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Advances in Laser Processing of Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 September 2024) | Viewed by 1523

Special Issue Editor


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Guest Editor
The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
Interests: laser advanced manufacturing
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Special Issue Information

Dear Colleagues,

As a new set of material processing tools, Lasers have been attracting intense research interest in terms of their potential for additive, subtractive, and formative manufacturing systems. Researchers across various disciplines are achieving rapid progress in areas such as ultrafast or precise laser machining, advanced laser 3D printing methods, the physics underlying novel laser shock processing, emerging laser induction of 2D materials and the hybrids, new laser sources, cutting-edge laser annealing, and welding approaches and applications. Furthermore, artificial intelligence is becoming highly integrated with advanced manufacturing. This Special Issue aims, therefore, at connecting multidisciplinary academic scholars including physicists, chemists, optical/mechanical/materials engineers, and data scientists, as well as industry stakeholders and government officials, for the advancement and application of laser processing of materials. Modeling, experimental, numerical, and design works are all welcome submissions.

Prof. Dr. Yaowu Hu
Guest Editor

Manuscript Submission Information

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Keywords

  • laser processing
  • advanced manufacturing
  • additive
  • subtractive
  • deformation

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Published Papers (1 paper)

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Research

12 pages, 2518 KiB  
Article
In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization
by Yu Lei, Wentao Sun, Xiaolong Huang, Yan Wang, Jinling Gao, Xiaopei Li, Rulei Xiao and Biwei Deng
Materials 2024, 17(21), 5297; https://doi.org/10.3390/ma17215297 - 31 Oct 2024
Viewed by 1049
Abstract
Femtosecond laser two-photon polymerization (TPP) technology, known for its high precision and its ability to fabricate arbitrary 3D structures, has been widely applied in the production of various micro/nano optical devices, achieving significant advancements, particularly in the field of photonic wire bonding (PWB) [...] Read more.
Femtosecond laser two-photon polymerization (TPP) technology, known for its high precision and its ability to fabricate arbitrary 3D structures, has been widely applied in the production of various micro/nano optical devices, achieving significant advancements, particularly in the field of photonic wire bonding (PWB) for optical interconnects. Currently, research on optimizing both the optical loss and production reliability of polymeric photonic wires is still in its early stages. One of the key challenges is that inadequate metrology methods cannot meet the demand for multiphysical measurements in practical scenarios. This study utilizes novel in situ scanning electron microscopy (SEM) to monitor the working PWBs fabricated by TPP technology at the microscale. Optical and mechanical measurements are made simultaneously to evaluate the production qualities and to study the multiphysical coupling effects of PWBs. The results reveal that photonic wires with larger local curvature radii are more prone to plastic failure, while those with smaller local curvature radii recover elastically. Furthermore, larger cross-sectional dimensions contribute dominantly to the improved mechanical robustness. The optical-loss deterioration of the elastically deformed photonic wire is only temporary, and can be fully recovered when the load is removed. After further optimization based on the results of multiphysical metrology, the PWBs fabricated in this work achieve a minimum insertion loss of 0.6 dB. In this study, the multiphysical analysis of PWBs carried out by in situ SEM metrology offers a novel perspective for optimizing the design and performance of microscale polymeric waveguides, which could potentially promote the mass production reliability of TPP technology in the field of chip-level optical interconnection. Full article
(This article belongs to the Special Issue Advances in Laser Processing of Materials)
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