Thermal Management of Electronic Packaging

Dear Colleagues,

Recent developments in electronic devices and components have not only increased their operability but have also made them energy-intensive. They are also expected to sustain their performance under uninterrupted operating conditions. Compared to the past, electronic components have higher heat generation levels that make their thermal management more critical, in order to overcome potential failures and maintain safety concerns. Therefore, much effort has been invested in improving the thermal management performance of electronic packaging by scientists, researchers, and engineers. Some of these endeavours aim to increase the efficiency of traditional and existing solutions such as air-cooled systems, whilst some studies focus on more energy-intensive thermal management solutions like liquid-cooled systems. In addition, thermal energy storage (latent or sensible) has also been proposed as one of the new ways to control heat generation from electronic devices. Since the proposed solutions are expected to be as economically feasible as the existing systems, techno- and thermo-economic assessments of the proposed solutions also play crucial roles for sustainable thermal management processes of the electronic packaging.

In light of the foregoing facts, this Special Issue focuses on innovative solutions, novel contributions, critical reviews, case studies, or theoretical models of Thermal Management of Electronic Packaging studies from microchip-level to room-level (including data center cooling solutions). The invited topics include, but are not limited to, thermodynamic (energy and exergy) analysis; heat transfer enhancement; system design and optimization; thermo- and/or techno-economic assessments of the air-cooled and liquid-cooled solutions. Thermal energy store via sensible or latent heat mechanisms is also welcome in the Special Issue.

Prof. Dr.-Ing. habil. Ali Cemal Benim
Dr. Barış Burak KANBUR
Guest Editors

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