Special Issue "The Fabrication of Compact and Porous Semiconductor Metal Oxide Layers"
Deadline for manuscript submissions: closed (29 February 2020).
At present, semiconductor metal oxides are used in a great variety of commercially available technologies. Thin layers of these materials can now be manufactured at small and large scale to produce self-cleaning surfaces, electrodes for energy systems (photovoltaics, hydrogen generation, batteries, etc.), smart colour-changing windows, electronics, gas sensors, and environmental monitoring, and for many other applications. The fabrication of compact semiconductor metal oxide films tends to rely on techniques such as chemical or physical vapour deposition, atomic layer deposition, wet chemical methods (dip/spin/slot-die coating, electrochemical deposition, spray pyrolysis, ink-jet printing, etc.). Many of these have been succesfully transfered from laboratories to manufacturing plants; however, there is still a great need for continuing the development of these routes to lower our global mass manufacturing carbon foot print and make advanced technologies available to a wider community. Porous semiconductor metal oxide layers, especially micro- and mesoporous materials, offer large specific surface areas, a key property for the successful development of efficient technologies in application fields, such as water purification, energy generation, and storage, or carbon capture and utilisation. However, their use in commercial products is still extremely limited, owing to the many difficulties associated with scaling up their fabrication whilst preserving their uniform structural properties, their durability, and recycling.
In this issue, we aim to capture some of the latest advances in the development of environmentally friendly deposition methods and materials for the fabrication of semiconductor metal oxide compact and porous layers.
Dr. Cecile Charbonneau
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- semiconductor metal oxide layers
- low carbon