho and Bong-Cheol Shin

Sensors 2007, 7(5), 697-707; https://doi.org/10.3390/s7050697 - 24 May 2007

Cited by 8 | Viewed by 12393

Abstract

This study investigated the feasibility of the micro powder blasting technique for the micro fabrication of sensor structures using the Pyrex glass to replace the existing silicon-based acceleration sensor fabrication processes. As the preliminary experiments, the effects of the blasting pressure, the mass [...] Read more.

This study investigated the feasibility of the micro powder blasting technique for the micro fabrication of sensor structures using the Pyrex glass to replace the existing silicon-based acceleration sensor fabrication processes. As the preliminary experiments, the effects of the blasting pressure, the mass flow rate of abrasive and the number of nozzle scanning times on erosion depth of the Pyrex and the soda lime glasses were examined. From the experimental results, optimal blasting conditions were selected for the Pyrex glass machining. The dimensions of the designed glass sensor was 1.7×1.7×0.6mm for the vibrating mass, and 2.9×0.7×0.2mm for the cantilever beam. The machining results showed that the dimensional errors of the machined glass sensor ranged from 3 μm in minimum to 20 μm in maximum. These results imply that the micro powder blasting method can be applied for the micromachining of glass-based acceleration sensors to replace the exiting method. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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10 pages, 5386 KiB

Open AccessLetter

In-Situ Measurement of High-Temperature Proton Exchange Membrane Fuel Cell Stack Using Flexible Five-in-One Micro-Sensor

by Chi-Yuan Lee, Fang-Bor Weng, Yzu-Wei Kuo, Chao-Hsuan Tsai, Yen-Ting Cheng, Chih-Kai Cheng and Jyun-Ting Lin

Sensors 2016, 16(10), 1731; https://doi.org/10.3390/s16101731 - 18 Oct 2016

Cited by 18 | Viewed by 6379

Abstract

In the chemical reaction that proceeds in a high-temperature proton exchange membrane fuel cell stack (HT-PEMFC stack), the internal local temperature, voltage, pressure, flow and current nonuniformity may cause poor membrane material durability and nonuniform fuel distribution, thus influencing the performance and lifetime [...] Read more.

In the chemical reaction that proceeds in a high-temperature proton exchange membrane fuel cell stack (HT-PEMFC stack), the internal local temperature, voltage, pressure, flow and current nonuniformity may cause poor membrane material durability and nonuniform fuel distribution, thus influencing the performance and lifetime of the fuel cell stack. In this paper micro-electro-mechanical systems (MEMS) are utilized to develop a high-temperature electrochemical environment-resistant five-in-one micro-sensor embedded in the cathode channel plate of an HT-PEMFC stack, and materials and process parameters are appropriately selected to protect the micro-sensor against failure or destruction during long-term operation. In-situ measurement of the local temperature, voltage, pressure, flow and current distributions in the HT-PEMFC stack is carried out. This integrated micro-sensor has five functions, and is favorably characterized by small size, good acid resistance and temperature resistance, quick response, real-time measurement, and the goal is being able to be put in any place for measurement without affecting the performance of the battery. Full article

(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)

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