Functional Polyimides
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Smart and Functional Polymers".
Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 4032
Special Issue Editor
Interests: polyimide; membrane; polyamide; epoxy resin; low Earth orbit; gas separation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thanks to their high heat resistance, polyimides enjoy diverse applications in roles demanding rugged organic materials (e.g., high-temperature fuel cells, displays, and various military applications). Polyimide materials are lightweight, flexible, and resistant to heat and chemicals. Therefore, the electronics industry makes extensive use of polyimide films in semiconductor applications, as an example. Polyimides are also the leading polymer matrices for high-temperature advanced composites. High-temperature adhesive systems for the bonding of metals or composites are often based on polyimides. In addition, polyimides are now finding use as fibers, foams, sealants and even membranes for the low-energy separation of industrial gases.
This Special Issue aims to cover the most recent and engaging topics on polyimide materials, with a focus on their preparation, characterization, properties and applications. Submissions in the form of full-length articles, communications, and reviews are invited.
Dr. Xingfeng Lei
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- advanced polyimides
- preparation
- properties
- applications
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