Special Issue "Development and Application of 3D Printing Technology in Electromagnetic Devices"
Deadline for manuscript submissions: 15 May 2020.
Interests: multi-material 3D printing; 4D printing; sensing technologies; metamaterials; novel RF applications; dielectrics materials; functional composite materials and applications
3D printing allows us to create objects with complex geometry without the need for expensive tools, which makes it an attractive manufacturing technique for both scientific research and commercial production. The latest generations of inexpensive and easy-to-use printers for additive manufacturing now provide access to mainstream markets and extend the concept of additive production from expensive and exclusive technologies to those that are easy to use and affordable.
Thanks to the rapid development of additive production methods and the spread of these technologies to new areas, it has become possible to use these approaches for the quick prototyping of advanced devices—additive layer processes such as material extrusion, vat photopolymerisation, material jetting and their combinations are now more widely used in the research and development of bespoke engineered components with artificial functionality.
Growing interest in composite materials for 3D printing is primarily due to the fact that it offers the ability to control the properties of manufactured components by tailoring their composition and microstructure. Polymer composites containing a dispersed proportion of inorganic powder materials can provide a wide range of thermal, mechanical, and dielectric properties.
This is especially attractive field that leads to the versatile development of AM for the manufacturing of electromagnetic materials with specially designed subwavelength structures designed to exhibit strong coupling with the electrical and magnetic components of the incident electromagnetic wave. Indeed this opens up new possibilities for novel functional structures utilizing the principles of transformation optics, smart microwave devices, and systems possessing metamaterial features.
This Special Issue is open for all contributors in the field of the application of additive technologies to electromagnetic materials and devices. We invite submissions of novel and original papers and reviews to this Special Issue from the areas that include, but are not limited to:
- New materials for 3D printing
- Advanced 3D-printable composites
- 3D-printed devices for EM applications
- 3D printing for transformation optics
- 3D printed phase-changeable materials
- AM for acoustic and thermal wave applications
Dr. Dmitry Isakov
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- 3D printing
- additive manufacturing
- 4D printing
- gradient index materials
- AM development
- microwave applications
- dielectric materials
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
1. Title: 3D-printed Sievenpiper metasurface using conductive filaments and electrodeposition