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Open AccessArticle

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

1
Łukasiewicz Research Network—Institute of Electron Technology, Kraków Division, 30701 Krakow, Poland
2
Department of Electrotechnology, Czech Technical University in Prague, 16627 Prague, Czech Republic
3
Department of Electronics Technology, Budapest University of Technology and Economics, 1111 Budapest, Hungary
*
Author to whom correspondence should be addressed.
Materials 2020, 13(4), 968; https://doi.org/10.3390/ma13040968
Received: 27 January 2020 / Revised: 17 February 2020 / Accepted: 18 February 2020 / Published: 21 February 2020
The effect of recrystallization of 99.3Sn–0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 °C for 72 h, which caused the recrystallization of the alloy. The samples were stored at −10 and −20 °C. The β-Sn to α-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the β-Sn to α-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of β-Sn to α-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample. View Full-Text
Keywords: tin pest; recrystallization; grain size; β to α-Sn allotrope transition; SnAgCu (SAC); electrical resistance measurement tin pest; recrystallization; grain size; β to α-Sn allotrope transition; SnAgCu (SAC); electrical resistance measurement
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Skwarek, A.; Illés, B.; Hurtony, T.; Bušek, D.; Dušek, K. Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb. Materials 2020, 13, 968.

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