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Smart Material-Based Micromechatronics in Soft Robotics

This special issue belongs to the section “A:Physics“.

Special Issue Information

Dear Colleagues,

Soft robotics has become an intensive research area focusing on intelligent structures and mechanisms with highly integrated actuation and sensing functionalities. As one of the key technologies in the development of soft robotics, the community is actively looking for smart, stimuli-responsive materials that enable soft robotics to interact with unconstructed, unpredictable environments, and thus provide more comprehensive operational flexibilities than traditional rigid-body robotics.

This Special Issue is dedicated to understanding the interaction between smart materials and subsystems of soft robotics to provide a state-of-the-art pathway to achieve self-regulation, advanced manipulation, structural health monitoring, and integrated manufacturing of soft robotics. Invited and submitted manuscripts are especially welcome to investigate the cooperation and programming of light-, electrical- and thermal-responsive smart materials and metamaterials that enable embedded sensing, self-healing, self-assembly, and compliant self-actuation properties of soft robotic systems. Research on the fabrication and integration of miniaturized smart materials to enable MEMS and soft robotic electronics with integrated operational functionalities for practical applications are also strongly encouraged.

We look forward to receiving your contributions! 

Prof. Dr. Seung-Bok Choi
Guest Editor

Dr. Ziliang Kang
Dr. Fangzhou Xia
Guest Editor Assistants

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart materials
  • soft active materials
  • multifunctional materials
  • programmable materials
  • electromechanical coupling
  • soft robotics
  • stimuli-responsive
  • flexible electronics
  • soft actuators
  • soft sensors
  • piezoelectrics
  • flexible sensors
  • flexible actuators
  • wearable devices
  • physical intelligence
  • fabrication
  • integration
  • biomimetics

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Micromachines - ISSN 2072-666X