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Micromachines
Special Issues
Thermal Management Technologies and Their Applications
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Thermal Management Technologies and Their Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (30 April 2023) | Viewed by 3486

Special Issue Editors

Prof. Dr. Yulong Ji

E-Mail Website
Guest Editor
Marine Engineering College, Dalian Maritime University, No. 1 Linghai Road, Ganjingzi District, Dalian 116026, China
Interests: phase change heat transfer; oscillating heat pipe; thermal interface materials; marine energy saving
Special Issues, Collections and Topics in MDPI journals
Dr. Chao Chang

E-Mail Website
Guest Editor
Institute of Marine Engineering and Thermal Science, Marine Engineering College, Dalian Maritime University, Dalian 116026, China
Interests: thermal management materials and technology; renewable thermal materials
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

As the modern electronic devices are becoming increasing compact, multifunctional and powerful, the heat fluxes generated by internal electronic components increase dramatically during operation, resulting in heat dissipation becoming an escalating issue for product development. Efficient thermal management is critically important to guarantee the performance and service life of electronic devices, such as high-power LEDs, highly integrated batteries, miniaturized CPU and other electronic systems. Various thermal management technologies have been developed during the last few decades, including heat sinks, heat pipes, microchannels, thermoelectric cooling, and phase change materials. Although the extensive efforts of academic and industrial researchers have been done, there are still many significant limitations and challenges in the current thermal management technologies. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (1) the novel design, fabrication, simulation and modeling of thermal management technologies; and (2) applications of newly designed thermal management technologies for any kind in electronics, battery systems, industry, space, or other high-power systems.

We look forward to your submissions!

Prof. Dr. Yulong Ji
Dr. Chao Chang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Prof. Dr. Yulong Ji
Dr. Chao Chang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal management
  • heat transfer
  • heat pipe
  • phase change materials
  • microchannel
  • multiphase flow
  • application

Published Papers (2 papers)

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Research

17 pages, 6494 KiB  
Article
Numerical Study on the Evaporation of a Non-Spherical Sessile Droplet
by Wenbin Cui, Yang Cao, Shoupei Wang, Tianci Zhang, Hongbin Ma, Chao Chang, Dalong Liang and Jingming Dong
Micromachines 2023, 14(1), 76; https://doi.org/10.3390/mi14010076 - 28 Dec 2022
Cited by 3 | Viewed by 1318
Abstract
To better understand the evaporation of a non-spherical droplet, a two-dimensional simulation was conducted to investigate the evaporation on the asymmetric cross-section of non-spherical sessile droplets, which are characterized by two curvatures with two different contact angles on both sides. The temperature distribution, [...] Read more.
To better understand the evaporation of a non-spherical droplet, a two-dimensional simulation was conducted to investigate the evaporation on the asymmetric cross-section of non-spherical sessile droplets, which are characterized by two curvatures with two different contact angles on both sides. The temperature distribution, internal flow, and evaporation flux distribution at a quasi-steady state were revealed to be different from the spherical droplets. When heated from the substrate, the lowest surface temperature moves to the side of higher curvature or larger contact angle, forming a single vortex in the droplet. This single-vortex formation continues to be enhanced by enlarging the contact angle discrepancy. Unlike spherical droplets, the smaller curvature side of a non-spherical sessile droplet will release more evaporation flux. In addition, it is found that the non-spherical sessile droplets could surpass the spherical sessile droplets in evaporation flux. Full article
(This article belongs to the Special Issue Thermal Management Technologies and Their Applications)
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9 pages, 1739 KiB  
Article
Heat Transfer Performance of 3D-Printed Aluminium Flat-Plate Oscillating Heat Pipes for the Thermal Management of LEDs
by Chao Chang, Yaoguang Yang, Lilin Pei, Zhaoyang Han, Xiu Xiao and Yulong Ji
Micromachines 2022, 13(11), 1949; https://doi.org/10.3390/mi13111949 - 11 Nov 2022
Cited by 5 | Viewed by 1827
Abstract
With the rapid development of electronic technologies towards high integration, high power and miniaturization, thermal management has become an increasingly important issue to guarantee the reliability and service life of electronic devices. The oscillating heat pipe (OHP), which was governed by thermally excited [...] Read more.
With the rapid development of electronic technologies towards high integration, high power and miniaturization, thermal management has become an increasingly important issue to guarantee the reliability and service life of electronic devices. The oscillating heat pipe (OHP), which was governed by thermally excited oscillating motion, was considered as a promising technology to dissipate high-density heat and had excellent application prospects in many important industrial processes. A flat-plate OHP, however, was fabricated by traditional welding methods, which were difficult and inefficient, resulting in increasing the cost and wasting the production time. In this work, we adopted a new metal 3D printing technology to develop an aluminum flat-plate OHP, which made it facile to build complex inner channels with high-precision molding at one time. AlSi10Mg powders, as raw materials, were selectively melted and solidified to form the container of the flat-plate OHP. The sintered inner surface presented excellent wettability to the working fluid, which facilitated the evaporation of the working fluid. Acetone was chosen as the working fluid, and the filling ratios with a range of 40–70% were loaded into the flat-plate oscillating heat pipe to analyze its effect on heat transfer performance. It was found that the 3D-printed flat-plate OHP with a 60% filling ratio had a better heat transfer performance and a lower thermal resistance, and it was able to work properly in both vertical and horizontal operation modes. The 3D-printed flat-plate OHP had been successfully applied for the thermal management of high-power LEDs, and the results showed that the temperature of LEDs was maintained within 60 °C, and its service life was prolonged. Full article
(This article belongs to the Special Issue Thermal Management Technologies and Their Applications)
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