Development and Application of Adhesive Bonding in Structural, Civil, Mechanical, Aeronautical and Industrial Fields
A Special Issue of Materials (ISSN 1996-1944) belonging to the section "Advanced Composites".
Deadline for manuscript submissions: 20 December 2026 | Viewed by 485
Editors
Interests: adhesive bonding; structural bonding; adhesive connections; composite materials; composite structures; solid mechanics; aging; structural rehabilitation; high-performance fiber-reinforced concrete; metal, fission, and nuclear materials
Special Issues, Collections and Topics in MDPI journals
Interests: the multiscale modeling of the mechanical response of materials and structures; the numerical and experimental analysis of the mechanical behavior of composite material; the pre-critical and critical behavior of thin-walled beams; the mechanical behavior of concrete structures reinforced with composite materials; the analysis of masonry structures reinforced with innovative materials; the numerical-experimental analysis of structural joints between FRP adherents, hygrothermal durability of epoxy resins, and freezing and thawing durability of high-performance fiber-reinforced concrete (HPFRC)
Special Issues, Collections and Topics in MDPI journals
Interests: molecular bonding; direct bonding; adhesive bonding; structural bonding; composite materials; composite structures; polymers; solid mechanics; aging
Special Issues, Collections and Topics in MDPI journals
Interests: structure mechanics; solid mechanics; computational mechanics; contact mechanics; modeling
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Adhesive bonding has become a cornerstone technology across numerous industrial sectors, offering efficient and reliable solutions for joining both similar and dissimilar materials. The rapid evolution of adhesive technologies has transformed the way engineers design products, enabling weight reduction, improved efficiency, and entirely new functional capabilities. From simple natural glues to today’s advanced, high-performance adhesives, these materials are now integral to modern manufacturing and engineering innovation.
Unlike conventional joining techniques such as welding, riveting, or mechanical fastening, adhesive bonding distributes stresses uniformly along the bonded interface, minimizing stress concentrations and enhancing structural performance. This makes adhesive solutions particularly valuable in aerospace and automotive industries, where lightweight construction, optimized load transfer, and structural efficiency are paramount. In civil and mechanical engineering, adhesives are widely used for structural reinforcement, repair of damaged components, and joining composites, metals, and polymers. Furthermore, in industrial manufacturing, adhesive bonding supports automation by enabling rapid, clean, and reproducible assembly processes.
A key strength of adhesive bonding is its ability to unite materials that are otherwise incompatible with traditional joining methods, opening the door to innovative, multifunctional, and lightweight design solutions. Consequently, adhesives play a central role in modern engineering, offering versatility and high performance. Looking ahead, emerging advances in smart materials, nanotechnology, and bio-based chemistries are expected to further expand adhesive capabilities and applications.
This Special Issue invites high-quality contributions exploring adhesive bonding across structural, civil, mechanical, aeronautical, and industrial contexts. Topics of interest include, but are not limited to, the following: Mechanical performance, durability, fatigue, repair strategies, recycling, interfacial phenomena, surface chemistry, testing methodologies, novel adhesive materials and sealants, bonded joint design, manufacturing technologies, and theoretical, analytical, or finite element modeling approaches. By gathering the latest research and developments, this issue aims to provide a comprehensive perspective on the current state and future trends in adhesive bonding technology.
Dr. Marco Lamberti
Dr. Francesco Ascione
Dr. Aurelien Maurel-Pantel
Prof. Dr. Frédéric Lebon
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- adhesive
- fem
- interface
- cohesive
- mechanical behavior
- fracture mechanics
- experiments
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
