Recent Advances in Ultra-Thin Chips
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: closed (31 October 2022) | Viewed by 488
Special Issue Editor
Interests: analogue/mixed signal IC design; biomedical circuits; LiDAR readout circuits; wearable systems; ultra-thin chips
Special Issue Information
Dear Colleagues,
A new paradigm of silicon technology is the ultra-thin chip (UTC) technology and its emerging applications. Very thin integrated circuits (ICs) with through-silicon vias (TSVs) will allow the stacking and interconnection of multiple dies in a compact format, allowing a migration towards three-dimensional ICs (3D-Ics). Additionally, extremely thin and, therefore, mechanically bendable silicon chips in conjunction with the emerging thin-film and organic semiconductor technologies will enhance the performance and functionality of large-area flexible electronic systems. However, UTC technology requires special attention related to the circuit design, fabrication, dicing, and handling of ultra-thin chips as they have different physical properties compared to their bulky counterparts. Additionally, transistors and other active devices on UTCs experiencing variable bending stresses will suffer from the piezoresistive effect of silicon substrate which results in a shift of their operating point and therefore, an additional aspect should be considered during circuit design. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (a) novel designs, fabrication, handling, control, and modeling of devices and circuits on ultra-thin substrates and (b) new developments in applying ultra-thin chips of any kind in consumer electronics, biomedical electronics, optical communications, LiDAR, industry, medicine, food, agriculture, space, or defense.
Dr. Anastasios Vilouras
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- ultra-thin chip applications (consumer electronics, biomedical electronics, optical COMMUNICATIONS, LiDAR, industry, medicine, food, agriculture, space, or defense)
- thin silicon body CMOS circuits and systems
- circuits and systems on thin-body substrates
- modelling of devices and circuits on thin-body substrates
- ultra-thin chip technology
- thinning-down techniques
- 3D-stacking
- flexible electronic systems
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
