Special Issue "Smart Materials for Micro Electro Mechanical Systems (MEMS)"
Deadline for manuscript submissions: 31 August 2020.
Interests: piezoelectrics; energy harvesting; acoustic resonators; flexible/stretchable electronics; stimuli responsive polymers
This Special Issue on “Smart Materials for Micro Electro Mechanicanical Systems (MEMS)” for Materials will publish original work focusing on the development of smart materials with a MEMS target application. Papers can include areas focusing on fabrication techniques, material characterization, the development of novel materials, enhancing material properties, integration with MEMS, sensing, and actuation. MEMS applications of interest include energy conversion, BioMEMS, resonators, sensors, and actuators.
Smart or functional materials are often the key components required to allow the MEMS device to operate, and therefore they should be the main focus of the submitted manuscript. Significant advances in this area continue to enhance MEMS performance, and novel material or integration techniques allow next generation MEMS devices to be developed. Possible smart materials range from but are not limited to piezoelectrics, magnetcs, photonics, triboelectrics, stimuli-responsive polymers, composites, hybrids, flexible/stretchable, photomechanical, and shape memory materials. Methods of depositing MEMS materials using additive manufacturing methods are also welcome. Manuscripts should focus on the smart material developed, but should also include information on the entended MEMS device or application.
It is my pleasure to invite you to submit an original manuscript to this Special Issue. Full communications and review papers are welcome.
Assist. Prof. Nathan Jackson
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- functional materials
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Nonlinear deflection analysis of micro awl-shaped serpentine springs for in-plane deformation
Authors: Meng-Ju Lin*, Hui-Min Chou+, and Rongshun Chen+
* Department of Mechanical and Computer-Aided Engineering, Feng Chia University
+ Department of Power Mechanical Engineering, National Tsing Hua University
The nonlinear deflections of micro awl-shaped serpentine microsprings for providing in-plane deformation area are investigated. The spring constants of micro awl-shaped serpentine microsprings for in-plane motion are theoretically derived. A finite element method software COMSOL Multiphysics is used for furthermore numerical analysis. These micro awl-shaped serpentine springs are successfully fabricated by silicon based micromachining on a silicon-on-insulator wafer. The experimental results agree well with theoretical solution and numerical results. The results show that the geometry of micro awl-shaped serpentine springs would affect the nonlinearity of spring deflections. The taper angle has the most significant effect on nonlinearity. Springs with larger taper angle and turn number and smaller thickness and width of beam would more easily induce nonlinear deformation. The stresses of the awl-shaped springs when the nonlinearity happened are investigated by numerical analysis. It is also found that geometry of spring would affect the stress when the nonlinear behaviors of springs happen. Taper angles also have significant effect on the stresses. However, number of turns of spring has no obvious effect on the stress when the nonlinearity of springs happens.