Reviewer Board
Members of the reviewer board are selected from all Micromachines reviewers for regularly providing timely high quality reports on submitted manuscripts. Responsibilities of reviewers are available here.
Members
Institut de Ciència de Materials de Barcelona, ICMAB-CSIC, Campus UAB, 08193 Bellaterra, Cerdanyola, Spain
Interests: organic field-effect transistors; organic semiconductors; organic metals; charge transport; dielectrics; sensors; optoelectronics
Interests: organic field-effect transistors; organic semiconductors; organic metals; charge transport; dielectrics; sensors; optoelectronics
Department of Automated Mechanical Engineering, South Ural State University (national research university), Lenin Prosp. 76, Chelyabinsk, 454080 Russia
Interests: wear; finite element method; optimization; machining; grinding; milling; turning; Drilling
Interests: wear; finite element method; optimization; machining; grinding; milling; turning; Drilling
Future Industries Institute, STEM, University of South Australia, Mawson Lakes, SA 5095, Australia
Interests: microfluidics; nanofluidics; wettability; surface modification; sensor; extraction; screening
Interests: microfluidics; nanofluidics; wettability; surface modification; sensor; extraction; screening
Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA
Interests: MEMS; carbon nanotube; sensors; microelectronic fabrication
Interests: MEMS; carbon nanotube; sensors; microelectronic fabrication
Department of Health Sciences, University Magna Graecia of Catanzaro, Catanzaro, Italy
Interests: biomedical instrumentation; polymer sensors; microfluidics
Interests: biomedical instrumentation; polymer sensors; microfluidics
The Advanced Microfluidics and Microdevices Laboratory (AMMLab), New York University Abu Dhabi, P.O. Box 129188, Abu Dhabi, United Arab Emirates
Interests: microfluidics; biomedical micro-devices; MEMS; point of care diagnostics
Interests: microfluidics; biomedical micro-devices; MEMS; point of care diagnostics
Institute of Process Equipment, College of Energy Engineering, Zhejiang University, Hangzhou, China
Interests: flow control; heat transfer; microchannel; valve; computational fluid dynamics
Interests: flow control; heat transfer; microchannel; valve; computational fluid dynamics
Shock and Vibration Lab-IBM Corporation, 2455 South RD, Poughkeepsie, NY 12601, USA
Interests: MEMS; resonator; Vibration; Nonlinear Dynamics; capacitive; micromirror; nonlinear vibration; capacitive sensing
Interests: MEMS; resonator; Vibration; Nonlinear Dynamics; capacitive; micromirror; nonlinear vibration; capacitive sensing
Instituto de Micro y Nanotecnología, IMN-CNM, CSIC (CEI UAM+CSIC) Isaac Newton, 8, Tres Cantos, 28760 Madrid, Spain
Interests: optomechanics; plasmonics; photonic crystals; nanomechanical sensing
Interests: optomechanics; plasmonics; photonic crystals; nanomechanical sensing
Laser Physics Centre, Research School of Physics, The Australian National University, Canberra, ACT 2600, Australia
Interests: application of short-pulse laser-matter interaction phenomena in nanotechnology and micromachining; ultrafast dynamics in solid, fs-laser interraction inside transparent and non-transparent materials; nanomaterials, nanoparticules materials and nanostructures
Interests: application of short-pulse laser-matter interaction phenomena in nanotechnology and micromachining; ultrafast dynamics in solid, fs-laser interraction inside transparent and non-transparent materials; nanomaterials, nanoparticules materials and nanostructures
School of Engineering, University of Glasgow, Glasgow, UK
Interests: acoustics; diagnostics; microfluidics; biomedical engineering; cell-based assays
Interests: acoustics; diagnostics; microfluidics; biomedical engineering; cell-based assays
Reata Pharmaceuticals, Inc., Plano, TX, USA
Interests: Nrf2; inflammation biology; neurodegeneration; renal disease; liver disease
Interests: Nrf2; inflammation biology; neurodegeneration; renal disease; liver disease
Department of Electrical Engineering,Arizona State University,Tempe, AZ 85287, USA
Interests: MEMS; microbial fuel cells; micromirrors; MEMS out-of-plane actuators; MEMS sensors; piezoelectric resonators; microsystems
Interests: MEMS; microbial fuel cells; micromirrors; MEMS out-of-plane actuators; MEMS sensors; piezoelectric resonators; microsystems
Department of Mechanical Engineering, Imperial College London, 58 Princes Gate, South Kensington, London SW7 1AY, UK
Interests: nonlinear vibrations; nonlinear dynamics; mode interactions; bifurcation analysis; model reduction; control vibration analysis
Interests: nonlinear vibrations; nonlinear dynamics; mode interactions; bifurcation analysis; model reduction; control vibration analysis
Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea
Interests: metamaterials; plasmonics; nanophotonics; nanofabrication; nanomanufacturing
Interests: metamaterials; plasmonics; nanophotonics; nanofabrication; nanomanufacturing
Imperial College London, Mechanical Engineering Department, South Kensington Campus, Exhibition Road, London SW7 2AZ, UK
Interests: control systems; cad; robotics and distributed power generation
Interests: control systems; cad; robotics and distributed power generation
Department of Electronics and Computer Technology, University of Granada, 52005 Granada, Spain
Interests: sensors; printed electronics; rfid smart system; energy harvesting; environmental engineering
Interests: sensors; printed electronics; rfid smart system; energy harvesting; environmental engineering
Faculty of Engineering, Queretaro State University, Querétaro 76010, Mexico.
Interests: electronics; automation; mechatronics; robot; bioenginering
Interests: electronics; automation; mechatronics; robot; bioenginering
Swiss Light Source, Paul Scherrer Institute, CH-5232 Villigen, Switzerland
Interests: X-ray optics; gratings; silicon etching; metal assisted chemical etching; silicon nanowires
Interests: X-ray optics; gratings; silicon etching; metal assisted chemical etching; silicon nanowires
Division of Orthopaedic Surgery, Department of Surgery, McGill University, Montreal, QC H3A 0G4, Canada
Interests: tissue repair and regeneration post-tumor resection; tissue engineering; drug delivery; low-cost 3D-printing; bioprinting; 3D models for tumor and trauma tissue microenvironments
Interests: tissue repair and regeneration post-tumor resection; tissue engineering; drug delivery; low-cost 3D-printing; bioprinting; 3D models for tumor and trauma tissue microenvironments
Department of Mechanical and Aerospace Engineering, California State University, Long Beach, CA 90840, USA
Interests: mechanics of composite materials; structural health monitoring – diagnostics and prognostics
Interests: mechanics of composite materials; structural health monitoring – diagnostics and prognostics
Dipartimento di Ingegneria delle Costruzioni Meccaniche, Nucleari, Aeronautiche e di Metallurgia (DIEM), University of Bologna, Bologna, Italy
Interests: vibration mechanics; mechanical monitoring and diagnostics; mechanical systems modelling; signal processing
Interests: vibration mechanics; mechanical monitoring and diagnostics; mechanical systems modelling; signal processing
Department of Electronics, AGH University of Science and Technology, 30-059 Kraków, Poland
Interests: diabetes; exhaled breath analysis; biosensors; cells metabolism analysis; NAFLD; gas sensors
Interests: diabetes; exhaled breath analysis; biosensors; cells metabolism analysis; NAFLD; gas sensors
Universidad Politécnica de Madrid
Interests: scanning probe lithography; micro-/nanoelectronics; tansition metal dichalcogenides; nanoscience; nanotechnology; graphene; high resolution
Interests: scanning probe lithography; micro-/nanoelectronics; tansition metal dichalcogenides; nanoscience; nanotechnology; graphene; high resolution
Micro- and Nanosystems Research Group, BioMediTech, Faculty of Medicine and Health Technology, Tampere University, 33720 Tampere, Finland
Interests: microelectrode array (MEA); microfabrication; organ-on-chip; thin films; microsensors
Interests: microelectrode array (MEA); microfabrication; organ-on-chip; thin films; microsensors
Department of Mechanical Engineering, University of Calgary, Wireless Fluidics, Calgary, AB, Canada
Interests: microsystems; microfluidics; sensors; lab-on-a-chip; point-of-care; MEMS
Interests: microsystems; microfluidics; sensors; lab-on-a-chip; point-of-care; MEMS
Department of Materials Engineering and Construction Processes, Wroclaw University of Science and Technology, 50-370 Wrocław, Poland
Interests: building materials; non-destructive testing; concrete; surface morphology; acoustic techniques and artificial intelligence
Interests: building materials; non-destructive testing; concrete; surface morphology; acoustic techniques and artificial intelligence
Emerging Technologies Research Centre, De Montfort University, Leicester, UK
Interests: nanomaterials; polymers; 3D printing; inkjet printing and fused deposition modelling; polymer memory devices; resistive RAM; photovoltaics
Interests: nanomaterials; polymers; 3D printing; inkjet printing and fused deposition modelling; polymer memory devices; resistive RAM; photovoltaics
Stuttgart Center for Electron Microscopy, Max Planck Institute for Solid State Research, 70569 Stuttgart, Germany
Interests: X-ray microscopy; atomic layer deposition; thin films; focused ion beam lithography; multi-photon lithography; optics; fresnel zone plates; electron microscopy
Interests: X-ray microscopy; atomic layer deposition; thin films; focused ion beam lithography; multi-photon lithography; optics; fresnel zone plates; electron microscopy
School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ 85281, USA
Interests: TCAD simulation; compact modeling; novel nanoscale devices such as FinFET, graphene nanoribbons, G4FETs, junctionless FET, tunnel FET, and nanowire; 3d nand; resistive random-access memory (ReRAM) and programmable metallization cell (PMC); diamond-based power devices and high power devices such as LDMOSFETs; single event effects; quantum transport
Interests: TCAD simulation; compact modeling; novel nanoscale devices such as FinFET, graphene nanoribbons, G4FETs, junctionless FET, tunnel FET, and nanowire; 3d nand; resistive random-access memory (ReRAM) and programmable metallization cell (PMC); diamond-based power devices and high power devices such as LDMOSFETs; single event effects; quantum transport
