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Special Issue "Hybrid and Heterogeneous Technologies in Photonics Integrated Circuits"
A special issue of Photonics (ISSN 2304-6732).
Deadline for manuscript submissions: closed (31 October 2015).
The technology to integrate multiple photonic components, such as waveguides, lasers, modulators and detectors, on a single chip is maturing fast. Such photonic integrated circuits can consist of hundreds of components in commercial devices, and up to thousands in research demonstrators. The three main material platforms for photonic circuit technology are silicon-on-insulator, indium phosphide, and silica and silicon nitride based waveguides. However, integration requires an inherent trade-off, in terms of size, performance and cost and the three main integration technologies mentioned above have different advantages and limitations, depending on the application.
To overcome such limitations, increasingly the combination of materials is needed. This combination can be achieved in a hybrid way, by combining processed chips or chiplets in a package and/or on an interposer. Alternatively, this can be done heterogeneously, by combining different materials on a single substrate during the process flow. In these ways, the ‘best of both worlds’ can be combined. Examples include the combination of indium phosphide based active chips with silicon or silica passive chips, and the heterogeneous integration of indium phosphide active layers on silicon photonic wafers using wafer bonding.
This Special Issue will focus on hybrid and heterogeneous integration technology for photonic integrated circuits, including materials processing, techniques for combination and integration, novel components and circuits, and the applications that are uniquely enabled by such a technology. With a combination of invited and contributed papers, this issue will present the latest developments and state-of-the-art in this rapidly developing field.
Prof. Dr. John E. Bowers
Prof. Dr. Martijn J. R. Heck
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- photonic integrated circuits
- silicon photonics hybrid integration; heterogeneous integration
- optical interposers;
- indium phosphide photonics
- silica and silicon nitride photonics
- wafer bonding
- optical interconnects
- microwave photonics
- photonic sensors
- tunable lasers