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Laser-Based Surface Processing: Techniques, Mechanisms, and Advanced Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 21

Special Issue Editors


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Guest Editor
School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, China
Interests: laser processing; surface engineering; semiconductor packaging technology

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Guest Editor
School of Mechanical Science & Engineering, Huazhong University of Science and Technology, Wuhan, China
Interests: micro & nano manufacturing; micro & nano mechanics; reliability of microelectronic packaging micro & nano testing and measurement
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Guest Editor
School of Materials Science and Engineering, Harbin Institute of Technology, Weihai, China
Interests: laser welding; additive manufacturing; underwater laser additive remanufacturing technology and equipment; underwater welding material design and development

Special Issue Information

Dear Colleagues,

Surface engineering plays a pivotal role in enhancing the performance and functionality of materials across diverse industries. Laser-based surface processing has emerged as a powerful and versatile technique suite that offers precise control over material surface properties, enabling tailored functionalities and improved performance characteristics. This Special Issue, "Laser-Based Surface Processing: Techniques, Mechanisms, and Advanced Applications", aims to showcase the latest advancements in this rapidly evolving field, encompassing fundamental research on underlying mechanisms to cutting-edge applications in various sectors.

We invite submissions that explore the breadth of laser-based surface processing, including but not limited to laser surface modification techniques, fundamental mechanisms of laser–material interaction, advanced characterization of laser-processed surfaces, applications in emerging fields, and so on.

This Special Issue will provide a comprehensive platform for researchers and engineers to disseminate their latest findings and insights in laser-based surface processing. We anticipate that this collection of articles will contribute significantly to the advancement of the field and inspire further innovation in surface engineering for advanced materials and applications.

Dr. Yuhua Huang
Prof. Dr. Fulong Zhu
Dr. Yunlong Fu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • laser surface processing
  • laser surface modification
  • laser texturing
  • laser–material interaction
  • additive manufacturing
  • laser processing monitors

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Published Papers

This special issue is now open for submission.
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