Emerging Materials and Technologies for Advanced Semiconductor Packaging
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 December 2026 | Viewed by 101
Special Issue Editors
Interests: soft electronic devices; electronic packaging; advanced packaging instrumentation; hybrid bonding; co-packaged optics
Special Issues, Collections and Topics in MDPI journals
Interests: electronic packaging; heterogeneous integration; opto-electronics and photonic devices; flexible interconnection; materials science
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue will address emerging technologies in semiconductor packaging, including aspects such as the design, structure, materials, processing, and testing of electronic and photonic devices. A particular focus of this Special Issue is the technologies associated with the soft design and engineering of electronic packaging, potentially for use in soft electronic devices. Electronic devices have developed rapidly with the growing necessities of high computing, low power consumption, miniaturization, and multi-functionality in storage and logic IC chips and highly integrated electronics systems. Advanced electronic packaging technologies bridge the design and use of the powerful functions of electronic devices, becoming the core driving force of future semiconductor technologies.
Smart electronics have permeated daily life and become extensions of the human body. Soft electronic packaging represents one of the most promising approaches to creating imperceptible and comfortable interfaces between people and their electronic devices. In this regard, research into advanced soft materials, structures, and design in advanced electronic packaging is in high demand for the development of soft electronic devices.
We welcome original papers on all types of advanced electronic packaging technologies involving designs, structures, materials, processing, and testing. Of particular interest are recent developments in soft materials, structures, processes, and devices. Articles and reviews investigating electronic packaging technologies in wearable electronics and photonic devices are also particularly welcome.
Dr. Yue Gu
Dr. Yongjun Huo
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- hybrid bonding
- soft electronic and photonic devices
- co-packaged optics
- thermal management
- intrinsically soft materials
- flexible and stretchable structures
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
