Special Issue "Functional Surface Structures and Thin Solid Films"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films".

Deadline for manuscript submissions: 31 December 2020.

Special Issue Editor

Dr. Mikołaj Lewandowski
Website
Guest Editor
NanoBioMedical Centre, Adam Mickiewicz University, Umultowska 85, 61-614 Poznań, Poland
Interests: growth; structure; electronic; magnetic and catalytic properties of nanostructures at surfaces

Special Issue Information

Dear Colleagues,

We would like to invite you to contribute your work to the Special Issue of Materials titled “Functional Surface Structures and Thin Solid Films”.

Nanostructures at surfaces, such as supported nanoparticles, nanowires, molecular arrays, 2D materials, and thin solid films, exhibit unique physico-chemical properties, originating both from their low-dimensionality and the interaction with the substrate on which they grow. Recent advances in nanostructure fabrication, experimental atomic-scale characterization, and theoretical modeling, allow the determination of the structure–properties relationships in such systems and the studies of the underlying physical and chemical mechanisms. Hybrid nanostructures, such as nanoparticles supported on thin solid films or intercalated epitaxial graphene, allow us to combine the properties of different materials and fine-tune the mutual interactions through the well-defined interfaces formation. This results in a wide range of potential applications of supported nanostructures in various industrial fields, such as nanoelectronics/spintronics, data storage, heterogeneous catalysis, or gas/bio- sensing.

This Special Issue will feature articles devoted to the preparation and physico-chemical characterization of surface nanostructures, focusing on the determination of structure–properties relationships. The submission of both experimental and theoretical reports is cordially invited. We believe that “Functional Surface Structures and Thin Solid Films” will become a valuable bibliographic resource for scientists working on experimental and theoretical aspects of nanostructures at surfaces.

Dr. Mikołaj Lewandowski
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanostructures at surfaces
  • thin solid films
  • structure
  • physico-chemical properties
  • experiment
  • theory

Published Papers (3 papers)

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Research

Open AccessArticle
Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames
Materials 2020, 13(5), 1191; https://doi.org/10.3390/ma13051191 - 06 Mar 2020
Abstract
Previous studies merely focus on the hot dipping properties of lead frame materials used in electronic industry. Yet, the environmentally friendly and cost-efficient traits of hot-dipped tinning process make it a possible promising surface modification technique compared with electroplating. As a result, the [...] Read more.
Previous studies merely focus on the hot dipping properties of lead frame materials used in electronic industry. Yet, the environmentally friendly and cost-efficient traits of hot-dipped tinning process make it a possible promising surface modification technique compared with electroplating. As a result, the optimal hot-dipped tinning process routine is proposed in this paper. The hot-dipped tinning process of four different types of copper foils (C11000, C19400, C19210, and C70250), pretreatment parameters, mechanical properties of Cu substrates, thickness of IMC (intermetallic compound) layers and coatings, and microstructure of coatings were investigated to determine the copper substrate suitable for hot-dipped tinning and the optimized tinning procedures. The results indicate that a proper increase in alloying elements (e.g., Cu-Fe-P series alloys) towards Cu substrate leads to a decrease in hot dipping performance. The proper process routine is determined as alkaline cleaning→water scrubbing→accelerant solvent dipping→drying→hot-dipped tinning→cooling. The appropriate dipping temperature range is 260 to 280 °C, which assists to maintain acceptable micro hardness (i.e., maintaining at least 95% of the original hardness). The optimal dipping time should be set as 6–10 s. The proposed hot-dipped tinning process routine may present a guideline for the fabrication of tin coating in electronic industry. Full article
(This article belongs to the Special Issue Functional Surface Structures and Thin Solid Films)
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Open AccessCommunication
Size-Dependent Thermo- and Photoresponsive Plasmonic Properties of Liquid Crystalline Gold Nanoparticles
Materials 2020, 13(4), 875; https://doi.org/10.3390/ma13040875 - 15 Feb 2020
Abstract
Achieving remotely controlled, reversibly reconfigurable assemblies of plasmonic nanoparticles is a prerequisite for the development of future photonic technologies. Here, we obtained a series of gold-nanoparticle-based materials which exhibit long-range order, and which are controlled with light or thermal stimuli. The influence of [...] Read more.
Achieving remotely controlled, reversibly reconfigurable assemblies of plasmonic nanoparticles is a prerequisite for the development of future photonic technologies. Here, we obtained a series of gold-nanoparticle-based materials which exhibit long-range order, and which are controlled with light or thermal stimuli. The influence of the metallic core size and organic shell composition on the switchability is considered, with emphasis on achieving light-responsive behavior at room temperature and high yield production of nanoparticles. The latter translates to a wide size distribution of metallic cores but does not prevent their assembly into various, switchable 3D and 2D long-range ordered structures. These results provide clear guidelines as to the impact of size, size distribution, and organic shell composition on self-assembly, thus enhancing the smart design process of multi-responsive nanomaterials in a condensed state, hardly attainable by other self-assembly methods which usually require solvents. Full article
(This article belongs to the Special Issue Functional Surface Structures and Thin Solid Films)
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Open AccessArticle
The Interface and Mechanical Properties of a CVD Single Crystal Diamond Produced by Multilayered Nitrogen Doping Epitaxial Growth
Materials 2019, 12(15), 2492; https://doi.org/10.3390/ma12152492 - 06 Aug 2019
Cited by 2
Abstract
In the present investigation, a nitrogen-doped multilayer homoepitaxial single crystal diamond is synthesized on a high-pressure high temperature (HPHT) Ib-type diamond substrate using the microwave plasma chemical vapor deposition (MPCVD) method. When 0.15 sccm of nitrogen was added in the gas phase, the [...] Read more.
In the present investigation, a nitrogen-doped multilayer homoepitaxial single crystal diamond is synthesized on a high-pressure high temperature (HPHT) Ib-type diamond substrate using the microwave plasma chemical vapor deposition (MPCVD) method. When 0.15 sccm of nitrogen was added in the gas phase, the growth rate of the doped layer was about 1.7 times that of the buffer layer, and large conical and pyramidal features are formed on the surface of the sample. Raman mapping and photoluminescence imaging of the polished cross sectional slice shows a broadband emission, with a characteristic zero phonon line (ZPL) at 575 nm in the doped layers, and large compressive stress was formed in the nitrogen-doped layers. X-ray topography shows that the defects at the interface can induce dislocation. The pyramid feature is formed at the defect, and more nitrogen-related defects are formed in the pyramid region. Thin nitrogen-doped multilayers were successfully prepared, and the thickness of the nitrogen-doped and buffer layers was about 650 nm each. The indentation measurements reveal that the thin nitrogen-doped multilayers are ultra-tough (at least ~22 MPa m1/2), compared to the Ib-type HPHT seed substrate (~8 MPa m1/2) and the unintentionally doped chemical vapor deposition (CVD) single crystal diamond (~14 MPa m1/2). Full article
(This article belongs to the Special Issue Functional Surface Structures and Thin Solid Films)
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