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Integrated Circuit Research for Nanoscale Field-Effect Transistors: 2nd Edition

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".

Deadline for manuscript submissions: closed (24 October 2025) | Viewed by 1238

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Wide Bandgap Semiconductor Technology Disciplines State Key Laboratory, School of Microelectronics, Xidian University, Xi'an, China
Interests: optoelectronic properties of group IV devices; silicon photonics
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Special Issue Information

Dear Colleagues,

This is the second edition of the previous Special Issue, “Integrated Circuit Research for Nanoscale Field-Effect Transistors”.

As the channel size of field-effect transistors (FETs) shrinks to the nanometre scale, there is increasing demand for atomic-layer materials to minimize the effects of short channels under extreme scaling. Since the proposal of graphene, the first monolayer of graphite, many researchers have developed novel nanomaterials, such as two-dimensional chalcogenides and single-element two-dimensional materials, on FET devices. These FETs, fabricated using nanomaterials, have become a hot research topic, and researchers are committed to improving their performance and expanding their circuit applications.

To draw more attention to this research field, this Special Issue will comprehensively discuss progress in FET device applications. Potential topics include, but are not limited to, nanomaterials in FET devices and the preparation, circuit design, and application of nano-FET devices. We invite authors to contribute original research and review articles covering the latest developments in aspects such as nanomaterial-based devices, sub-reliability, and material stability.

There are many issues related to the design, fabrication, and application of advanced field-effect transistors. It is my pleasure to invite you to share your expertise in this Special Issue. Full papers, communications, and reviews are all welcome.

Prof. Dr. Huiyong Hu
Guest Editor

Manuscript Submission Information

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Keywords

  • FETs
  • nanomaterials
  • nanointegrated circuits
  • nano-semiconductor device
  • channel effect
  • simulation

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Published Papers (1 paper)

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Research

13 pages, 2128 KB  
Article
Remarkably High Effective Mobility of 301 cm2/V·s in 3 nm Ultra-Thin-Body SnO2 Transistor by UV Annealing
by An-Chieh Shih, Yi-Hao Zhan and Albert Chin
Nanomaterials 2026, 16(2), 133; https://doi.org/10.3390/nano16020133 - 19 Jan 2026
Viewed by 894
Abstract
At an ultra-thin 3 nm SnO2 channel thickness, a record-high effective mobility (µeff) of 301 cm2/V·s, field-effect mobility (µFE) of 304 cm2/V·s, and a sharp subthreshold swing (SS) of 201 mV/decade are [...] Read more.
At an ultra-thin 3 nm SnO2 channel thickness, a record-high effective mobility (µeff) of 301 cm2/V·s, field-effect mobility (µFE) of 304 cm2/V·s, and a sharp subthreshold swing (SS) of 201 mV/decade are achieved at a high carrier density (Ne) of 5 × 1012 cm−2. These excellent transport properties are attributed to ultraviolet (UV) light annealing. The resulting µeff is significantly higher than that of Molybdenum Disulfide (MoS2) and Tungsten Diselenide (WSe2), and is more than twice that of single-crystalline Si channel transistors at the same quasi-two-dimensional (2D) thickness of 3 nm (equivalent to five monolayers of MoS2). UV annealing not only enhances µeff and µFE but also sharpens the SS, which is crucial for low-power operation. This improved SS is attributed to reduced scattering from charged interface traps, as supported by µeff-Ne analysis, thereby increasing the transistor’s mobility. The realization of such high-mobility devices at a quasi-2D thickness of only 3 nm is of particular importance for the further downscaling of ultra-thin-body transistors for high-speed computing and monolithic three-dimensional (M3D) integration. Furthermore, the wide bandgap of SnO2 (3.7 eV) enables operation at relatively high voltages, paving the way for pioneering ternary logic applications. Full article
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