Thermal Transport and Management of Electronic Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: 28 February 2026 | Viewed by 384
Special Issue Editor
Interests: thermal transport; thermal management; solar-thermal energy; thermal measurement; carbon capture and conversion
Special Issue Information
Dear Colleagues,
Recent developments in electronic devices and components have led to significant advances in power, integration, and miniaturization. Considering the unprecedently high power density of over 100 W cm−2 currently possible in electronics, thermal management has become crucial in overcoming potential failures and resolving safety concerns; this requires deeper insights into fundamental thermal transport, thermal diagnostics, electronic packaging, and electronic cooling technologies from scientists, researchers, and engineers in the fields of HEMTs, IGBTs, lasers, and 3D-stacked chips, among others. Ongoing endeavours in cross-scale heat transfer—spanning fundamental energy carriers, thermal systems, operando thermal diagnostic tools, novel single-phase/phase-change/solid-state cooling techniques, and system-level techno-economic and life-cycle assessments—have revealed tractable solutions to push the power density towards 1000 W cm−2.
This Special Issue intends to present research papers and review articles that cover the recent advancements in the thermal transport and thermal management of high-power electronics, including thermal materials, heat dissipation techniques, thermal characterization, and thermal system analysis from both experimental and modelling perspectives. The topics in this Special Issue include, but are not limited to, the following:
- Microscale thermal transport;
- Thermal transport in electronic materials;
- Emerging thermal interface materials and phase-change materials;
- Thermal management of electronics;
- Single-phase and phase-change heat dissipation;
- Thermal modelling and simulations;
- Thermal reliability analysis of microelectronics;
- Thermal system TEA and LCA;
- Energy conversion and management.
Dr. Jian Zeng
Guest Editor
Manuscript Submission Information
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Keywords
- thermal management
- microelectronics
- thermal transport
- thermal diagnostics
- thermal materials
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