Selected Papers from the 25th EuroSimE Conference

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 30 September 2024 | Viewed by 167

Special Issue Editors


E-Mail Website
Guest Editor
Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Interests: solid-state lighting; microelectronics and microsystems technologies; virtual prototyping; virtual reliability qualification; designing for reliability of microelectronics and microsystems
Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Interests: LED packaging and system integration; prognostics and health management; wide bandgap power electronics packaging and reliability modeling
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

On behalf of the Editorial Board, we are pleased to propose a selection of papers presented at the 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurosimE 2024) held in Catania, Italy, April 7–10 2024 (https://www.eurosime.org/). EuroSimE is the only annual international conference with a focus on thermal, mechanical and multiphysical simulations and experiments for microelectronics and microsystems. The first conference was held in 2000 by the COMPETE network, sponsored by the European Commission, to meet the research and development needs of the microelectronics and microsystems fields. Since then, EuroSimE has garnered worldwide attention with participants from more than 30 countries, spanning all continents, and is a fully sponsored IEEE CPMT technical event. The EuroSimE conference has earned a reputation for having a high scientific and technical quality. We hope that this Special Issue will be helpful. We also welcome your feedback and suggestions for improvement, with the aim of providing you with valuable references in the future. We would also like to sincerely thank the journal Micromachines for its editorial support and constant assistance throughout the preparation of this Special Issue.

Prof. Dr. Willem Van Driel
Dr. Jiajie Fan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS/NEMS
  • microelectronics
  • microsystems
  • reliability
  • simulation and modeling

Published Papers

This special issue is now open for submission.
Back to TopTop