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Special Issue "High-Entropy Materials"

A special issue of Entropy (ISSN 1099-4300).

Deadline for manuscript submissions: 30 November 2019

Special Issue Editors

Guest Editor
Prof. Dr. Hyoung Seop Kim

Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea
Website | E-Mail
Interests: Mechanical behavior of metallic materials, Plasticity theory, Constitutive modelling, High-Entropy Alloy, Porous materials, Severe plastic deformation, Processing simulation
Guest Editor
Prof. Jien-Wei Yeh

Materials Science & Technology Building R505, National Tsing Hua University, Hsinchu 30013, Taiwan
Website | E-Mail
Interests: High-entropy materials, Functional coatings, Functional composites

Special Issue Information

Dear Colleagues,

“High-entropy alloys” has become an exciting and vibrant field of materials science and engineering since the concept was first proposed more than a decade ago. Symposia, conferences and workshops on topics of high-entropy alloys or high-entropy materials (HEMs) are being held, and a rapid increase in the number of journal publications and citations is evident. This design concept allows compositions beyond the scope of traditional materials, and offers unprecedented properties and opportunities for a wide range of structural and functional applications. The 2nd International Conference on High-Entropy Materials (ICHEM2) was thus held on Jeju island, South Korea, from 9‒12 December, 2018. It gathered research groups from around the world to present the latest development in HEMs. It also offered a platform for networking, collaboration, and information exchange in the community. To deliver the excellent research works presented at ICHEM2 to global audiences and to accelerate the development of HEMs, the SCI journal Entropy (MDPI) has planned to publish a Special Issue on “High-Entropy Materials” in 2019. The main aspects of these materials are covered, including synthesis, microstructures, properties, mechanisms, and applications of HEMs. The Special Issue will hence provide the latest research results and a state-of-the-art overview of technology in the exciting and rapidly evolving field of HEMs. This Special Issue welcomes all submissions from authors in the field of high-entropy materials.

Prof. Dr. Hyoung Seop Kim
Prof. Jien-Wei Yeh
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Entropy is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • High-entropy materials/alloys
  • Medium-entropy alloy
  • Alloy design
  • Microstructure
  • Properties
  • Modeling and simulation

Published Papers

This special issue is now open for submission.
Entropy EISSN 1099-4300 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
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