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Editorial

Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies

by
M. Jamal Deen
Department of Electrical and Computer Engineering, School of Biomedical Engineering, McMaster University, Hamilton, ON L8S 4K1, Canada
Microelectronics 2025, 1(1), 1; https://doi.org/10.3390/microelectronics1010001
Submission received: 31 March 2025 / Accepted: 31 March 2025 / Published: 4 June 2025
Versions Notes

1. Microelectronics: Pioneering the Future of Technology

The field of microelectronics is at the heart of modern technological progress, driving innovations that span computing, communications, healthcare, and energy. From the relentless miniaturization of semiconductor devices to breakthroughs in neuromorphic computing and quantum-integrated circuits, microelectronics continues to push the boundaries of science and engineering. Yet, as we confront the challenges of post-Moore’s Law scaling [1], sustainable manufacturing [2], and the global demand for smarter, energy-efficient technologies, interdisciplinary collaboration and transformative research have become more critical than ever.
We are thrilled to announce the launch of Microelectronics (https://www.mdpi.com/journal/microelectronics) (accessed on 1 January 2025) (ISSN: 3042-5344), a peer-reviewed, open-access journal dedicated to advancing innovation across all facets of microelectronic science and technology. Established in September 2024, Microelectronics serves as a global platform for researchers, engineers, and industry leaders to address emerging challenges and unlock new opportunities in the field.

2. Announcing Microelectronics: A Catalyst for Cutting-Edge Research

Microelectronics bridges academia, industry, and policymakers, fostering cutting-edge research to develop sustainable, energy-efficient solutions for tomorrow’s technologies. We invite scholars and innovators to contribute high-impact research on the latest advancements in microelectronics, including theoretical breakthroughs, experimental validations, and real-world applications. Our scope encompasses the following:
  • Device Design and Engineering: Transistor technologies, MEMS/NEMS devices [3], power devices, RF/microwave components, optoelectronic and photonic devices [4], neuromorphic computing devices, flexible and bioelectronic devices, heterogeneous integration and chiplet-based systems [5].
  • Circuit Design and System Integration: Analog/digital/mixed-signal IC design, System-on-Chip (SoC) and embedded systems, Electronic Design Automation (EDA) [6], AI-driven circuit architectures [7], High-speed interfaces.
  • Applications and Emerging Technologies: Sustainable microelectronics manufacturing [8], biomedical and automotive electronics [9] (sensors, diagnostics, and AI-integrated control systems), quantum computing interfaces [10], energy harvesting technologies [11].
  • Materials and Fabrication Innovations: Wide-bandgap semiconductors and 2D materials [12,13], advanced lithography and 3D integration [14], flexible and biocompatible materials.
  • Testing, Reliability, and Standards: Fault diagnosis and reliability modeling, nanoscale metrology (TEM, AFM, and compliance with industry standards).

3. Join Us in Shaping the Future

We invite researchers, engineers, and innovators worldwide to submit their groundbreaking work to Microelectronics. Whether your expertise lies in atomic-scale phenomena or system-level integration, we aim to amplify your contributions and foster collaborations that redefine the future of electronics.
Together, let us pioneer solutions that transcend traditional limits and build a smarter, more sustainable world.

Conflicts of Interest

The author declares no conflicts of interest.

References

  1. Theis, T.N.; Wong, H.-S.P. The End of Moore’s Law: A New Beginning for Information Technology. Comput. Sci. Eng. 2017, 19, 41–50. [Google Scholar] [CrossRef]
  2. Garetti, M.; Taisch, M. Sustainable Manufacturing: Trends and Research Challenges. Prod. Plan. Control 2011, 23, 83–104. [Google Scholar]
  3. Zhu, J.; Liu, X.; Shi, Q.; He, T.; Sun, Z.; Guo, X.; Liu, W.; Sulaiman, O.B.; Dong, B.; Lee, C. Development Trends and Perspectives of Future Sensors and MEMS/NEMS. Micromachines 2020, 11, 7. [Google Scholar]
  4. Deen, M.J.; Basu, P.K. Silicon Photonics—Fundamentals and Devices; John Wiley and Sons Ltd.: Hoboken, NJ, USA, 2012; p. 456. ISBN 978-0-470-51750-5. [Google Scholar]
  5. Li, T.; Hou, J.; Yan, J.; Liu, R.; Yang, H.; Sun, Z. Chiplet Heterogeneous Integration Technology—Status and Challenges. Electronics 2020, 9, 670. [Google Scholar] [CrossRef]
  6. Knechtel, J.; Kavun, E.; Regazzoni, F.; Heuser, A.; Chattopadhyay, A.; Mukhopadhyay, D.; Dey, S.; Fei, Y.; Belenky, Y.; Levi, I.; et al. Secure Composition of ICs and EDA Tools. In Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE), Grenoble, France, 9–13 March 2020; pp. 508–513. [Google Scholar]
  7. Paler, A.; Sasu, L.; Florea, A.-C.; Andonie, R. Machine Learning for Quantum Circuit Optimization. ACM Trans. Quantum Comput. 2023, 4, 1–25. [Google Scholar] [CrossRef]
  8. Liu, Y.; Shang, S.; Mo, S.; Wang, P.; Wang, H. Eco-friendly Strategies for the Material and Fabrication of Wearable Sensors. Int. J. Precis. Eng. Manuf.-Green Tech. 2021, 8, 1323–1346. [Google Scholar] [CrossRef]
  9. Basarir, F.; Al Haj, Y.; Zou, F.; De, S.; Nguyen, A.; Frey, A.; Haider, I.; Sariola, V.; Vapaavuori, J. Edible and Biodegradable Wearable Capacitive Pressure Sensors: A Paradigm Shift toward Sustainable Electronics with Bio-Based Materials. Adv. Funct. Mater. 2024, 34, 2403268. [Google Scholar]
  10. Barnes, K.M.; Buyskikh, A.; Chen, N.Y.; Gallardo, G.; Ghibaudi, M.; Ruszala, M.J.A.; Underwood, D.S.; Agarwal, A.; Lall, D.; Rungger, I.; et al. Optimising the quantum/classical interface for efficiency and portability with a multi-level hardware abstraction layer for quantum computers. EPJ Quantum Technol. 2023, 10, 36. [Google Scholar] [CrossRef]
  11. Zhao, L.-C.; Zou, H.-X.; Wei, K.-X.; Zhou, S.-X.; Meng, G.; Zhang, W.-M. Mechanical Intelligent Energy Harvesting: From Methodology to Applications. Adv. Energy Mater. 2023, 13, 2300557. [Google Scholar] [CrossRef]
  12. Li, Z.; Yan, T.; Fang, X. Low-Dimensional Wide-Bandgap Semiconductors for UV Photodetectors. Nat. Rev. Mater. 2023, 8, 587–603. [Google Scholar]
  13. Liu, C.; Chen, H.; Wang, S.; Liu, Q.; Jiang, Y.-G.; Zhang, D.W.; Liu, M.; Zhou, P. Two-Dimensional Materials for Next-Generation Computing. Nat. Nanotechnol. 2020, 15, 545–557. [Google Scholar]
  14. Levinson, H.J. High-NA EUV Lithography: Current Status and Outlook. Jpn. J. Appl. Phys. 2022, 61, SD0803. [Google Scholar]

Short Biography of Author

Microelectronics 01 00001 i001Prof. Dr. M. Jamal Deen is a Distinguished University Professor at McMaster University. His research interests are nano-/opto-electronics, nanotechnology, data analytics, and their applications to health and environmental sciences. His research record includes more than 930 peer-reviewed articles, two textbooks, six awarded patents extensively used in industry, and 26 best paper/poster/presentation awards. As an undergraduate, he was the top-ranked mathematics and physics student and the second ranked student at the university, winning the Chancellor’s gold medal and the Irving Adler prize. As a graduate student, he was a Fulbright LASPAU Scholar and an American Vacuum Society Scholar. As an educator, he won the IEEE Canada’s Ham Education Medal, the McMaster President’s Award for Excellence in Graduate Supervision, and MSU Macademics’ Lifetime Achievement Award for his exceptional dedication to teaching. His other awards and honors include the Callinan Award and the Electronics and Photonics Award from the Electrochemical Society (ECS); a Humboldt Research Award; the Eadie Medal from the Royal Society of Canada (RSC); the McNaughton Gold Medal, Fessenden Medal, and Gotlieb Medal, all from IEEE Canada. He was awarded five honorary doctorate degrees in recognition of his exceptional research, scholarly and education accomplishments, exemplary professionalism, and valued services. He is elected by his peers to Fellow status in thirteen national academies and professional societies, including RSC, IEEE, ECS, and the American Physical Society. Recently, he was appointed to the Order of Canada. He served as President of the Academy of Science, RSC, from 2015 to 2017.
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Share and Cite

MDPI and ACS Style

Deen, M.J. Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies. Microelectronics 2025, 1, 1. https://doi.org/10.3390/microelectronics1010001

AMA Style

Deen MJ. Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies. Microelectronics. 2025; 1(1):1. https://doi.org/10.3390/microelectronics1010001

Chicago/Turabian Style

Deen, M. Jamal. 2025. "Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies" Microelectronics 1, no. 1: 1. https://doi.org/10.3390/microelectronics1010001

APA Style

Deen, M. J. (2025). Microelectronics—An Open-Access Journal for Advancing Microelectronics Technologies. Microelectronics, 1(1), 1. https://doi.org/10.3390/microelectronics1010001

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