Special Issue "Thermography Technique in Materials Science"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Structure Analysis and Characterization".

Deadline for manuscript submissions: 31 December 2020.

Special Issue Editor

Prof. Vladimir Vavilov
Guest Editor
National Research Tomsk Polytechnic University, Tomsk, Russia
Interests: nondestructive testing, infrared thermography, active thermal testing, image processing, heat conduction, numerical modeling

Special Issue Information

Dear Colleagues,

For several years, we have experienced a revolution in material science in aerospace and other hi-tech industries. Metal structures, which were subject to corrosion and fatigue damage, are now being made of composites and ceramics. The importance of infrared nondestructive testing (IRNDT) has greatly increased in the last decade due to its effectiveness in the inspection of composite and ceramic materials. Two challenging research fields for IR thermography are the detection of structural defects in composite materials and the characterization of the thermal properties of novel anisotropic materials. The goal of this Special Issue is to provide a platform for sharing newly-found knowledge and experience in the development of both hardware and software for IRNDT.

This Special Issue invites original submissions that reflect recent achievements in IRNDT and the characterization of materials by the use of both passive and active infrared thermography.

Prof. Vladimir Vavilov
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • infrared thermography
  • nondestructive testing
  • composite
  • ceramics
  • coating
  • material damage
  • mechanical stress
  • structural defects
  • defect characterization
  • thermal properties
  • image processing
  • heat conduction
  • optical heating
  • convective heating
  • inductive heating

Published Papers

This special issue is now open for submission.
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