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Hybrid Photonic Integration on a Polymer Platform

1
Fraunhofer Heinrich Hertz Institute (HHI), Einsteinufer 37, Berlin 10587, Germany
2
Photonic Communications Research Laboratory, National Technical University of Athens, Zografou, Athens 15573, Greece
3
III-V Lab, Joint lab between Alcatel-Lucent Bell Labs, Thales-TRT and CEA/Leti, Route de Nozay, Marcoussis 91460, France
4
Linkra Srl, Via S. Martino 7, Agrate Brianza (MB) 20864, Italy
5
GigOptix Inc., 19910 North Creek Parkway Suite 100, Bothell, WA 98011, USA
*
Author to whom correspondence should be addressed.
Photonics 2015, 2(3), 1005-1026; https://doi.org/10.3390/photonics2031005
Received: 13 August 2015 / Revised: 14 September 2015 / Accepted: 15 September 2015 / Published: 21 September 2015
To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, passive insertion of thin-film-based optical elements, and on-chip attachment of optical fibers. This work reviews the recent progress of our polyboard platform. On the fundamental level, multi-core waveguides and polymer/silicon nitride heterogeneous waveguides have been fabricated, broadening device design possibilities and enabling 3D photonic integration. Furthermore, 40-channel optical line terminals and compact, bi-directional optical network units have been developed as highly functional, low-cost devices for the wavelength division multiplexed passive optical network. On a larger scale, thermo-optic elements, thin-film elements and an InP gain chip have been integrated on the polyboard to realize a colorless, dual-polarization optical 90° hybrid as the frontend of a coherent receiver. For high-end applications, a wavelength tunable 100Gbaud transmitter module has been demonstrated, manifesting the joint contribution from the polyboard technology, high speed polymer electro-optic modulator, InP driver electronics and ceramic electronic interconnects. View Full-Text
Keywords: hybrid photonic integration; photonic integrated circuits; polymer waveguides hybrid photonic integration; photonic integrated circuits; polymer waveguides
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MDPI and ACS Style

Zhang, Z.; Felipe, D.; Katopodis, V.; Groumas, P.; Kouloumentas, C.; Avramopoulos, H.; Dupuy, J.-Y.; Konczykowska, A.; Dede, A.; Beretta, A.; Vannucci, A.; Cangini, G.; Dinu, R.; Schmidt, D.; Moehrle, M.; Runge, P.; Choi, J.-H.; Bach, H.-G.; Grote, N.; Keil, N.; Schell, M. Hybrid Photonic Integration on a Polymer Platform. Photonics 2015, 2, 1005-1026. https://doi.org/10.3390/photonics2031005

AMA Style

Zhang Z, Felipe D, Katopodis V, Groumas P, Kouloumentas C, Avramopoulos H, Dupuy J-Y, Konczykowska A, Dede A, Beretta A, Vannucci A, Cangini G, Dinu R, Schmidt D, Moehrle M, Runge P, Choi J-H, Bach H-G, Grote N, Keil N, Schell M. Hybrid Photonic Integration on a Polymer Platform. Photonics. 2015; 2(3):1005-1026. https://doi.org/10.3390/photonics2031005

Chicago/Turabian Style

Zhang, Ziyang; Felipe, David; Katopodis, Vasilis; Groumas, Panos; Kouloumentas, Christos; Avramopoulos, Hercules; Dupuy, Jean-Yves; Konczykowska, Agnieszka; Dede, Alberto; Beretta, Antonio; Vannucci, Antonello; Cangini, Giulio; Dinu, Raluca; Schmidt, Detlef; Moehrle, Martin; Runge, Patrick; Choi, Jung-Han; Bach, Heinz-Gunter; Grote, Norbert; Keil, Norbert; Schell, Martin. 2015. "Hybrid Photonic Integration on a Polymer Platform" Photonics 2, no. 3: 1005-1026. https://doi.org/10.3390/photonics2031005

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