Recent Advances in MEMS Pressure Sensors
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (15 October 2021) | Viewed by 4646
Special Issue Editors
Interests: micro-nano fabrication technology and intelligent sensors; micromachined ultrasonic transducers; quantum sensors
Special Issues, Collections and Topics in MDPI journals
Interests: MEMS sensors; CMUTs; PMUTs; flexible electronics & wearable sensors
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
MEMS pressure sensors are highly demanded in many fields, such as industrial processing, automobiles, daily electronic products, clinical medicine and aerospace, because of their miniature sizes, low power consumption, high sensitivity and ability to be integrated with ICs. In the past few decades, a great number of studies have been conducted on the design, modeling and fabrication of MEMS pressure sensors. Remarkable progress has been achieved in improving their performance, such as sensitivity, resolution, linearity, stability and measuring accuracy. However, with the increasing requirements and expanding scope of practical applications, new challenges are arising that require continuous efforts to address. For instance, low-pressure sensors are required to detect subtle pressure changes in clinical medicine. Ultra-low-pressure sensors are required for monitoring vacuums in MEMS processes. Besides these new requirements regarding pressure detection ranges, the working environments also vary. For example, MEMS pressure sensors for aerospace should be able to work, and maintain their stability and reliability, in extremely harsh conditions, such as under strong vibration and in ultra-high- or ultra-low-temperature environments. To address these newly raised and unmet requirements in practical applications, a vast number of investigations should be carried out to innovate modeling, design, fabrication and packaging technologies for MEMS pressure sensors.
Therefore, this Special Issue focuses on recent advances in modeling, design, fabrication and packaging technologies for MEMS pressure sensors. Both original research and review papers are welcome.
Prof. Dr. Libo Zhao
Dr. Zhikang Li
Guest Editors
Manuscript Submission Information
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Keywords
- MEMS Pressure Sensors
- Principle Innovation
- Structure Design
- Theoretical Modeling
- Fabrication
- Packaging Technologies
- Signal Processing Circuits
- Performance Enhancement
- Extreme Pressure Detection
- Extremely Harsh Working Environment
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