Special Issue "Sensors for Nondestructive Testing and Evaluation"
Deadline for manuscript submissions: 30 May 2020.
Interests: non-destructive evaluation; tunneling structures; geotechnical structures; damage detection; health monitoring; AI health diagnosis
Interests: structural health monitoring; non-destructive evaluation; smart sensors; smart structures; damage detection
Special Issues and Collections in MDPI journals
Non-destructive evaluation (NDE) is an engineering approach for examining the properties of a structure or system, without causing damage. Non-destructive evaluation techniques, such as optical, electromagnetics, ultrasonic, radiography, and thermal methods have contributed to ground-breaking improvements in safety in many industrial areas.
In order to develop successful NDE technology, various integrated technologies, such as advanced sensors, data measurement technology, signal processing method, and statistical decision making algorithms have been studied in combination, in order to evaluate the condition of the structures and machinery.
Meanwhile, over the last decades, there has been a growing number of new NDE solutions that provide artificial intelligence (AI) and machine learning (ML) based techniques for automated decision making. In addition, Internet of things (IoT) technologies are also undergoing great expansion and development, and the convergence of both AI and IoT are now realities that are going to change the paradigm of NDE technology.
We invite you to submit original research papers or technical or review articles to this Special Collection, with emphasis on novel and emerging technologies for a wide range of non-destructive evaluation techniques, including AI and ML combined techniques.
Potential topics include, but are not limited to, the following:
- non-destructive evaluation
- real-time monitoring
- structural health monitoring
- Data mining methods, algorithms, and applications
- Data analysis for non-destructive evaluation
- Advanced signal processing, data mining, and data fusion
- Pattern recognition applications
- Artificial intelligence and machine learning application for NDE
- Computer vision-based NDE
- Industry 4.0, sensors, and AI
Prof. Dr. Seunghee Park
Prof. Dr. Bo Han
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- non-destructive evaluation;
- structural health monitoring;
- artificial intelligence;
- machine learning;
- Internet of things;
- intelligent health diagnosis