Special Issue "Development and Application of 3D Printing Technology in Electromagnetic Devices"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 15 May 2020.

Special Issue Editor

Dr. Dmitry Isakov
Website
Guest Editor
WMG, University of Warwick, United Kingdom
Interests: multi-material 3D printing; 4D printing; sensing technologies; metamaterials; novel RF applications; dielectrics materials; functional composite materials and applications

Special Issue Information

Dear Colleagues,

3D printing allows us to create objects with complex geometry without the need for expensive tools, which makes it an attractive manufacturing technique for both scientific research and commercial production. The latest generations of inexpensive and easy-to-use printers for additive manufacturing now provide access to mainstream markets and extend the concept of additive production from expensive and exclusive technologies to those that are easy to use and affordable. 

Thanks to the rapid development of additive production methods and the spread of these technologies to new areas, it has become possible to use these approaches for the quick prototyping of advanced devices—additive layer processes such as material extrusion, vat photopolymerisation, material jetting and their combinations are now more widely used in the research and development of bespoke engineered components with artificial functionality.

Growing interest in composite materials for 3D printing is primarily due to the fact that it offers the ability to control the properties of manufactured components by tailoring their composition and microstructure. Polymer composites containing a dispersed proportion of inorganic powder materials can provide a wide range of thermal, mechanical, and dielectric properties.

This is especially attractive field that leads to the versatile development of AM for the manufacturing of electromagnetic materials with specially designed subwavelength structures designed to exhibit strong coupling with the electrical and magnetic components of the incident electromagnetic wave. Indeed this opens up new possibilities for novel functional structures utilizing the principles of transformation optics, smart microwave devices, and systems possessing metamaterial features. 

This Special Issue is open for all contributors in the field of the application of additive technologies to electromagnetic materials and devices. We invite submissions of novel and original papers and reviews to this Special Issue from the areas that include, but are not limited to:

  • New materials for 3D printing
  • Advanced 3D-printable composites 
  • 3D-printed devices for EM applications
  • 3D printing for transformation optics
  • 3D printed phase-changeable materials
  •  AM for acoustic and thermal wave applications

Dr. Dmitry Isakov
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D printing
  • additive manufacturing
  • 4D printing
  • gradient index materials
  • AM development
  • microwave applications
  • composites
  • dielectric materials

Published Papers (1 paper)

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Research

Open AccessArticle
Fabrication of High Permittivity Resin Composite for Vat Photopolymerization 3D Printing: Morphology, Thermal, Dynamic Mechanical and Dielectric Properties
Materials 2019, 12(23), 3818; https://doi.org/10.3390/ma12233818 - 20 Nov 2019
Cited by 1
Abstract
The formulation of a high dielectric permittivity ceramic/polymer composite feedstock for daylight vat photopolymerization 3D printing (3DP) is demonstrated, targeting 3DP of devices for microwave and THz applications. The precursor is composed of a commercial visible light photo-reactive polymer (VIS-curable photopolymer) and dispersed [...] Read more.
The formulation of a high dielectric permittivity ceramic/polymer composite feedstock for daylight vat photopolymerization 3D printing (3DP) is demonstrated, targeting 3DP of devices for microwave and THz applications. The precursor is composed of a commercial visible light photo-reactive polymer (VIS-curable photopolymer) and dispersed titanium dioxide (TiO2, TO) ceramic nano-powder or calcium copper titanate (CCT) micro-powder. To provide consistent 3DP processing from the formulated feedstocks, the carefully chosen dispersant performed the double function of adjusting the overall viscosity of the photopolymer and provided good matrix-to-filler bonding. Depending on the ceramic powder content, the optimal viscosities for reproducible 3DP with resolution better than 100 µm were η(TO) = 1.20 ± 0.02 Pa.s and η(CCT) = 0.72 ± 0.05 Pa.s for 20% w/v TO/resin and 20% w/v CCT/resin composites at 0.1 s−1 respectively, thus showing a significant dependence of the “printability” on the dispersed particle sizes. The complex dielectric properties of the as-3D printed samples from pure commercial photopolymer and the bespoke ceramic/photopolymer mixes are investigated at 2.5 GHz, 5 GHz, and in the 12–18 GHz frequency range. The results show that the addition of 20% w/v of TO and CCT ceramic powder to the initial photopolymer increased the real part of the permittivity of the 3DP composites from ε’ = 2.7 ± 0.02 to ε’(TO) = 3.88 ± 0.02 and ε’(CCT) = 3.5 ± 0.02 respectively. The present work can be used as a guideline for high-resolution 3DP of structures possessing high-ε. Full article
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Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

1. Title: 3D-printed Sievenpiper metasurface using conductive filaments and electrodeposition

Authors: (1) Pablo Stuardo, (1) Francisco Pizarro, (2) Eva Rajo-Iglesias
(1) Pontificia Universidad Católica de Valparaíso, Escuela de Ingeniería Eléctrica, Valparaíso, Chile
(2) Department of Communications and Signal Theory, Universidad Carlos III de Madrid, 28911 Madrid, Spain
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