Special Issue "Atomic Layer Deposition of Functional Materials"
Deadline for manuscript submissions: closed (10 October 2015)
Dr. Peter J. King
Atomic Layer Deposition (ALD) has become a robust industry tool for functional thin films growth, and a powerful technique to produce novel thin film materials in a research context. Within the ALD community, there still seem to be many avenues for innovation and optimization as the technique matures and diversifies.
In this Special Issue of Materials, the focus is to present new developments for Functional Materials growth by ALD. This could include: precursor design, simulation and modeling, novel materials deposition and characterization (multi-component alloys, ferroelectrics, nitrides, metals, 2D materials), and innovations with tool design.
It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are all welcome.
Dr. Peter J. King
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- functional thin films
- multi-component oxides
- 2D materials
- interface engineering
- solid-state batteries