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Advances in Silicon Carbide (SiC) and Related Materials: Structure Design, Fabrication and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced and Functional Ceramics and Glasses".

Deadline for manuscript submissions: 20 June 2026 | Viewed by 1316

Special Issue Editors

School of Mechanics and Civil Architecture, Northwestern Polytechnical University, Xi'an 710072, China
Interests: ceramic sintering; freeze-casting; heterogenous composite

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Guest Editor
Shi-Changxu Innovation Center for Advanced Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Interests: multifunctional structural silicon-based ceramics (e.g., SiC, SiBCN) and ceramic matrix composites; 2D materials (graphene, MXenes) and energy storage materials (ceramic electrolyte)

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Guest Editor
Institute of Microelectronics and Photonics, 32/46 Al. Lotników, 02-668 Warsaw, Poland
Interests: SiC-based composite materials; metal-ceramic interface; interfacial reactions, microstructural evolution; mechanical, thermal, and chemical stability

Special Issue Information

Dear Colleagues,

Silicon carbide (SiC), with its exceptional mechanical properties, high-temperature stability, radiation resistance, and excellent chemical inertness, has shown great potential for applications in nuclear energy, aerospace, and electronic semiconductor devices. This Special Issue focuses on the fabrication, optimization, and multi-scale simulation of SiC and related materials, their performance under extreme conditions in advanced nuclear systems and aerospace applications (including high-temperature mechanical properties, corrosion resistance, and radiation tolerance), and the latest advancements in SiC electronic and semiconductor devices, functional coatings, and surface modification technologies. By optimizing fabrication processes, tailoring microstructures and macrostructures, enhancing heterogeneous interface bonding strength, and improving overall material performance, the goal is to further advance the application and development of SiC and related materials in extreme environments.

Dr. Chong Wei
Dr. Bin Liang
Dr. Marcin Chmielewski
Guest Editors

Manuscript Submission Information

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Keywords

  • SiC materials
  • SiC-based composites
  • extreme environment performance
  • multi-scale structural design
  • fabrication technology
  • nuclear applications
  • electronic devices

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Published Papers (2 papers)

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Research

18 pages, 3587 KB  
Article
Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes
by Hu Li, Yanjiao Jiang, Yujia Yang, Jianyu Yang and Lida Zhu
Materials 2026, 19(2), 397; https://doi.org/10.3390/ma19020397 - 19 Jan 2026
Viewed by 271
Abstract
When grinding silicon carbide, surface and subsurface damage have a significant impact on the product’s surface quality. One method to control the crack dimensions is laser irradiation on the SiC surface. The effect of this method on the grinding process is analyzed in [...] Read more.
When grinding silicon carbide, surface and subsurface damage have a significant impact on the product’s surface quality. One method to control the crack dimensions is laser irradiation on the SiC surface. The effect of this method on the grinding process is analyzed in this study. A series of experiments was carried out based on an orthogonal experimental design, with systematic adjustments made to laser parameters, including pulse energy (current), laser spot spacing, scanning times, and grinding process parameters. During the experiments, the grinding force was monitored by a dynamometer, and the specific grinding energy was calculated accordingly. Pulsed engraving laser modification effectively reduced the hardness of the ceramic surface layer by about 20%. The median and radial crack sizes induced by the laser in the subsurface layer ranged from 20.4 μm to 54.3 μm. This effectively inhibited further propagation of median and radial cracks during the grinding processes. Simultaneously, the tangential grinding force Ft was reduced by 30%. These conclusions were obtained through corresponding experiments that link surface roughness to laser power and grinding parameters. Using laser-induced controllable crack characteristics in the grinding process allow damage from surface and subsurface grinding to be controlled in brittle materials. Full article
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13 pages, 3843 KB  
Article
Application of UV Laser for Ohmic Contact Formation on 4H-SiC
by Andrzej Kubiak, Janusz Wozny, Izabela Bobowska and Alessandro Verdolotti
Materials 2025, 18(21), 4946; https://doi.org/10.3390/ma18214946 - 29 Oct 2025
Viewed by 672
Abstract
In this paper, we demonstrate a simplified method for fabricating ohmic contacts on 4H-SiC substrates using pulsed UV laser surface modification followed by application of a silver-based conductive adhesive. Even a small number of laser passes significantly improved the contact interface, while ten [...] Read more.
In this paper, we demonstrate a simplified method for fabricating ohmic contacts on 4H-SiC substrates using pulsed UV laser surface modification followed by application of a silver-based conductive adhesive. Even a small number of laser passes significantly improved the contact interface, while ten or more repetitions produced linear I–V characteristics with low voltage drops. SEM analysis revealed surface ablation and an expanded effective area of the contact. Raman spectroscopy proved that laser processing leads to surface amorphization of the SiC sample. DFT simulations showed that the amorphous SiC layer is a material with no band gap, explaining the elimination of the Schottky barrier. Our approach enables the manufacturing of reliable, low-resistive contacts without high-temperature annealing and offers a practical route for rapid SiC device prototyping. Full article
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