Small-Scale Mechanical Behaviors in Advanced Engineering Materials
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 450
Special Issue Editors
Interests: nanoindentation; sub-micron fabrication; nanomechanics; thin film delaminations; integrate circuits; cell immobilization; morphology control of cells
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Mechanical failures of high-tech devices, such as nanoelectronics and microelectromechanical systems, are often caused by factors like process-induced residual stresses, adhesion, mechanical wear, or mechanical deformation during fabrication. Therefore, understanding the small-scale mechanical properties of materials is essential for the commercial success of future technologies. Advanced mechanical characterization techniques, including nanoindentation and atomic force microscope-based methods, have proven to be crucial in understanding these complex material behaviors. This Special Issue, titled ‘Small-Scale Mechanical Behaviors in Advanced Engineering Materials’, invites researchers from both industry and academia to present their recent work in areas such as nanoindentation, micro- and nano-tribology (friction, wear, and lubrication), interfacial adhesion, chemical mechanical polish (CMP), and fracture mechanics, as such studies are crucial for enhancing the performance and reliability of advanced technological devices. These devices include, but are not limited to, nanoelectronics, microelectromechanical, biomaterials, medical implants, energy storage devices, and aerospace components. Manuscripts focusing on biological specimens are also welcome. Topic of interests include, but are not limited to, the following:
- Small-scale mechanical properties;
- Nano-tribology and wear;
- Nanoindentation and contact mechanics;
- Chemical Mechanical Polish (CMP);
- Mechanical wear in biomedical implant materials;
- Biological cell adhesion on surfaces.
Dr. Ting Tsui
Dr. Nitya Nand Gosvami
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- small-scale mechanical properties
- nano-tribology and wear
- nanoindentation and contact mechanics
- chemical mechanical polish (CMP)
- mechanical wear in biomedical implant materials
- biological cell adhesion on surfaces
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