Advances in Silicon Carbide (SiC) and Related Materials: Structure Design, Fabrication and Application
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced and Functional Ceramics and Glasses".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 37
Special Issue Editors
Interests: ceramic sintering; freeze-casting; heterogenous composite
Interests: multifunctional structural silicon-based ceramics (e.g., SiC, SiBCN) and ceramic matrix composites; 2D materials (graphene, MXenes) and energy storage materials (ceramic electrolyte)
Special Issue Information
Dear Colleagues,
Silicon carbide (SiC), with its exceptional mechanical properties, high-temperature stability, radiation resistance, and excellent chemical inertness, has shown great potential for applications in nuclear energy, aerospace, and electronic semiconductor devices. This Special Issue focuses on the fabrication, optimization, and multi-scale simulation of SiC and related materials, their performance under extreme conditions in advanced nuclear systems and aerospace applications (including high-temperature mechanical properties, corrosion resistance, and radiation tolerance), and the latest advancements in SiC electronic and semiconductor devices, functional coatings, and surface modification technologies. By optimizing fabrication processes, tailoring microstructures and macrostructures, enhancing heterogeneous interface bonding strength, and improving overall material performance, the goal is to further advance the application and development of SiC and related materials in extreme environments.
Dr. Chong Wei
Dr. Bin Liang
Dr. Marcin Chmielewski
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- SiC materials
- SiC-based composites
- extreme environment performance
- multi-scale structural design
- fabrication technology
- nuclear applications
- electronic devices
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.