Silicon Photonics Bloom, Volume II

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: closed (30 April 2021) | Viewed by 3182

Special Issue Editors


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Guest Editor
Electrical Engineering and Computer Science, University of California, Irvine, CA 92697, USA
Interests: silicon photonics; integrated optics; microwave photonics; optical communication systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Electrical and Computer Engineering, University of California, Santa Barbara, CA 93117, USA
Interests: integrated photonics; planar optical waveguides; optical reference cavity; laser stabilization, leaky wave antennas; plasmonics; optomechanics; micro/nano fabrication
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The open access journal Micromachines invites manuscript submissions for the Special Issue “Silicon Photonics Bloom, Volume II”. The past two decades have witnessed tremendous growth in silicon photonics. Lab-scale research on simple passive component designs is now being expanded by on-chip hybrid systems architectures. With the recent injection of government and private funding, we are living the 1980s of the electronic industry, when the first merchant foundries were established. Soon, we will see more and more merchant foundries proposing well-established electronic design tools, product development kits, and mature component libraries. The open access journal Micromachines invites the submission of manuscripts in the developing area of silicon photonics. This Special Issue will highlight recent developments in this cutting-edge technology. Areas of interest include, but are not limited to, the following sub-categories:

  • Optoelectronic integration
  • New silicon and silicon nitride active and passive component designs
  • Novel light sources on silicon platforms
  • High-speed detectors for silicon photonics
  • High-Q resonators
  • New fabrication techniques
  • Hybrid integration of silicon with other semiconductors or solid-state crystals
  • Silicon-based high-speed modulators
  • Silicon-based short-distance optical communication systems and architectures
  • Beam-steering and beam-shaping architectures
  • Silicon-based RF compared to fiber or microwave photonics
  • Silicon-based biophotonics
  • Novel integrated sensors
  • Silicon photonics for space applications
  • Niche applications of silicon photonics

Dr. Ozdal Boyraz
Dr. Qiancheng Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Silicon photonics
  • Photonic-integrated circuits
  • Silicon photodetectors
  • Planar phased-array antennas
  • Silicon beam-steering devices
  • Photonic optomechanics
  • Hybrid photonic-integrated circuits
  • Optoelectronic integration

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Published Papers (1 paper)

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Research

12 pages, 2635 KiB  
Communication
Broadband High-Efficiency Grating Couplers for Perfectly Vertical Fiber-to-Chip Coupling Enhanced by Fabry-Perot-like Cavity
by Zan Zhang, Beiju Huang, Zanyun Zhang, Chuantong Cheng, Bing Bai, Tianxi Gao, Xiaobo Xu, Wenping Gu, Lin Zhang and Hongda Chen
Micromachines 2020, 11(9), 859; https://doi.org/10.3390/mi11090859 - 17 Sep 2020
Cited by 1 | Viewed by 2872
Abstract
We propose a broadband high-efficiency grating coupler for perfectly vertical fiber-to-chip coupling. The up-reflection is reduced, hence enhanced coupling efficiency is achieved with the help of a Fabry-Perot-like cavity composed of a silicon nitride reflector and the grating itself. With the theory of [...] Read more.
We propose a broadband high-efficiency grating coupler for perfectly vertical fiber-to-chip coupling. The up-reflection is reduced, hence enhanced coupling efficiency is achieved with the help of a Fabry-Perot-like cavity composed of a silicon nitride reflector and the grating itself. With the theory of the Fabry-Perot cavity, the dimensional parameters of the coupler are investigated. With the optimized parameters, up-reflection in the C-band is reduced from 10.6% to 5%, resulting in an enhanced coupling efficiency of 80.3%, with a 1-dB bandwidth of 58 nm, which covers the entire C-band. The minimum feature size of the proposed structure is over 219 nm, which makes our design easy to fabricate through 248 nm deep-UV lithography, and lowers the fabrication cost. The proposed design has potential in efficient and fabrication-tolerant interfacing applications, between off-chip light sources and integrated chips that can be mass-produced. Full article
(This article belongs to the Special Issue Silicon Photonics Bloom, Volume II)
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