Reviewer Board

Members of the reviewer board are selected from all Micromachines reviewers for regularly providing timely high quality reports on submitted manuscripts. Responsibilities of reviewers are available here.

Members

Division of Mechanical Science and Technology, Gunma University, Kiryu 376-8515, Japan
Interests: Microfabrication; photolithography; polymer mems; bio mems; microfluidic device; lab on a chip; vibration energy harvester
Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland
Interests: MEMS inertial sensors; integrated circuits

Website
DTU Nanolab, National Centre for Nano Fabrication and Characterization, Technical University of Denmark, DK-2800 Kgs., Lyngby, Denmark
Interests: micro- and nanofabrication; microfluidics; polymer micro- and nanosystems; surface engineering; surface wetting
Universidad del País Vasco/Euskal Herriko Unibertsitatea, Barrio Sarriena s/n, 48940 Leioa, Spain
Interests: magnetism and magnetic materials; ferromagnetic metallic glasses; functional (nano)composite materials; magnetic hyperthermia; induction heating; giant magnetoimpedance effect; domain wall dynamics; rapid solidification techniques; mechanical alloying
The Henry Samueli School of Engineering, University of California, Irvine, CA 92697-2700, USA
Interests: MEMS; microimplants; microfluidic platforms

Website
Department of Biomedical Engineering, School of Science and Engineering, Duquesne University, Pittsburgh, PA 15282, USA
Interests: microfluidics; BioMEMS/NEMS; in vitro diagnostics; Lab-on-a-chip; biomedical microdevices; biosensors; point of care diagnostics; particle trapping; Manipulation; Sorting
1. UCD School of Medicine, University College Dublin, D04 V1W8 Dublin, Ireland
2. UCD Conway Institute of Biomolecular & Biomedical Research, University College Dublin, D04 V1W8 Dublin, Ireland
Interests: mesenchymal stem cell; biomechanics; mechanobiology; cell-matrix interactions
Department of Precision and Microsystems Engineering, Faculty of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Mekelweg 2, 2628CD, Delft, The Netherlands
Interests: scalable micro/nano manufacturing; high precision alignment; self-assembly; heterogeneous nano-scale integration; mechanical micro/nano metamaterials; photonic devices and flexible electronics
Massachusetts Inst. of Technology (US) & Technion -Israel Inst. of Technology (Israel), Haifa, Israel
Interests: diamond physics; diamond and carbon electronic devices; nano science
Department of Biosystems Science and Engineering, ETH Zurich, 4058 Basel, Switzerland
Interests: biosensor interface electronics; neuron stimulation and recording interface circuits; biomedical circuits; energy harvesting; low power electronics
Department of Chemical Engineering, Izmir Institute of Technology, Urla, 35430 Izmir, Turkey
Interests: electrochemical systems; electronic materials; semiconductor device packaging; supercritical fluid technologies
Faculty of Engineering and Architecture, Kore University of Enna, 94100 Enna, Italy
Interests: thermal analysis; composites; smart materials; computational mechanics; optimization; acoustics; structural dynamics; viscoelasticity; multiphysics analysis

Website
Department of Mechanical Engineering, Eindhoven University of Technology (TU/e), 5600 MB Eindhoven, The Netherlands
Interests: stretchable electronics; micro- and nano-electronics; thin films; fracture; delamination; adhesion; multi-scale mechanics; digital twin

Website
Department of AppliedPhysics and Photonics, Vrije Universiteit Brussel and Flanders Make, Brussels Photonics (B-PHOT), Pleinlaan 2, B-1050 Brussels, Belgium
Interests: freeform optics manufacturing; optical fiber connectivity; polymer optics
Research Centre for Natural Sciences, Budapest, Hungary
Interests: drug delivery liposomes; extracellular vesicles; nanomedicine; structural characterization of biological and medical nanomaterials
Vinca Institute of Nuclear Sciences, University of Belgrade, P.O. Box 522 Belgrade, Serbia
Interests: anticancer drugs; noble metal complexes; nanocomposites; enzyme activity modulation; biosensors
University of Akron, KeraCel Inc.
Interests: multi-material 3D Printing; functional 3D structures; metal and ceramics; 3D printing; flexible sensors; solid-state batteries
Department of Mechanical Engineering, Universidad de Ingenieria y Tecnologia, Lima, Peru
Interests: biorobotics; microrobotics; sensors and actuators; soft robotics

Website
Yenepoya, Yenepoya Research Centre, Deralakatte, Mangalore, Karnataka, India
Interests: biomaterials; tissue engineering; drug delivery
Universite Paris-Saclay, Saint-Aubin, France
Interests: biosensor; nanoparticles; biophysics; food safety
Department of Engineering, University of Palermo, Viale Delle Scienze, Parco d’Orleans, 90128 Palermo, PA, Italy
Interests: electric vehicled

Website
Intel Corporation, Santa Clara, CA, USA
Interests: transistor
Università degli Studi di Bari
Interests: laser; texturing; wettability; microfluidics; polymers; metals; ultrashort pulses; laser writing; nanoparticles
Department of Applied Computing and Engineering, Cardiff School of Technologies, Cardiff Metropolitan University, Llandaff Campus, Cardiff CF5 2YB, UK
Interests: intelligent robotics; networked robotics; computational intelligence; human–machine interaction; nanomanipulation
ACROSS and ACES, University of Tasmania, Hobart TAS 7005, Australia
Interests: 3d printing technology; soft lithography; hot embossing; microfluidic devices and sensors
Wrocław University of Science and Technology
Interests: microfluidics; separation; electrophoresis; 3D printing; DNA separations
Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung 40227, Taiwan
Interests: compliant mechanism design; green energy harvester; ultrasonic welding/machining; design and fabrication of microactuator/microsensor devices and products; plasticity; fracture mechanics and computer aided engineering
Electrical Engineering College of Engineering and Computing, University of South Carolina, Columbia, SC 29208, USA
Interests: MEMS/NEMS; energy harvesting; microwave materials and applications
Department of Mechanical Engineering, Tsinghua University, Beijing, China
Interests: intelligent manufacturing; material processing; vibration assisted machining
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
Interests: solid mechanics; multiphysics modeling and FEM; flexible electronics; biosensors and bioadhesion; soft materials and soft robotics
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