Hybrid Nano Polymer Composites Volume II

Dear Colleagues,

By initiating this Special Issue collection, we want to bring together researchers, scientists, and engineers working in the field of Hybrid Nano Polymer Composites, providing them with a platform to exchange ideas, share their latest findings, and contribute to the growth of knowledge in this exciting and rapidly evolving area.

Background and history of this topic

Hybrid Nano Polymer Composites is an interdisciplinary field that combines the unique properties of nanoparticles and polymers to create advanced materials with enhanced mechanical strength, thermal stability, electrical conductivity, and other desired characteristics. The goal is to harness the synergistic effects of at least two components to overcome the limitations of individual materials. The history of Hybrid Nano Polymer Composites can be traced back to the 2000s, when researchers started to more intensively explore the potential of incorporating nanoparticles into polymer matrices. The field has gained significant attention due to the increasing demand for high-performance materials in various industries such as aerospace, automotive, electronics, and energy. Over the years, extensive research has been conducted to develop innovative synthesis techniques, understand structure–property relationships, and explore various combinations, including carbon nanotubes, graphene, metal oxides, and clay nanoparticles, along with various polymer matrices.

Aim and scope of the Special Issue

Volume II of the Special Issue collection on Hybrid Nano Polymer Composites focuses on gathering publications that cover recent developments, cutting-edge research, and advancements in the field. It aims to provide a comprehensive overview of the state of the art, challenges, and future prospects of Hybrid Nano Polymer Composites, in particular with piesoresistive, thermoresistive, and piesoelectric properties for sensing applications, as well as electroactive and shape memory materials, suitable for the new technology of 4D printing, that adds unique functions to 3D-printed architectures under the influence of external stimuli.

Cutting-edge research

Next-generation electronics is a field that is benefiting from the development of these composites via investigating their implementation in flexible and stretchable electronics, printed circuit boards, cooling and heating elements, thermal sensors, as well as emphasizing their electrical conductivity, thermal stability, and ability to integrate with organic and inorganic electronic components. Regarding the field of sensing, their sensitivity, responsiveness, and ability to detect various physical and chemical stimuli should be highlighted. Recently, there has been discussion about their potential for improving energy efficiency, promoting the applications of renewable energy sources, and enabling advancements in supercapacitors and other storage elements for the needs of portable electronics.

What kind of papers we are soliciting

We welcome any papers and review articles related to synthesis techniques, characterization methods, performance evaluation, and applications of Hybrid Nano Polymer Composites with the above-mentioned piesoresistive, thermoresistive, piesoelectric and electroactive smart properties for automotive, consumer electronics, energy, healthcare and 4D printing applications.

Prof. Dr. Rumiana Kotsilkova
Dr. Mariya Aleksandrova
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2900 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• piesoresistive
• thermoresistive
• piezoelectric
• shape memory
• 4D printing
• automotive
• electronics
• energy
• healthcare applications