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Next-Generation Wide Band Gap Device Architectures for Power Electronics and Renewable Energy Applications

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F3: Power Electronics".

Deadline for manuscript submissions: 25 August 2026 | Viewed by 4912

Special Issue Editors


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Guest Editor
Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA), University of Grenoble Alpes, Leti, 38000 Grenoble, France
Interests: gallium nitride; transistors; diodes; new device architectures; power electronics; renewable energies
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA), University of Grenoble Alpes, Leti, 38000 Grenoble, France
Interests: epitaxy; gallium nitride; new device architectures; vertical devices; power electronics; renewable energies
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Commissariat à l’Énergie Atomique et aux Énergies Alternatives (CEA), University of Grenoble Alpes, Leti, 38000 Grenoble, France
Interests: gallium nitride; transistors; diodes; new device architectures; power electronics; spice model; GaN circuits and driver
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Wide band gap materials such as gallium nitride (GaN) and silicon carbide (SiC) are increasingly used to fabricate power electronics devices. They are well-suited for applications such as electric vehicles (EVs) and renewable energy systems like solar inverters.

For example, GaN devices with a lateral architecture (High Electron Mobility Transistors - HEMTs) are currently the most commercially widespread. However, vertical architecture has also been studied for many years, and this can give gains in performance in terms of Ron for a given device size and voltage, but also in terms of trap suppression and failure modes (Avalanche failure is not possible in HEMT devices). The piezoelectric properties of GaN can also be exploited to improve device performance in innovative ways.

In addition to GaN and SiC, Ga2O3, AlN, AlGaN, and Diamond have even larger band gaps. These materials still have significant challenges, but they could make the fabrication of “ultimate power convertors” possible.

The scope of this Special Issue is to cover research that explores novel power electronics device architectures composed of wide-bandgap semiconductors. In particular, this issue focuses on the use of these devices in renewable energy applications and electric vehicles, where highly efficient as well as compact electrical energy conversion is desired.

Dr. Julien Buckley
Dr. Matthew Charles
Dr. René Escoffier
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • gallium nitride
  • silicon carbide
  • transistors
  • diodes
  • power electronics
  • spice model
  • circuits and drivers

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Published Papers (3 papers)

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Research

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31 pages, 697 KB  
Article
Applications and Implications of Wide-Bandgap Technologies in Microgrids: A Review
by Daniel Burmester, Ramesh Rayudu and Alan Brent
Energies 2026, 19(5), 1126; https://doi.org/10.3390/en19051126 - 24 Feb 2026
Viewed by 633
Abstract
The next evolution in power electronics is being driven by wide-bandgap materials—particularly silicon carbide and gallium nitride power semiconductor devices—which increase efficiency and power density, thus ensuring their integration into high-performance systems. One system poised to receive benefits from this progression is microgrids. [...] Read more.
The next evolution in power electronics is being driven by wide-bandgap materials—particularly silicon carbide and gallium nitride power semiconductor devices—which increase efficiency and power density, thus ensuring their integration into high-performance systems. One system poised to receive benefits from this progression is microgrids. This paper reviews common microgrid architectures, components, voltage and power levels, and power electronics to establish where wide-bandgap materials, specifically silicon carbide and gallium nitride, may benefit current and future microgrids. Full article
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24 pages, 1282 KB  
Article
Comparative Dynamic Performance Evaluation of Si IGBTs and SiC MOSFETs
by Jamlick M. Kinyua and Mutsumi Aoki
Energies 2025, 18(24), 6540; https://doi.org/10.3390/en18246540 - 14 Dec 2025
Viewed by 2440
Abstract
Power semiconductor devices are fundamental components in modern electronic power conversion. In applications demanding high power density and efficiency, the choice between silicon (Si) IGBTs and Silicon Carbide (SiC) MOSFETs is critical. SiC MOSFETs, owing to their high critical electric field, superior thermal [...] Read more.
Power semiconductor devices are fundamental components in modern electronic power conversion. In applications demanding high power density and efficiency, the choice between silicon (Si) IGBTs and Silicon Carbide (SiC) MOSFETs is critical. SiC MOSFETs, owing to their high critical electric field, superior thermal conductivity, wide band gap, and low power loss, realize significant performance improvements and compact design. This work presents a comprehensive, simulation-driven comparative investigation under identical setups, evaluating both technologies across various parameters. The effects of temperature variations on gate-source threshold voltage drift, current slew rate, device stress, and energy dissipation during switching transitions are evaluated. Furthermore, the characteristic switching behavior when the DC-bus voltage, gate resistance, and load current are varied is investigated. This study addresses a current scarcity of systematic investigation by presenting a comprehensive comparative evaluation of switching losses and efficiency across varied operating conditions, providing validated conclusions for the design of advanced WBG converters. The results demonstrate that SiC exhibits lower losses and faster switching speeds than Si IGBTs, with minimal temperature-dependent loss variations, unlike Si devices, whose losses rise significantly with temperature. Si shows distinct tail currents during turn-off, absent in SiC devices. A conclusive comparative evaluation of switching energy losses under varied operating conditions demonstrates that SiC devices can effectively retrofit Si counterparts for fast, low-loss, high-efficiency applications. Full article
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Review

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47 pages, 3812 KB  
Review
GaN HEMTs for Electric Vehicle Power Electronics: Device Architectures, Reliability and Next-Generation Wide Bandgap Opportunities
by Husna Hamza, Julie Roslita Rusli and Anwar Jarndal
Energies 2026, 19(7), 1752; https://doi.org/10.3390/en19071752 - 3 Apr 2026
Viewed by 1139
Abstract
The accelerating adoption of electric vehicles (EVs) is driving the demand for next-generation wide-bandgap (WBG) power devices that can deliver high efficiency, high power density, and robust operation under stringent electrical and thermal stress. Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) have emerged as [...] Read more.
The accelerating adoption of electric vehicles (EVs) is driving the demand for next-generation wide-bandgap (WBG) power devices that can deliver high efficiency, high power density, and robust operation under stringent electrical and thermal stress. Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) have emerged as a leading WBG technology due to their high breakdown voltage, ultrafast switching capability, and low conduction and switching losses relative to silicon devices, enabling high-performance EV power converters such as on-board chargers, DC-DC converters, and traction inverters. This review provides a comprehensive device-level assessment of GaN HEMTs, emphasizing advanced device architectures, state-of-the-art discrete transistors, and their implications for high-frequency, high-efficiency power conversion. Critical performance and reliability challenges, including current collapse, self-heating, and gate degradation, are analyzed in the context of their physical mechanisms and operational behavior under realistic conditions such as elevated junction temperatures, high switching frequencies, and dynamic load profiles. Furthermore, emerging opportunities in ultra-wide-bandgap semiconductor technologies beyond GaN are discussed, providing insights to guide the design, optimization, and robust integration of WBG devices into next-generation EV power electronic systems. Full article
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