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Advances in Silicon Carbide (SiC) and Related Materials: Structure Design, Fabrication and Application

This special issue belongs to the section “Advanced and Functional Ceramics and Glasses“.

Special Issue Information

Dear Colleagues,

Silicon carbide (SiC), with its exceptional mechanical properties, high-temperature stability, radiation resistance, and excellent chemical inertness, has shown great potential for applications in nuclear energy, aerospace, and electronic semiconductor devices. This Special Issue focuses on the fabrication, optimization, and multi-scale simulation of SiC and related materials, their performance under extreme conditions in advanced nuclear systems and aerospace applications (including high-temperature mechanical properties, corrosion resistance, and radiation tolerance), and the latest advancements in SiC electronic and semiconductor devices, functional coatings, and surface modification technologies. By optimizing fabrication processes, tailoring microstructures and macrostructures, enhancing heterogeneous interface bonding strength, and improving overall material performance, the goal is to further advance the application and development of SiC and related materials in extreme environments.

Dr. Chong Wei
Dr. Bin Liang
Dr. Marcin Chmielewski
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • SiC materials
  • SiC-based composites
  • extreme environment performance
  • multi-scale structural design
  • fabrication technology
  • nuclear applications
  • electronic devices

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Published Papers

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Materials - ISSN 1996-1944