Prospect of RF MEMS Devices and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 March 2026
Special Issue Editor
Interests: applied electromagnetic; microwave; mm-wave circuits; RF MEMS; RF MEMS/CMOS integration; energy harvesting
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
We are pleased to invite authors to submit original, high-quality research to this Special Issue, “Prospect of RF MEMS Devices and Applications”. Radio Frequency Micro-Electro-Mechanical Systems (RF MEMSs) have become a cornerstone of modern high-frequency system design, offering unparalleled benefits in terms of size, power consumption, linearity, and reconfigurability. With the increasing demand for high-speed, multi-band, and adaptive wireless communication systems, RF MEMSs are driving innovations across both the commercial and defense sectors.
This Special Issue aims to highlight recent advancements in RF MEMS device technologies, including design methodologies, physics-based modeling, FEM and multiphysics simulation, wafer-level fabrication techniques, hybrid and monolithic integration with CMOS and other IC platforms, and cutting-edge packaging and encapsulation strategies. We welcome submissions on a broad range of topics, including, but not limited to, tunable filters, reconfigurable antennas, ohmic and capacitive MEMS switches, variable capacitors, delay elements, phase shifters, and RF MEMS-based sensors.
We especially encourage the submission of papers addressing the reliability, long-term performance stability, and operation of MEMSs under extreme temperature, pressure, or radiation. Studies targeting emerging and high-impact applications—such as 5G/6G communications, millimeter-wave and terahertz systems, spaceborne and satellite payloads, IoT, automotive radar, and conformal or wearable electronics—are of particular interest.
Both theoretical and experimental contributions are welcome. This includes new device concepts, fabrication breakthroughs, characterization methods, packaging schemes, or system-level demonstrations of RF MEMS integration and performance. This Special Issue seeks to bring together leading researchers and engineers from academia, government laboratories, and industry to advance global knowledge and accelerate the real-world adoption of RF MEMS devices.
Dr. Maher Bakri-Kassem
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 1. RF MEMS devices 2. tunable filters 3. reconfigurable antennas 4. MEMS switches (ohmic and capacitive) 5. CMOS-MEMS integration 6. millimeter-wave systems 7. 5G/6G communication technologies 8. wafer-level packaging 9. multiphysics modeling and simulation 10. reliability in harsh environments
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