Numerical and Experimental Insights into Thermal, Mechanical and Electrical Behavior of Carbon-Based Nanocomposites
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Carbon Materials".
Deadline for manuscript submissions: 20 September 2026 | Viewed by 173
Special Issue Editors
2. OLEM, Institute of Mechanics, Bulgarian Academy of Sciences, 1113 Sofia, Bulgaria
Interests: electromagnetic, mechanical and thermal characterization of nanocomposites; 3D printing applications; carbon-based particles; nanotechnology; modeling, development and optimization of advanced materials
Special Issues, Collections and Topics in MDPI journals
Interests: transport phenomena modelling; numerical analysis of transport phenomena by means of finite element method; measuring of transport properties of materials for engineering applications; chemical reactors; polymers
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue focuses on the most recent breakthroughs in the multi-physical characterization of carbon-reinforced nanocomposites, aiming to bridge the gap between fundamental laboratory research and advanced engineering applications. The integration of carbonaceous fillers—such as carbon nanotubes, graphene, nanoplatelets, and carbon black—into polymer matrices has opened new frontiers for creating multifunctional materials. However, achieving full control over their macroscopic performance requires a deep understanding of the complex interplay between nanofiller dispersion, interfacial bonding, and network formation.
The primary objective of this collection is to explore the synergistic effects of thermal, mechanical, and electrical properties through a dual approach that emphasizes the cooperation between rigorous experimental investigation and advanced numerical modeling. We seek contributions that delve into how the internal morphology and chemical functionalization of carbon fillers influence the composite's overall behavior under diverse environmental and operational conditions. By combining empirical data with state-of-the-art computational simulations, such as finite element analysis, molecular dynamics, or micromechanical modeling, this Special Issue aims to foster the development of robust predictive tools essential for the design and optimization of high-performance materials.
The scope of the collection encompasses a wide range of critical phenomena, including electromagnetic interference shielding, electrical percolation thresholds, thermal stability, and enhanced heat dissipation strategies. Furthermore, we encourage studies regarding viscoelastic behavior, fracture mechanics, and the emerging field of smart materials, such as self-sensing components utilizing piezoresistive effects. Special attention will also be given to how advanced manufacturing processes influence nanofiller orientation and the long-term durability of the final components. As a renowned scientist and leading expert in this field, you are cordially invited to submit an original research paper, a short communication, or a comprehensive review to enrich this Special Issue and contribute to the advancement of next-generation multifunctional materials.
Dr. Giovanni Spinelli
Prof. Dr. Vittorio Romano
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- carbon-based nanocomposites
- multifunctional materials
- numerical modeling and simulation
- structure-property relationships
- electrical percolation and conductivity
- thermal stability and management
- mechanical characterization and fracture mechanics
- piezoresistive behavior and self-sensing
- interface and interphase engineering
- advanced manufacturing and processing
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